Ansys Thermal and Multiphysics Solutions Certified for Intel 18A Process and 3D-IC Designs

Signoff certification includes power integrity, multi-die thermal reliability, and electromagnetic modeling for AI and HPC applications/ Key Highlights Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and Intel Foundry deliver a thermal and multiphysics signoff flow for Intel Foundry's Embedded Multi-Die Interconnect Bridge (EMIB) technology, including Ansys RedHa ...