甬矽电子（宁波）股份有限公司2025年第一季度报告

Core Viewpoint - The company, Yongxi Electronics, reported significant growth in revenue and net profit for the year 2024, driven by increased market demand and the introduction of new product lines. The company has also decided not to distribute cash dividends for the year due to its strategic development plans and capital needs. Company Overview - Yongxi Electronics primarily engages in integrated circuit packaging and testing, providing solutions for integrated circuit design companies. Its packaging products include various advanced packaging types such as FC, SiP, Bumping, QFN/DFN, and MEMS [5][6][7]. - The company was established in November 2017 and has focused on advanced packaging in the semiconductor testing industry, achieving notable technological advantages in various advanced packaging forms [6][7]. Business Model - The company's main business model involves customized packaging solutions based on client requirements, where clients provide unprocessed wafers for packaging and testing [8]. - The production model emphasizes high-end packaging and testing products, utilizing advanced automated production equipment and a flexible production approach to enhance efficiency and yield [8][9]. - The sales model is primarily direct sales to chip design companies, with some products in the cryptocurrency sector sold through agency models to manage operational risks [10]. Industry Situation - The integrated circuit packaging and testing industry has evolved into a specialized sector within the semiconductor industry, with significant market share concentrated in the Asia-Pacific region [12][13]. - The global packaging market is projected to reach $89.9 billion in 2024, with advanced packaging accounting for 49$697 billion by 2025, driven by advancements in logic and memory sectors [21][22].