IBM(IBM) Prnewswire·2024-06-04 02:00Group 1 - Rapidus Corporation and IBM announced a joint development partnership to establish mass production technologies for chiplet packages [1][2] - The collaboration builds on an existing agreement for the joint development of 2nm node technology and is part of a project by Japan's NEDO [1][2] - Engineers from both companies will collaborate at IBM's facilities in North America for R&D and manufacturing of semiconductor packaging [1] Group 2 - IBM has extensive R&D and manufacturing technologies for semiconductor packaging and experience in joint development partnerships with Japanese manufacturers [2] - Rapidus aims to leverage IBM's expertise to quickly establish cutting-edge chiplet packaging technology [2] - The partnership is expected to enhance Japan's role in the semiconductor packaging supply chain [2] Group 3 - IBM is recognized as a leading provider of global hybrid cloud and AI solutions, serving clients in over 175 countries [3] - Rapidus aims to develop and manufacture advanced logic semiconductors, focusing on shortening cycle times in semiconductor production [4]