DuPont(DD) Prnewswire·2025-03-06 02:00Core Insights - DuPont is showcasing advancements in circuit materials at Intelligent Asia Thailand 2025, focusing on solutions for fine-line technology, signal integrity, and thermal management [1] - The electronics industry is undergoing significant transformation due to artificial intelligence, which is accelerating innovation in printed circuit boards (PCBs) essential for intelligent devices [2] - DuPont's product portfolio includes state-of-the-art materials for flexible, rigid-flex, and rigid PCBs, addressing industry challenges such as fine pitch and advanced reliability requirements [3] Product Offerings - DuPont™ Copper Gleam™ PPR-II/III is a new electroplating solution designed for advanced multilayer boards and AI server applications, offering superior throwing power for through-hole plating [4] - DuPont™ Circuposit™ 6800W and Copper Gleam™ PS-100 are designed for enhanced reliability in multi-stack micro-via designs, providing a more efficient single process solution [5] - DuPont™ Riston® DI9500M & DI8600 and FD3000M dry film photoresist are ideal for applications in electrified automotive and AI server stations, improving overall yield for manufacturers [6] - DuPont™ Microfill™ EVF-III acid copper is a new via-filling technology for fine-line HDI applications, particularly effective for automotive applications [7] - DuPont™ Pyralux® AP flexible copper-clad laminate offers exceptional reliability and reduced transmission loss, fulfilling high-speed and high-frequency signal transmission requirements [8] Industry Trends - The automotive industry is transitioning towards electrification and automation, requiring advancements in multilayer boards and high-density interconnects [2] - The expansion of 5G infrastructure and server technologies is driving the need for technology advancements in the electronics sector [2]