Core Viewpoint - The article emphasizes the importance of international exposure for companies in the chip industry, particularly through participation in global exhibitions like the electronica in Munich, Germany, which is considered the largest chip-related exhibition in the world [2][3]. Group 1: Current Industry Challenges - The primary pain point for many companies in the chip distribution sector is intense competition and price pressure from domestic clients, leading to thin profit margins [2][3]. - Many industry players are questioning their efforts, realizing that the issue lies not in their hard work but in the strategic direction of their business [3]. Group 2: Benefits of International Exposure - Participating in international exhibitions allows companies to gain insights into global industry trends and establish valuable connections with potential partners and clients [5][6]. - The experience of attending such events can lead to significant business opportunities, as evidenced by past participants who successfully built foreign trade teams and capitalized on the chip shortage from 2020 to 2022 [6][7]. Group 3: Upcoming International Tours - The 2024 tour will feature two options: a basic group focused on affordability and convenience, and a high-end group offering premium experiences [9][14]. - The high-end group will include visits to prestigious institutions and companies in Germany and France, providing participants with deep insights into the semiconductor industry and fostering high-quality networking opportunities [14][15]. Group 4: Itinerary Highlights - The itinerary for the 2026 tour includes a deep dive into the electronica exhibition, networking events, and visits to key industry players and research institutions in both Germany and France [19][21]. - Participants will have the opportunity to engage in customized activities that facilitate meaningful exchanges and discussions about international trade and business strategies [10][20].

Core Insights - Soitec and CEA are collaborating to enhance automotive cybersecurity through advanced Fully Depleted Silicon-on-Insulator (FD-SOI) technology, addressing the increasing vulnerabilities in modern vehicles as they become more software-defined and connected [1][2]. Technology and Security - FD-SOI substrates provide intrinsic protection against fault injection attacks, which are recognized as a significant risk by automotive cybersecurity standards such as ISO/SAE 21434 [2]. - Fault injection attacks can disrupt a chip's normal operation, allowing hackers to bypass security checks and access protected data [3]. - Laser Fault Injection (LFI) is highlighted as a precise attack method that targets chip vulnerabilities at a sub-micron and sub-nanosecond scale, which can be exploited against vehicles [4]. Research Findings - Research conducted at CEA-Leti laboratories shows that FD-SOI technology requires up to 150 times more effort and higher laser power to induce faults compared to traditional 28-nanometer bulk silicon, thereby increasing the complexity and cost of potential attacks [5]. - The resilience of FD-SOI supports compliance with emerging automotive cybersecurity standards, including the need for a secure "reference chip" for vehicle software encryption codes [6]. Future Innovations - Future developments in substrate technology, such as buried optical barriers and integrated sensors, could further enhance the security capabilities of semiconductor wafers [6]. Company Profiles - Soitec, a leader in innovative semiconductor materials, reported sales of €0.9 billion in the fiscal year 2024-2025 and focuses on three main markets: Mobile Communications, Automotive and Industrial, and Edge and Cloud AI [10]. - CEA is a public research body that aids policymakers and provides scientific tools to address societal changes related to digital and energy transitions, healthcare, and security [9].

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