中芯国际取得一种热处理装置专利，降低晶圆放置出现位置偏差的概率

Group 1 - The State Intellectual Property Office of China has granted a patent for a "thermal processing device" to both Beijing Semiconductor Manufacturing Co., Ltd. and Shanghai Semiconductor Manufacturing International Corporation, with the patent application date being July 2024 [1][2] - The patent includes a process chamber, a support ring for holding wafers, and a light source generator and receiver, which are symmetrically arranged around the center of the support ring [1] - Beijing Semiconductor Manufacturing Co., Ltd. was established in 2020 with a registered capital of 500 million USD and has participated in 34 bidding projects and holds 12 patents [1] Group 2 - Shanghai Semiconductor Manufacturing International Corporation was founded in 2000 with a registered capital of 244 million USD, has invested in 4 companies, participated in 127 bidding projects, and holds 5000 patents [2] - The company also has 149 trademark registrations and 443 administrative licenses [2]