HHCK(688535)2024-11-26 07:35Group 1: Business Development - The company has completed customer assessments for high thermal conductivity and reliability products used in the automotive electronics sector, currently in the pre-mass production stage [3] - The company has successfully developed encapsulation materials for photovoltaic applications, iterating existing products based on customer needs [3] - The company is gradually expanding its market share in traditional packaging while actively entering advanced packaging sectors [4] Group 2: Product and Technology - The company’s high-end epoxy encapsulation materials are still dominated by foreign entities, with domestic alternatives requiring ongoing technological advancements and stable product quality [3] - The company’s granular epoxy encapsulation material (GMC) has passed customer validation and is currently in the sample delivery phase for HBM storage applications [4] - The company’s products are characterized by high technical barriers, involving multiple disciplines such as polymer materials and organic chemistry [5] Group 3: Product Differentiation - LMC (liquid encapsulation material) is a mature packaging material with advantages like low warpage and high reliability, while GMC (granular encapsulation material) offers simpler operation and lower costs [5] - The company is focusing on advanced packaging trends, including wafer-level packaging and system-level packaging, with products gradually passing customer evaluations [4] Group 4: Investor Relations - The investor relations activity included a meeting with representatives from Haitong Securities and Huazheng Securities, held online on November 25, 2024 [2] - The meeting was attended by the Chairman and General Manager, Han Jianglong, along with other key personnel [2]