龙芯中科技术股份有限公司 董事会议事规则 龙芯中科技术股份有限公司 董事会议事规则 第二条 董事会下设董事会办公室，处理董事会日常事务。 董事会秘书兼任董事会办公室负责人，保管董事会印章。 第二章 董事 第三条 公司董事为自然人，有下列情形之一的，不得担任公司的董事： 第一条 为适应建立现代企业制度的要求、明确龙芯中科技术股份有限公司（以 下简称"公司"）董事会的职责权限，规范董事会内部机制及运作程序，充分发挥董 事会经营决策中心的作用，根据《中华人民共和国公司法》《中华人民共和国证券法》 等相关法律、法规及《龙芯中科技术股份有限公司章程》（以下简称"公司章程"） 的规定，特制定本规则。 （一） 无民事行为能力或者限制民事行为能力； （二） 因贪污、贿赂、侵占财产、挪用财产或者破坏社会经济秩序，被判处刑 罚，执行期满未逾5年，或因犯罪被剥夺政治权利，执行期满未逾5年； （三） 担任破产清算的公司、企业的董事或者厂长、经理并对该公司、企业的 破产负有个人责任的，自该公司、企业破产清算完结之日起未逾3年； （四） 担任因违法被吊销营业执照、责令关闭的公司、企业的法定代表人，并 负有个人责任的，自该公司、企业被吊销 ...

| 大 | | --- | | 71 | | 报 | | L | 关于本报告 本报告是龙芯中科技术股份有限公司发布的第 2 份 ESG 报告，本着客观、规范、透明和 全面的原则，详细披露公司 2023 年在积极承担社会责任和促进可持续发展等方面的具 体举措、重点实践、亮点案例和关键绩效，旨在回应利益相关方的期望，未来更好地履 行社会责任。 时间范围 本报告涵盖期间为 2023 年 1 月 1 日至 12 月 31 日。为增强本报告的对比性和前瞻性， 部分内容适当追溯以往年份或具有前瞻性描述。 报告范围 本报告以龙芯中科技术股份有限公司为主体，包括下属分、子公司。除特别说明外，本 报告范围与本公司年报范围保持一致。 编制依据 本报告遵循上海证券交易所《上海证券交易所科创板股票上市规则》《上海证券交易所 科创板上市公司自律监管指引第 1 号——规范运作》，并参照国务院国有资产监督管 理委员会《央企控股上市公司 ESG 专项报告编制研究》、全球可持续发展标准委员会 （GSSB）发布的《可持续发展报告标准（GRI Standards）》。 数据来源及可靠性保证 本报告引用的全部信息数据均来自龙芯中科内部文件或有关公开 ...

我们审核了后附的龙芯中科技术股份有限公司(以下简称"龙芯中科")《2023年度募集 资金存放与实际使用情况的专项报告》。 一、管理层的责任 龙芯中科管理层的责任是按照中国证监会《上市公司监管指引第2号 -- 上市公司募集资 金管理和使用的监管要求》、上海证券交易所颁布的《上海证券交易所科创板上市公司自律监 管指引第 1 号 -- 规范运作》及相关格式指引规定编制《2023 年度募集资金存放与实际使用情 况的专项报告》,并保证其内容的真实、准确、完整,不存在虚假记载、误导性陈述或重大遗 漏。 龙芯中科技术股份有限公司 募集资金存放与实际使用情况 鉴证报告 天职业字[2024]27678 号 目 募集资金存放与实际使用情况鉴证报告 - -1 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://acc.mof.gov.cn）"进行查验 募集资金存放与实际使用情况鉴证报告 天职业字[2024]27678 号 龙芯中科技术股份有限公司全体股东: 我们的责任是按照《中国注册会计师其他鉴证业务准则 3101 号 -- 历史财务信息审计或 审阅以外的鉴证业务》的规定执行鉴证业务。该准则要求我们计划和执行鉴 ...

中信证券股份有限公司 关于龙芯中科技术股份有限公司 2023 年度募集资金存放与使用情况的核查意见 一、募集资金基本情况 （一）实际募集资金金额、资金到账时间 根据中国证券监督管理委员会《关于同意龙芯中科技术股份有限公司首次公开发 行股票注册的批复》（证监许可〔2022〕646 号文），同意公司首次公开发行股票的注 册申请。公司首次向社会公开发行人民币普通股（A 股）股票 4,100.00 万股，每股面 值人民币 1 元，发行价格为人民币 60.06 元/股，募集资金总额为 246,246.00 万元， 各项发行费用总额为 4,252.11 万元，扣除各项发行费用后募集资金净额为 241,993.89 万元。 公司实际收到的募集资金金额 243,931.29 万元于 2022 年 6 月 21 日全部到账， 已经天职国际会计师事务所（特殊普通合伙）审验并出具了《验资报告》（天职业字 [2022]35349 号）。公司依照规定对募集资金进行了专户存储，并与保荐机构、募集资 金专户监管银行签订了募集资金三方监管协议。 （二）本年度使用金额及年末余额 截至 2023 年 12 月 31 日，本公司累计使用募集资金人 ...

事前认可意见 根据《上市公司独立董事管理办法》《上海证券交易所科创板股票上市规则》 等法律法规以及《公司章程》《独立董事工作规则》等有关规定，我们作为龙芯 中科技术股份有限公司（以下简称"公司"）的独立董事，基于独立客观的立场， 本着实事求是的原则，对拟提交公司第二届董事会第三次会议相关事项发表如下 事前认可意见： 龙芯中科技术股份有限公司 二、 关于预计 2024 年度日常关联交易的事前认可意见 独立董事关于第二届董事会第三次会议相关事项的 一、 关于续聘公司 2024 年度审计机构的事前认可意见 我们作为公司独立董事，就公司拟续聘会计师事务所的事项向公司经营管理 层了解具体情况，公司已通过公开选聘的方式来选择 2024 年度审计机构。我们 审核了拟续聘会计师事务所的相关资质等证明资料，认为天职国际会计师事务所 （特殊普通合伙）是具有证券相关业务资格的会计师事务所，具备对上市公司进 行年度审计的经验和能力，对公司的财务审计和内部控制审计客观、公正。公司 拟续聘会计师事务所的事项不存在损害公司及全体股东利益的情况。我们同意将 该事项提交公司董事会审议。 独立董事：吴晖、马贵翔、肖利民 2024 年 4 月 2 ...

龙芯中科技术股份有限公司 2023 年度审计委员会履职情况报告 根据《上市公司治理准则》《上海证券交易所科创板股票上市规则》《上海证 券交易所科创板上市公司自律监管指引第 1 号——规范运作》《公司章程》《董事 会审计委员会工作细则》的有关规定，龙芯中科技术股份有限公司（以下简称"公 司"）董事会审计委员会（以下简称"审计委员会"）2023 年度（以下简称"报告 期"）勤勉尽责，认真履行了审计监督职责。现就 2023 年度审计委员会履职情况 报告如下： 一、 审计委员会基本情况 公司第一届董事会审计委员会由 3 名成员组成，分别为吴晖、胡伟武、肖 利民，其中审计委员会主任委员由具有会计专业资格的独立董事吴晖担任，董 事长胡伟武、独立董事肖利民为审计委员会委员。 2023 年 11 月，公司完成了董事会换届选举工作。公司第二届审计委员会 由独立董事吴晖、肖利民、非独立董事谢莲坤组成，其中审计委员会主任委员 由具有会计专业资格的独立董事吴晖担任。报告期内，审计委员会全体成员具 备能够胜任审计委员会工作职责的专业知识和行业经验。 二、 审计委员会会议召开情况 报告期内，董事会审计委员会共召开 5 次会议，全体委员均 ...

证券代码：688047 证券简称：龙芯中科 公告编号：2024-015 龙芯中科技术股份有限公司 第二届监事会第二次会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、监事会会议召开情况 龙芯中科技术股份有限公司（以下简称"公司"）第二届监事会第二次会议 于 2024 年 4 月 25 日在公司会议室以现场方式召开，会议通知已于 2024 年 4 月 15 日以邮件形式送达公司全体监事。 本次会议由监事会主席杨梁先生主持，本次会议应出席监事 3 人，实际出席 监事 3 人。会议的召集和召开程序符合《公司法》和《公司章程》等相关规定， 会议形成的决议合法、有效。 二、监事会会议审议情况 (一)审议通过《关于<2023 年度监事会工作报告>的议案》 2023 年度，公司监事会按照《公司法》《公司章程》和《监事会议事规则》 等有关规定，勤勉、尽责地履行监事会职能，对公司的运作情况等进行监督和检 查，维护了公司和全体股东的利益。 表决结果：3 票同意，0 票反对，0 票弃权。 公司《2023 年年度报告》及摘要的编制 ...

根据《上市公司独立董事管理办法》《上海证券交易所科创板上市公司自律 监管指引第 1 号——规范运作》的相关规定，龙芯中科技术股份有限公司（以下 简称"公司"）董事会就公司在任独立董事吴晖先生、马贵翔先生和肖利民先生 的独立性情况进行了评估，并出具如下专项意见： 经核查公司在任独立董事吴晖先生、马贵翔先生和肖利民先生任职情况以及 签署的相关自查文件，上述人员未在公司担任除独立董事、董事会专门委员会成 员以外的任何职务，未在公司主要股东单位任职，与公司实际控制人之间不存在 利害关系，亦不存在可能对其独立客观判断产生影响的其他情况。董事会认为， 公司独立董事符合《上市公司独立董事管理办法》《上海证券交易所科创板上市 公司自律监管指引第 1 号——规范运作》等法律法规以及《公司章程》对独立董 事独立性的相关要求，有效地履行了独立董事的职责，为公司决策提供了公正、 独立的专业意见。 龙芯中科技术股份有限公司 龙芯中科技术股份有限公司董事会 2024 年 4 月 25 日 董事会关于独立董事独立性评估的专项意见 ...

Corporate Governance and Compliance - The company has no special arrangements for corporate governance[5] - The company has no non-operational fund occupation by controlling shareholders or other related parties[5] - The company has no violations of decision-making procedures for external guarantees[5] - The company has no instances where more than half of the directors cannot guarantee the authenticity, accuracy, and completeness of the annual report[5] - The company's annual report is guaranteed to be true, accurate, and complete by the company's responsible person, the person in charge of accounting work, and the accounting institution[3] - The company's board of directors, board of supervisors, and senior management guarantee the authenticity, accuracy, and completeness of the annual report[2] - The company has established a comprehensive internal control system, including the Articles of Association, Rules of Procedure for Shareholders' Meetings, and Rules of Procedure for the Board of Directors, ensuring compliance with laws and regulations and protecting the interests of shareholders[145] - The company's internal control system was audited by Tianzhi International Accounting Firm, which issued a standard unqualified opinion on the effectiveness of the internal controls for 2023[147] - The company has implemented a unified management system for subsidiaries, focusing on risk management and improving operational efficiency through training and system improvements[146] Financial Performance and Metrics - Revenue in 2023 decreased by 31.54% to RMB 5,056.94 million compared to the previous year[20] - Net profit attributable to shareholders in 2023 was RMB -329.44 million, a decrease of 736.57% year-on-year[20] - R&D investment accounted for 103.47% of revenue in 2023, an increase of 49.64 percentage points from the previous year[21] - Gross profit margin decreased by 11.03 percentage points in 2023 due to increased fixed costs per unit and pricing pressure[22] - Operating cash flow in 2023 was RMB -410.33 million, compared to RMB -769.05 million in 2022[20] - Total assets at the end of 2023 were RMB 4,112.09 million, a decrease of 5.87% from the beginning of the year[20] - Basic and diluted earnings per share in 2023 were RMB -0.82, a decrease of 685.71% year-on-year[21] - Weighted average return on equity in 2023 was -8.84%, a decrease of 10.80 percentage points from the previous year[21] - Revenue in Q4 2023 was RMB 1,113.87 million, with a net loss attributable to shareholders of RMB -122.54 million[24] - R&D expenses increased by 35.68% in 2023 due to market expansion and intellectual property litigation[22] - Non-current asset disposal gains and losses amounted to -2,676.91 million, -4,917.61 million, and -51,200.12 million respectively[26] - Government subsidies included in current profits were 61,399,674.46, 196,241,583.27, and 81,390,965.78 respectively[26] - Gains and losses from changes in fair value of financial assets and liabilities were 38,821,703.01, 19,485,602.94, and -5,963.81 respectively[26] - Other non-operating income and expenses were 26,121,322.15, -2,923,955.75, and -404,339.22 respectively[27] - Total non-recurring gains and losses were 112,420,305.44, 208,529,827.46, and 66,818,744.74 respectively[27] - VAT refunds amounted to 714,966.40 due to software product tax incentives[28] - Government grants with an amortization period of 3 years or more amounted to 17,005,580.33[28] - The fair value of trading financial assets decreased by 23,334.27 million, impacting current profits by -334.28 million[29] - The fair value of other equity instrument investments increased by 1,162.69 million[29] - Total fair value of financial assets decreased by 22,162.57 million[29] - Revenue in 2023 was 506 million yuan, a year-on-year decrease of 31.54%[31] - Gross profit margin decreased by 11.03 percentage points to 36.06% due to increased fixed costs and pricing pressure[31] - R&D investment in 2023 was 523 million yuan, a year-on-year increase of 31.59%[31] - The company reported a net loss attributable to the parent company's owners of RMB -329,439,799.58 for 2023[141] - The parent company's undistributed profit as of December 31, 2023, was RMB 137,199,113.02[141] - No cash dividends, stock dividends, or capital reserve to share capital conversion will be distributed for 2023 due to the net loss[141] R&D and Technological Advancements - Loongson Technology Corporation Limited is the company's full name, with Loongson Technology as its abbreviation[14] - The company is headquartered at No. 2 Building, Loongson Industrial Park, Zhongguancun Environmental Protection Technology Demonstration Park, Haidian District, Beijing[14] - Loongson Coherent Link (LCL) is a new-generation high-speed inter-chip interface technology primarily used in server CPUs for high-speed cache-coherent message transmission[13] - The company's LoongArch instruction system, launched in 2020, is a new reduced instruction set computing (RISC) architecture[10] - Loongson operates under the Fabless model, focusing on chip design, R&D, application, and sales while outsourcing manufacturing, packaging, and testing[10] - The company's key products include general-purpose processors (CPUs), bridge chips, and system-on-chip (SoC) solutions[10] - Loongson's ecosystem involves collaboration with various hardware and software enterprises, forming a complex industrial ecosystem[11] - The company's technology portfolio includes advanced process nodes, EDA tools, and IP cores for integrated circuit design[10] - Loongson's products support both 32-bit and 64-bit architectures, catering to a wide range of computing needs[11] - The company's website is https://www.loongson.cn/, and its investor relations email is ir@loongson.cn[14] - New products developed in 2023 include the 1D100 MCU for ultrasonic water meters, the 2P0500 printer SoC, and the 4-core desktop CPU 3A6000[32] - The company opened its LoongArch CPU core IP to partners to expand the ecosystem[32] - The company's chip design capability has improved significantly, with the ability to develop around 5 new chips annually compared to 1-2 before listing[31] - Loongson 2P0500 chip integrates LA364 and LA132 processor cores with 512KB shared L2 cache, supporting DDR3, GMAC, USB, and other interfaces, suitable for printer and scanner applications[34] - Loongson 3A6000 features a 64-bit quad-core processor with a frequency of 2.0-2.5GHz, supporting simultaneous multithreading and dual-channel DDR4-3200, targeting desktop and server applications[34] - Loongson 3C5000 is a 64-bit 16-core processor with a frequency of 2.0-2.2GHz, supporting quad-channel DDR4-3200 and up to 16-way interconnection, designed for server applications[34] - Loongson 3D5000 integrates two 3C5000 dies, forming a 32-core processor with a frequency of 2.0GHz, supporting eight-channel DDR4-3200 and up to four-way interconnection, targeting server applications[34] - Loongson 7A2000, the second-generation bridge chip, supports PCIE3.0, USB3.0, SATA3.0, and integrates a self-developed 3D GPU with a maximum of 16GB DDR4 VRAM, compatible with Loongson 3 series processors[34] - The company strengthened its PC and server motherboard ODM capabilities, forming a "three-in-one" capability with CPU and operating systems, optimizing solutions in server BMC, storage servers, and industrial terminals[35] - Loongson opened its CPU core IP licensing to partners, enabling them to develop SoC chips based on Loongson's architecture, with revenue from this segment classified under industrial control or information technology chip revenue starting in 2023[35] - The company operates in a Fabless model, focusing on chip design while outsourcing wafer manufacturing, packaging, and testing, with in-house testing labs to enhance quality control[36] - Loongson's 3A6000 processor performance reached the level of the 10th generation quad-core Core processors, demonstrating the company's ability to optimize performance through design on mature processes[39] - The company achieved breakthroughs in international open-source software ecosystem development, establishing the LoongArch architecture as a parallel system to X86 and ARM, with improved compatibility for Linux-based software[39] - The global integrated circuit manufacturing capacity is relatively oversupplied in 2023, with significant differences in capacity utilization across different process platforms. In mature wafer and packaging process platforms, capacity significantly exceeds demand, while advanced wafer and packaging process platforms remain tight[40] - The company successfully taped out the LA664 processor core in its new high-performance general-purpose processor 3A6000, achieving design targets for functionality, performance, and power consumption[43] - The company released the first version of the driver software for the LG100 series GPU cores, supporting GPU acceleration for mass-produced chips like 7A2000 and 2K2000[44] - The second-generation GPU core LG200 has completed pre-silicon verification and passed OpenGL and OpenCL compatibility tests, with the 2K3000 chip expected to tape out in the first half of 2024[44] - The company developed multiple IP cores, including PCIE4.0 controllers, LCL controllers, DDR4 memory controllers, and LPDDR4 memory controllers, to enhance chip competitiveness[45] - The company improved its physical design platform, adopting new EDA tools and methods to enhance high-performance, low-power, and low-cost physical design capabilities[46] - The company achieved comprehensive support for LoongArch architecture in Linux kernel versions, enabling the latest community kernel versions to be used for Loongson platform OS development[47] - The company released Loongson Unified System Architecture 4.1, optimizing hardware design specifications and achieving cross-vendor and cross-generation compatibility for its operating systems[48] - The company initiated the development of the next-generation LA664 and LA364 processor cores, focusing on improving execution efficiency and energy efficiency[43] - The company continues to explore the adaptation and application of domestic EDA tools, with some preliminary achievements already made[46] - The Loongson binary translation system has been continuously improved, achieving AOT to accelerate application startup time and enhance user experience. It also implemented library pass-through technology for frequently called library functions, improving translation efficiency and compatibility with X86 Linux and partially with X86 Windows platforms[49] - The Loongson printer driver engine technology achieved a breakthrough, supporting over 6,300 printer models from more than 50 brands, significantly addressing the lack of printer driver support in Linux desktop systems[49] - The Loongson 3A6000 quad-core CPU achieved a 60% improvement in single-thread performance and a 100% improvement in multi-core performance compared to the previous generation 3A5000, while effectively reducing costs[51] - The LoongArch architecture has become a top-tier instruction set architecture alongside X86 and ARM in the international open-source software community, with support from major open-source projects like Linux kernel, GCC, LLVM, and others[52] - The company has contributed over 1 million lines of source code to nearly 200 international open-source software projects, fostering the development of the LoongArch ecosystem[52] - The company holds 690 authorized patents, including 546 invention patents, 143 utility model patents, and 1 design patent, along with 175 software copyrights and 22 integrated circuit layout design rights[53] - The total R&D investment in 2023 reached 5,232.219 million yuan, a 31.59% increase from the previous year, with R&D expenses accounting for 103.47% of operating revenue[55] - The capital-to-expense ratio of R&D investment decreased by 2.45 percentage points to 18.86% in 2023[55] - The company successfully taped out the 3C6000 16-core CPU, which can be packaged into 32-core and 64-core products, and completed the productization of the 32-core 3D5000 chip[51] - The Loongson application compatibility framework allows applications to run directly on other Linux platforms after a single migration, with the company providing the necessary runtime environment[52] - Chip R&D Project A: 32-core product has been officially launched, with a cumulative investment of 19,993.90 million yuan, targeting high-performance multi-core processor chips for the server market[58] - Chip R&D Project B: Completed initial verification of multiple industrial control SoC chip products, with a cumulative investment of 3,880.25 million yuan, targeting SoC chip products for industrial control and terminal markets[58] - Chip R&D Project E: Completed tape-out and initial verification of a new generation of products, with a cumulative investment of 7,232.68 million yuan, targeting high-performance processor chips for desktop and server markets[58] - Chip R&D Project I: Completed structural design optimization and tape-out of a new 16-core product, with a cumulative investment of 1,990.87 million yuan, aiming to improve inter-chip connectivity and increase processor performance by over 50%[59] - Key Core Technology R&D Project A: Completed development, achieving design goals with a cumulative investment of 9,025.26 million yuan, focusing on higher performance processor core IP[59] - Key Core Technology R&D Project B: Completed first-generation technology optimization, with a cumulative investment of 8,549.07 million yuan, targeting graphics processing and general computing requirements[59] - Key Core Technology R&D Project C: Completed design of inter-chip connectivity and high-speed interfaces, with a cumulative investment of 5,644.71 million yuan, aiming to increase data transmission speed and expand protocol compatibility[60] - Key Core Technology R&D Project D: Completed development, achieving design goals with a cumulative investment of 3,409.17 million yuan, focusing on improving mid-to-high-end processor core performance[60] - Operating System Basic Software R&D: Achieved support for LoongArch architecture in major international open-source software communities, with a cumulative investment of 29,876.85 million yuan, targeting desktop, server, embedded, IoT, cloud computing, and big data fields[62] - Packaging and Testing Technology R&D: Established mid-test and final-test capabilities for general-purpose processors, with a cumulative investment of 2,937.64 million yuan, focusing on high-performance multi-core chip packaging[60] - The company's R&D investment in the 3rd series solutions reached 5,416.93 million yuan, with a total investment of 17,114.11 million yuan, leading to the development of multiple PC/server solutions, some of which have achieved mass production[19] - The 2nd series solutions R&D investment was 3,173.69 million yuan, totaling 6,745.21 million yuan, resulting in various products and solutions based on Loongson SoC chips, with some projects in verification/testing and others in mass production[20] - The 1st series solutions R&D investment was 774.29 million yuan, totaling 3,462.48 million yuan, focusing on MCU chip-based solutions for industries like smart locks and smart meters[21] - The company's R&D personnel increased to 636, accounting for 68.24% of the total workforce, with a total R&D salary of 31,244.01 million yuan and an average salary of 49.13 thousand yuan[67] - The company has developed a comprehensive ecosystem with thousands of partners and tens of thousands of developers, leveraging its proprietary LA instruction set architecture[70] Market and Sales Performance - Sales in the industrial control sector were significantly impacted by market stagnation in a specific field[31] - Server and terminal board revenue increased significantly, partially offsetting the decline in traditional electronic government procurement[31] - The company developed a white-label server and cloud terminal products to mitigate the impact of the stagnant electronic government market[31] - The company focused on optimizing sales channels and product pricing to enhance market competitiveness[31] - Revenue from industrial control chips decreased by 41.21% year-on-year to 16,202.78 million yuan, with a gross margin decline of 8.42 percentage points[86] - Revenue from information-based chips dropped by 51.23% year-on-year to 9,150.83 million yuan, with a gross margin decline of 16.10 percentage points[86] - Revenue from solutions decreased by 8.13% year-on-year to 25,109.06 million yuan, with a gross margin decline of 8.95 percentage points[86] - Production of processors and supporting chips decreased by 60.57% year-on-year to 1,302,088 units, while sales decreased by 25.03% to 777,967 units[87] - Material and outsourcing costs for integrated circuits decreased by 20.83% year-on-year to 24,712.03 million yuan, accounting for 76.56% of total costs[89] - Labor costs for integrated circuits decreased by 23.21% year-on-year to 319.00 million yuan, accounting for 0.99% of total costs[89] - Manufacturing expenses for integrated circuits remained relatively stable, decreasing by only 0.44% year-on-year to 7,245.07 million yuan[89] - Sales to the top five customers amounted to 18,843.31 million yuan, accounting for 37.26% of total annual sales[91] - The first and fifth largest customers were new additions to the top five customer list in the reporting period[92] - Procurement from the top five suppliers amounted to 38,160.11 million yuan, accounting for 75.46% of total annual procurement[93] - Total procurement from top 5 suppliers accounted for 75.46% of the annual procurement, with BQ11 being the largest supplier at 26.67%[94] - Sales expenses increased by 18.14% to 10,602.31 million yuan, while R&D expenses surged by 35.68% to 42,456.23 million yuan[96] - Net cash flow from operating activities improved to -41,032.74 million yuan from -76,904.62 million yuan in the previous year[97] - Monetary funds decreased by 28.43% to 49,836.81

2024年第一季度报告 证券代码：688047 证券简称：龙芯中科 龙芯中科技术股份有限公司 2024 年第一季度报告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示 公司董事会、监事会及董事、监事、高级管理人员保证季度报告内容的真实、准确、完整，不存 在虚假记载、误导性陈述或重大遗漏，并承担个别和连带的法律责任。 公司负责人、主管会计工作负责人及会计机构负责人（会计主管人员）保证季度报告中财务信息 的真实、准确、完整。 第一季度财务报表是否经审计 □是 √否 ...