HHCK(688535)2024-12-11 07:41Group 1: Company Positioning and Strategy - The company aims to become an excellent supplier of semiconductor packaging materials, focusing on the R&D and industrialization of advanced epoxy molding compounds [3] - The company is actively cooperating with domestic packaging manufacturers to increase R&D investment and seize opportunities for domestic substitution [3] - The company has been involved in the automotive electronics sector for several years, with multiple products already achieving mass sales [4] Group 2: Advanced Packaging Technologies - Advanced packaging includes complex processes and materials at the forefront of the industry, such as QFN, BGA, FC, SiP, and FOWLP/FOPLP [3] - The usage of epoxy molding compounds (EMC) is primarily related to packaging design and processes, with no direct correlation to the number of HBM stacking layers [3][4] - The company is developing products related to MCM packaging technology, which has diverse forms and applications [4] Group 3: Product Applications - The company's electronic adhesives can be used for PCB board-level assembly [4] - Regular products and sulfur-free EMC can be utilized in automotive chip packaging [4] - The company is currently in the R&D phase for new liquid encapsulation materials related to MR-MUF technology, which is not yet commercially available [5]