Core Insights - Cadence Design Systems, Inc. has expanded its collaboration with Taiwan Semiconductor Manufacturing Company (TSMC) to accelerate time to silicon for advanced-node and 3D-IC technologies [1][2] - The partnership focuses on leveraging certified design flows, silicon-proven IP, and ongoing technical collaboration to drive innovation across TSMC's advanced process technologies, including N2P, N3, and N5 nodes [1][2] Company Developments - Cadence is delivering AI-driven design solutions for applications such as chiplets, system-on-chips (SoCs), and advanced packaging, specifically for TSMC's N2P, N3, and N5 platforms [2] - The collaboration includes certified tools and flows for TSMC's N2P and A16 nodes, with future support planned for the A14 node [2] - Cadence is enhancing its support for TSMC's 3DFabric technology, which improves design and packaging possibilities [2] Technology Advancements - Cadence is advancing chip design with certified tools and optimized IP for TSMC's N2P and A16 processes, including pre-silicon-certified DDR5 12.8G IP for N2P [3] - The company is integrating large language models (LLMs) into digital design flows to enhance automation and efficiency for future process nodes [3] - In the 3D-IC space, Cadence offers a comprehensive chiplet design and packaging solution, expanding its IP portfolio for AI training applications [4] Product Innovations - Cadence's Integrity 3D-IC Platform has been enhanced for improved quality of results (QoR), featuring AI-powered planning and optimization for multi-chiplet systems [5] - The integration of Sigrity X technologies and Clarity 3D Solver with the Integrity 3D-IC Platform supports compliance automation for 3D-IC ecosystems [6] - Cadence launched the industry's first DDR5 12.8Gbps MRDIMM Gen2 memory IP system solution on the advanced TSMC N3 process node, addressing the growing demand for memory bandwidth driven by AI and high-performance computing [8] Market Performance - Cadence currently holds a Zacks Rank 3 (Hold), with shares increasing by 11.5% over the past six months, contrasting with an 8.4% decline in the Zacks Computer – Software industry [9]
Cadence and TSMC Strengthen Partnership to Enhance AI & 3D-IC Designs