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泰凌微: 关于2023年限制性股票激励计划首次授予部分第一个归属期归属结果暨股票上市公告
688591Telink Semiconductor(Shanghai) (688591) 证券之星·2025-05-20 10:31

Core Viewpoint - The announcement details the first vesting results of the 2023 restricted stock incentive plan for TaiLing Microelectronics, including the number of shares to be listed and the vesting conditions for the recipients [1][5]. Summary by Sections Stock Listing and Vesting Details - The stock listing type is for equity incentive shares, with a total of 743,536 shares to be listed on May 23, 2025 [1][6]. - The first vesting period of the restricted stock incentive plan has been completed, with 123 recipients eligible for the shares [6][8]. Decision-Making Process - The board of directors and independent directors approved the relevant proposals regarding the incentive plan, and the supervisory board verified the list of recipients [2][3]. - The company conducted a self-examination regarding insider trading prior to the public disclosure of the incentive plan [3][5]. Vesting Conditions and Recipients - The total number of shares vested is 74.3536 million, representing approximately 23.38% of the total granted shares [5][6]. - The recipients include key management personnel and core employees, with specific allocations detailed for each individual [6][8]. Stock Source and Financial Impact - The shares are sourced from the company's directed issuance of A-shares to the recipients [6][8]. - The total share capital of the company will increase from 240,000,000 to 240,743,536 shares following this vesting, with a minimal impact on the company's financial results [7][8]. Listing and Transfer Restrictions - The shares will be subject to transfer restrictions, including a limit on the number of shares that can be transferred within a specified period [6][7]. - The company will retain any profits from shares sold within six months of purchase or sale by directors and senior management [6][7].