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晶方科技股价近期活跃,AI封装技术受关注
Jing Ji Guan Cha Wang· 2026-02-12 02:31
经济观察网 晶方科技(603005)近7日股价表现活跃,2月9日单日涨幅达8.02%,收盘报31.50元,成交 额19.83亿元,主力资金净流入1.64亿元,占成交额8.25%。2月10日股价继续上涨2.10%至32.16元,但2 月11日小幅回调0.81%至31.90元。截至2月12日早盘,股价进一步升至32.25元,5日累计涨幅8.73%,表 现强于半导体板块(0.94%)和大盘。资金流向显示,2月9日游资净流出6937.56万元,散户净流出 9429.49万元,融资净偿还5670.82万元,反映短期博弈加剧。 近期市场关注点集中在AI技术对半导体封装需求的拉动。2月9日,公司董秘在互动平台回应投资者时 强调,晶方科技在晶圆级TSV先进封装技术领域具备显著领先优势,AI芯片、自动驾驶等场景的快速发 展为公司带来市场机遇。此外,行业层面,高盛2月8日报告指出全球存储芯片供应短缺可能加剧,尤其 DRAM领域2026年供需缺口达4.9%,或间接利好先进封装企业。但需注意,公司未直接涉及存储芯片 生产。 机构观点 机构对晶方科技中长期前景保持中性偏积极。截至2月12日,机构综合目标价为37.00元,较当前价有约 ...
晶方科技:公司不断优化TSV-Last等工艺能力
Zheng Quan Ri Bao· 2026-02-09 13:36
(文章来源:证券日报) 证券日报网讯 2月9日,晶方科技在互动平台回答投资者提问时表示,公司通过技术持续创新,不断优 化TSV-Last等工艺能力,并在射频滤波器(FBAR)等新应用领域实现规模量产。 ...
晶方科技:截至2025年9月30日,公司股东总数为147658户
Zheng Quan Ri Bao Wang· 2026-02-09 13:17
证券日报网讯2月9日,晶方科技(603005)在互动平台回答投资者提问时表示,截至2025年9月30日, 公司股东总数为147658户,公司将在定期报告中披露截至报告期末的股东户数。 ...
2026年中国高带宽内存(HBM)行业政策、产业链、出货量、收入规模、竞争格局及发展趋势:行业正处于快速发展阶段,价值量占比在进一步提升[图]
Chan Ye Xin Xi Wang· 2026-02-03 01:28
Core Insights - The global High Bandwidth Memory (HBM) market is experiencing rapid growth, with shipments expected to increase from 1.5 billion gigabytes (GB) in 2023 to 5.7 billion GB by 2026, and revenues projected to rise from $4.35 billion in 2023 to $50 billion in 2026 [6][7][8]. HBM Industry Definition and Advantages - HBM is a high-performance semiconductor memory based on 3D stacking technology, offering high bandwidth and energy efficiency, primarily used in high-performance computing and networking applications [1][4]. - HBM has four main advantages over traditional DRAM: high bandwidth, high capacity, low power consumption, and small size [2][3]. HBM Industry Development Status - HBM technology is becoming a standard for AI acceleration cards (GPUs, TPUs, etc.), with its value share continuing to increase [4][6]. - The demand for HBM is driven by the needs of AI and high-performance computing, with significant growth expected in the coming years [6][10]. HBM Industry Chain - The HBM industry chain includes upstream materials (electrolytes, precursors, IC substrates) and semiconductor equipment (lithography machines, etching machines), with midstream focusing on HBM production and downstream applications in AI, data centers, and high-performance computing [8][9]. HBM Industry Competitive Landscape - The global HBM market is dominated by foreign manufacturers, with SK Hynix holding a 53% market share, followed by Samsung at 38% and Micron at 9% [14][15]. - Domestic companies in China, such as Changxin Memory, Changdian Technology, and others, are making significant progress in the HBM supply chain, aiming to increase local production capabilities [15][16]. HBM Industry Development Trends - HBM is positioned as a critical hardware component for AI and high-performance computing, with its unique 3D stacked structure providing superior bandwidth compared to traditional memory solutions [16][17]. - The future memory landscape will be heterogeneous, with HBM focusing on training scenarios, while other memory types will cater to specific workloads, creating a diverse memory ecosystem for the AI era [17].
晶方科技股价跌5.02%,华夏基金旗下1只基金位居十大流通股东,持有354.5万股浮亏损失563.66万元
Xin Lang Cai Jing· 2026-02-02 06:58
华夏中证1000ETF(159845)基金经理为赵宗庭。 截至发稿,赵宗庭累计任职时间8年294天,现任基金资产总规模3569.66亿元,任职期间最佳基金回报 124.19%, 任职期间最差基金回报-32.63%。 声明:市场有风险,投资需谨慎。 本文基于第三方数据库自动发布,不代表新浪财经观点,任何在本 文出现的信息均只作为参考,不构成个人投资建议。如有出入请以实际公告为准。如有疑问,请联系 biz@staff.sina.com.cn。 2月2日,晶方科技跌5.02%,截至发稿,报30.08元/股,成交11.15亿元,换手率5.60%,总市值196.17亿 元。 资料显示,苏州晶方半导体科技股份有限公司位于江苏省苏州工业园区汀兰巷29号,成立日期2005年6 月10日,上市日期2014年2月10日,公司主营业务涉及传感器领域的封装测试业务。主营业务收入构成 为:芯片封装及测试72.32%,光学器件25.91%,设计收入1.67%,其他0.10%。 从晶方科技十大流通股东角度 数据显示,华夏基金旗下1只基金位居晶方科技十大流通股东。华夏中证1000ETF(159845)三季度减 持6000股,持有股数354. ...
2月十大金股推荐
Ping An Securities· 2026-02-01 10:36
证券研究报告 2月十大金股推荐 1 ※ 核心观点 我们认为当前仍处于市场流动性偏宽的环境中,叠加高频景气跟踪与上市公司业绩预告均显示基本面有结构性亮点, 因此继续看好权益市场延续震荡向上趋势。方向上,建议重点关注:一是内外需共振景气向上、成长预期较好的科技 制造板块(AI/半导体/存储/风电等);二是受益于产品涨价预期的周期板块(有色金属/化工等);三是业绩有望筑 底改善的行业(建材/免税等);四是部分绩优红利资产(保险等)。 资料来源:Wind,平安证券研究所 备注:本篇报告数据统计截至2026/1/29 平安证券研究所 2026年1月30日 请务必阅读正文后免责条款 2 证券代码 证券名称 申万一级行业 总市值 PE PB 推荐逻辑 (亿元人民币) (TTM) (MRQ) 300223.SZ 北京君正 电子 662 208.6 5.3 存储周期上行,L3智能驾驶催化汽车电子 603005.SH 晶方科技 电子 201 58.9 4.4 WLCSP先进封装领先企业,受益车规CIS需求扩张 688041.SH 海光信息 电子 6,073 256.6 27.7 国产算力领先企业,业绩持续增长可期 688615. ...
晶方科技:公司通过技术持续创新,不断优化TSV-Last等工艺能力
Zheng Quan Ri Bao Wang· 2026-01-27 13:12
Core Viewpoint - The company, Jingfang Technology, is focusing on continuous technological innovation and optimization of its TSV-Last process capabilities, achieving mass production in new application areas such as RF filters [1] Group 1 - The company is actively responding to investor inquiries on its interactive platform [1] - The company emphasizes its commitment to technological innovation [1] - The company has successfully scaled production in new application fields [1]
晶方科技(603005.SH):在晶圆级TSV先进封装技术领域,公司具备显著领先优势
Ge Long Hui· 2026-01-27 08:03
Core Viewpoint - The company, Jingfang Technology (603005.SH), focuses on advanced packaging technology services for integrated circuits and has a significant leading advantage in wafer-level TSV advanced packaging technology, with a notable trend of growth in business and profitability in recent years [1] Group 1 - The company specializes in advanced packaging technology services for integrated circuits [1] - The company has a significant leading advantage in wafer-level TSV advanced packaging technology [1] - The company is continuously innovating and expanding into new application and product markets [1] Group 2 - The company's business and profitability have shown a significant growth trend in recent years [1] - The company's production and operations are currently normal [1]
晶方科技预计2025年净利润为3.65亿元至3.85亿元
Ju Chao Zi Xun· 2026-01-24 02:16
Core Viewpoint - Jingfang Technology expects a significant increase in net profit for 2025, driven by growth in automotive intelligent technology and advancements in packaging business [1] Financial Performance - The company forecasts a net profit attributable to shareholders of 36.5 million to 38.5 million yuan for 2025, representing a year-on-year increase of 44.41% to 52.32% [1] - The expected net profit after deducting non-recurring gains and losses is projected to be around 31.5 million to 33.5 million yuan, with a year-on-year growth of 45.48% to 54.72% [1] Business Development - The application range of automotive CIS chips is rapidly growing, enhancing the company's packaging business scale and competitive advantage in this field [1] - The company is increasing its investment in advanced packaging technology innovation to meet new business and product technical requirements, achieving commercialization in new application areas such as MEMS and RF filters [1] - Continuous optimization of production processes and management models has effectively improved production efficiency and cost control capabilities [1]
晶方科技:2025年年度业绩预告
Zheng Quan Ri Bao· 2026-01-23 14:21
Group 1 - The core viewpoint of the article is that Jingfang Technology has announced its performance forecast for the year 2025, expecting a significant increase in net profit [2] - The company anticipates a net profit attributable to shareholders of between 365 million yuan and 385 million yuan for 2025, representing a year-on-year growth of 44.41% to 52.32% [2]