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同飞股份(300990) - 同飞股份投资者关系管理信息

Group 1: Investor Relations Activities - The investor relations activity included a specific object survey and a telephone conference [1] - Participants included various investment firms and individual investors [1] - The meeting took place on October 25, 2024, at the company headquarters [1] Group 2: Product Development and Market Strategy - The company has launched plate liquid cooling and immersion liquid cooling products for data centers, with a focus on temperature control for CPU and GPU components [2] - Future plans include increasing R&D investment to enhance product technology and performance [2] - The company aims to develop personalized solutions through collaborative product development with clients [2] Group 3: Competitive Response and Service Improvement - Strategies to face market competition include strengthening core competitiveness and improving service quality [2] - The company will leverage supply chain management to enhance product cost-effectiveness and seek new profit growth points [2] - Exploration in industrial temperature control will continue to create brand advantages [2] Group 4: Semiconductor Product Offerings - The company offers a range of temperature control equipment for the semiconductor industry, including high-precision cooling units and heat exchangers [2] - Products are designed to meet stringent temperature control requirements in semiconductor manufacturing processes [2] Group 5: Capacity Utilization and Project Status - As of October 24, 2024, the energy storage thermal management system project has reached a usable state with stable overall capacity utilization [3] - The company will adjust resources based on industry trends and sales data to ensure effective production organization and customer delivery [3] - The company ensured accurate and timely information disclosure during investor communications [3]