GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation

Core Insights - GlobalFoundries (GF) has signed a Memorandum of Understanding (MOU) with the Agency for Science, Technology and Research (ASTAR) to enhance its advanced packaging capabilities in Singapore [1][3] - The collaboration aims to address the growing demand for advanced packaging in the semiconductor industry, driven by applications in artificial intelligence (AI) and data-intensive technologies [2][4] - ASTAR will provide GF with access to R&D facilities and technical support, while GF will supply critical equipment to A*STAR, facilitating mutual growth in advanced packaging technologies [3][5] Company Developments - The partnership will enable skills enhancement initiatives for GF employees, focusing on developing expertise in advanced packaging [4][6] - This collaboration aligns with GF's global advanced packaging roadmap and its commitment to producing energy-efficient chips essential for AI applications [4][6] - GF's strategic roadmap includes the establishment of an Advanced Packaging and Photonics Center in New York, complementing the efforts in Singapore [6] Industry Context - Advanced packaging is a key R&D priority for the semiconductor industry, essential for delivering compact, high-performance, and energy-efficient solutions [2] - Singapore is positioning itself as a critical node in the global semiconductor supply chain, emphasizing the importance of R&D collaboration between public research and industry [5][6] - The partnership reflects a broader trend of nurturing high technology talent and continuous upskilling in response to evolving industry needs [4][5]