DuPont(DD) Prnewswire·2025-03-11 13:44Core Insights - DuPont's Pyralux® ML Series of double-sided metal-clad laminates has won the 2025 NPI Award in the Laminates category, recognizing its innovation in the electronics assembly industry [1][4]. Product Overview - Launched in April 2024, Pyralux® ML laminates are designed for flexible and rigid-flex printed circuit boards (PCBs), focusing on optimal thermal management for high-reliability markets such as aerospace, defense, electric vehicles (EVs), and AI-related networking [2][3]. - The laminates utilize metal alloy technology, including copper-nickel (CuNi) and Kapton® all-polyimide dielectric technology, which enhances resistivity, reduces thermal conductivity, and provides necessary thermoelectric properties [3]. Evaluation Criteria - The NPI Award evaluations considered various factors such as creativity, innovation, compatibility with existing technology, cost-effectiveness, design, reliability, flexibility, performance, user-friendliness, and speed/throughput [3]. Company Recognition - The recognition of Pyralux® ML laminates highlights the product's role in optimizing thermal management, which is crucial for industries with high-performance and high-reliability requirements [4].