Ingenic(300223)2025-04-21 09:24Group 1: Market Outlook - The industry market is expected to gradually recover in 2025, with Q3 and Q4 likely showing better performance due to seasonal factors [2][3] - Storage chips are anticipated to reflect global market conditions, with improvements expected in Q1 2025 compared to the previous year [2][3] - The automotive sector is projected to show an upward trend, indicating 2025 could be a turning point for the industry [3] Group 2: Product Development - The 3D DRAM product is still in the R&D phase, with sample availability aimed for this year, while revenue contributions are uncertain [3][4] - High-performance SoC products are expected to exceed 2T by the end of the year, targeting applications in IPC and NVR markets [4] - The demand for 3D DRAM is increasing due to risks associated with HBM export restrictions, with potential applications in AI and high-performance computing [4][5] Group 3: Challenges and Strategic Planning - Tariffs are impacting both DRAM and analog product lines, potentially stabilizing prices for domestic chip manufacturers [5][6] - Key technical challenges for 3D stacking DRAM include stacking processes and thermal management [6] - The company plans to continue focusing on existing product lines while enhancing R&D in high-performance chips and 3D DRAM over the next three to five years [7]