SMIC(688981) 搜狐财经·2025-04-19 10:32Group 1 - The State Intellectual Property Office of China has reported that Semiconductor Manufacturing International Corporation (SMIC) has applied for a patent titled "Layout Method of Functional Areas in Wafer Fab, Storage Medium, and Terminal," with publication number CN119849410A, and the application date is October 2023 [1] - The patent abstract describes a layout method for functional areas in a wafer fab, which includes obtaining production processes during wafer processing and the correlation between different functional areas based on these processes [1] - The layout design aims to enhance the rationality of the functional area arrangement by utilizing feasible and theoretically grounded correlations [1] Group 2 - SMIC Beijing was established in 2002, located in Beijing, with a registered capital of 100 million USD, and has participated in 51 bidding projects and holds 5000 patent records [2] - SMIC Beijing has 226 administrative licenses and has made investments in one company [2] - SMIC Shanghai was founded in 2000, located in Shanghai, with a registered capital of 244 million USD, and has participated in 117 bidding projects, holding 5000 patent records and 147 trademark records [2] - SMIC Shanghai has 443 administrative licenses and has invested in four companies [2] - SMIC Beijing has a registered capital of 500 million USD and has participated in 34 bidding projects, holding 8 patent records and 245 administrative licenses [2]