中芯国际申请半导体结构及其形成方法专利，提高器件集成度

Core Points - Semiconductor companies, including SMIC Beijing and SMIC Shanghai, have applied for a patent titled "Semiconductor Structure and Its Formation Method" with publication number CN 119833523 A, filed on October 2023 [1] - The patent describes a method for forming a semiconductor structure that enhances device integration by reducing height differences on the surface of wafers and minimizing the chip area in the horizontal direction [1] Company Overview - SMIC Beijing was established in 2002 and is primarily engaged in the manufacturing of computers, communications, and other electronic devices, with a registered capital of 100 million USD [2] - The company has made one external investment, participated in 51 bidding projects, and holds approximately 5000 patent records, along with 226 administrative licenses [2]