Financial Performance - The company reported no cash dividends, stock bonuses, or capital reserve transfers for the 2024 profit distribution plan[7]. - The company has not achieved profitability since its listing[5]. - A standard unqualified audit report was issued by Tianjian Accounting Firm for the company[6]. - The company reported a significant increase in revenue, achieving a total of 1.2billion,representinga251.44 billion[15]. - New product launches included a next-generation semiconductor technology expected to enhance performance by 30%[16]. - The company is expanding its market presence in Southeast Asia, targeting a 10% market share by the end of the fiscal year[16]. - A strategic acquisition of a smaller tech firm was completed, expected to contribute an additional 200millioninannualrevenue[16].−Researchanddevelopmentexpensesincreasedby18150 million, to support innovation initiatives[16]. - The company plans to invest 500millioninnewmanufacturingfacilitiestoboostproductioncapacityby40627.6 billion in 2024, with a year-on-year growth of 19.1%[135]. - The storage market is expected to grow to $167.05 billion in 2024, representing an 81% increase and accounting for 26.6% of the total semiconductor market[135]. - The global AI smartphone shipments are projected to reach 230 million units in 2024, accounting for 18% of total smartphone shipments, with a year-on-year growth of 82.7% expected in 2025[137]. - The global AI glasses market is expected to see explosive growth in 2024, with shipments reaching 1.52 million units, a 533% increase, and projected to grow to 12.8 million units by 2025[158]. Technological Innovations - The company is developing advanced packaging technology for high-performance chips, targeting applications in AI, edge computing, and smart devices[187]. - The company has advanced packaging capabilities including 16-layer stacking and ultra-thin die production, reaching international standards[191]. - The company is innovating small-sized, low-power, high-performance storage chips, such as ultra-small eMMC, suitable for wearable devices[172]. - The company has received the "2021 China IC Design Achievement Award for Best Storage Device," highlighting its competitive edge in high-capacity, high-reliability storage solutions[172].