德邦科技拟收购泰吉诺89.42%股权 深化半导体封装材料领域布局

Core Viewpoint - Debon Technology plans to acquire 89.42% of Suzhou Taijino New Materials Technology Co., Ltd. for 258 million yuan to enhance its position in the semiconductor packaging materials sector [1] Company Overview - Debon Technology primarily engages in the research and industrialization of high-end electronic packaging materials, including integrated circuit packaging materials, smart terminal packaging materials, new energy application materials, and high-end equipment application materials [4] - The company reported a revenue of 784 million yuan for the first three quarters of the year, a year-on-year increase of 20.48%, while net profit decreased by 28.03% to 60 million yuan [5] - Debon Technology has several chip-level packaging materials in client production, with DAF film achieving mass production and other materials like CDAF film and AD glue in small batch deliveries [6] Market Insights - The global thermal management market is projected to grow at a compound annual growth rate (CAGR) of 8.5%, increasing from 17.3 billion USD in 2023 to 26.1 billion USD by 2028, indicating significant market potential [2] - The demand for thermal interface materials is driven by the rapid integration of AI, data centers, smart vehicles, and portable devices, with a focus on low thermal resistance and high reliability [7] Acquisition Details - The valuation of Taijino is 288 million yuan, representing an increase of 237 million yuan or 458.23% compared to the audited book value of the parent company's equity [3] - The acquisition is expected to enhance Debon Technology's technological innovation capabilities and core competitiveness, with performance commitments ensuring a cumulative net profit of no less than 42.33 million yuan from 2024 to 2026 [8][9] Strategic Implications - The acquisition is anticipated to expand Debon Technology's product range in electronic packaging materials, improve product solutions, and accelerate its business layout in high-performance and advanced packaging sectors [9] - The global semiconductor market is entering a strong recovery phase, providing new development opportunities for integrated circuit packaging materials [10]