高盛：中国半导体-Capcon私人技术考察 - 先进封装需求增长

We hosted Capcon (private) management on April 17 in Hong Kong during our Private Technology Tour (report link). Overall, management expects increasing demand of advanced packaging tools driven by AI and high power chips. Management sees their strength in providing tools with higher throughput, which can increase the efficiency and profitability of its clients. Management also highlighted their early development in FOPLP equipment, for which they have obtained an international leading IDM as its customer. 1 ...