Group 1 - The semiconductor industry is experiencing a significant merger and acquisition (M&A) wave driven by capital and technology integration, with expansion being the core theme for 2025 [1] - In the first half of 2025, China's disclosed M&A transaction volume exceeded $170 billion, marking a 45% increase year-on-year, with high-tech, health, and industrial sectors being key areas for large-scale mergers [1] - Notable transactions include Haiguang Information's acquisition of 100% equity in Zhongke Shuguang for approximately 115.97 billion yuan [1] Group 2 - Major semiconductor companies are actively pursuing acquisitions to quickly obtain technology and strategically position themselves in the market, as evidenced by recent announcements from companies like Hidi Micro and SIRUI [2][6] - Hidi Micro's acquisition of Chengxin Micro for 310 million yuan aims to enhance its product offerings in power management and motor chips, indicating a trend of companies seeking to broaden their product categories and applications [2][6] - The recovery of the consumer electronics market is providing a favorable environment for post-merger business integration, with Hidi Micro projected to see a 38.56% increase in revenue in 2024 [6] Group 3 - The semiconductor industry is characterized by rapid technological iteration and long R&D cycles, making M&A a pragmatic choice for business expansion [5] - Successful M&A transactions often hinge on the synergy of technology, products, and customer resources rather than mere scale, as demonstrated by Nanchip Technology's acquisition of Zhuhai Shengsheng Microelectronics [8] - Nanchip's revenue grew by 17.6% year-on-year in the first half of 2025, supported by improved product structure post-acquisition [8] Group 4 - Not all M&A efforts yield positive results; high technical barriers and strong business interconnections in the semiconductor industry can complicate post-merger integration [10] - Kangda New Materials' attempts to diversify into the semiconductor sector through acquisitions have not improved profitability, with a significant drop in net profit from 0.48 billion yuan in 2022 to a loss of 246 million yuan in 2024 [11] - The company faced substantial goodwill impairment due to underperformance of acquired entities, highlighting the risks associated with M&A in this sector [11] Group 5 - Companies are increasingly cautious in their M&A strategies, as seen in Kangda New Materials' decision to terminate a planned acquisition of Beiyi Semiconductor due to unmet expectations [12] - The industry emphasizes the importance of assessing the compatibility of target technologies with existing business models and the ability to integrate post-acquisition [12][13] - Timely strategy adjustments and risk avoidance are crucial for sustained growth in the semiconductor industry [13]

希荻微首次公开发行股票募集资金总额为13.43亿元，扣除发行费用后，募集资金净额为12.21亿元。该 公司最终募集资金净额比原计划多6.40亿元。希荻微于2022年1月17日披露的招股说明书显示，该公司 拟募集资金5.82亿元，拟分别用于高性能消费电子和通信设备电源管理芯片研发与产业化项目、新一代 汽车及工业电源管理芯片研发项目、总部基地及前沿技术研发项目、补充流动资金。 希荻微首次公开发行股票的发行费用总额为1.22亿元，其中，承销费及保荐费1.02亿元。 希荻微的共同实际控制人为戴祖渝、TAO HAI（陶海）、唐娅。戴祖渝，女，1948年出生，中国国 籍，无境外永久居留权。唐娅，女，1972年出生，中国国籍，无境外永久居留权。TAO HAI（陶 海），男，1971年出生，美国国籍。 希荻微于2022年1月21日在上交所科创板上市，公开发行股票数量为4001万股，发行价格为33.57元/ 股，联席保荐机构（主承销商）为民生证券股份有限公司（现更名为国联民生证券股份有限公司）和中 国国际金融股份有限公司，保荐代表人为黄西洋、黄平、郭慧、陶木楠，副主承销商为华兴证券有限公 司。 希荻微上市首日盘中创下股价最高点 ...

Core Viewpoint - The acquisition of 100% equity in Chengxin Micro by Xidi Micro for a total consideration of 310 million yuan marks a significant step in the consolidation of the domestic analog chip industry, indicating a deepening integration phase within the sector [1] Group 1: Technical Synergy - Both Xidi Micro and Chengxin Micro operate under the Fabless model, with complementary business layouts; Xidi Micro focuses on consumer and automotive electronics chips, while Chengxin Micro specializes in power management chips and related fields [2] - Chengxin Micro achieved a revenue of 159 million yuan and a net profit of 18.52 million yuan in the first ten months of 2024, showcasing its strong market presence [2] - The integration aims to leverage Chengxin Micro's 15 years of expertise in power management to enhance Xidi Micro's solutions across various applications, while Chengxin Micro will benefit from Xidi Micro's global customer network [2] Group 2: Financial Logic - The valuation of Chengxin Micro's 100% equity is set at 311 million yuan, reflecting a 214.37% increase over its book net assets, indicating strong growth expectations [3] - The acquisition structure involves 55% shares and 45% cash, with a share price set at 11 yuan, raising up to 99.48 million yuan in supporting funds [3] - Post-transaction, Xidi Micro's total assets are expected to increase by 23.89%, and equity attributable to shareholders is projected to grow by 12.76%, with an anticipated revenue increase of 18.65% in the first half of 2025 [3] Group 3: Industry Perspective - The current wave of mergers and acquisitions in the semiconductor sector highlights a trend where technology-focused targets are prioritized, as seen in Xidi Micro's acquisition aligning with similar transactions in the industry [4] - The acquisition not only facilitates scale expansion but also aims to create competitive barriers through deeper technological integration and market restructuring [4] - If the anticipated synergies are realized, Xidi Micro could achieve a revaluation in the analog chip segment, injecting new growth momentum into the A-share semiconductor sector [4]

Group 1 - The company Xi Di Wei (SH 688173) announced that as of November 28, 2025, the share reduction plan by Mr. Fan Jun, the director and vice president, has been completed, with a total of 3 million shares sold, accounting for 0.73% of the company's total share capital [1] - For the year 2024, the company's revenue composition is as follows: integrated circuits account for 99.71%, while other businesses account for 0.29% [1] Group 2 - The current market capitalization of Xi Di Wei is 7.2 billion yuan [2]

Core Points - The company Xi Di Wei (688173.SH) announced the completion of a share reduction plan by Mr. Fan Jun, who reduced his holdings by 3 million shares, accounting for 0.73% of the company's total share capital as of November 28, 2025 [1] Summary by Category - **Share Reduction Details** - Mr. Fan Jun executed the share reduction through centralized bidding [1] - The total number of shares reduced was 3 million [1] - This reduction represents 0.73% of the company's current total share capital [1] - **Timeline** - The share reduction plan was completed on November 28, 2025 [1]

证券代码：688173 证券简称：希荻微 公告编号：2025-100 公司于 2025 年 11 月 28 日收到范俊先生出具的《关于所持希荻微电子集团 股份有限公司股份减持结果的告知函》，截至 2025 年 11 月 28 日，本次减持计划 已实施完毕，范俊先生通过集中竞价方式减持公司股份 3,000,000 股，占公司当 前总股本的 0.73%。此外，因公司 2024 年股票期权激励计划实施自主行权和 2021 年股票期权激励计划实施行权登记，2025 年 8 月 10 日至 2025 年 11 月 27 日期 间，公司总股本由 410,383,848 股变更为 412,093,948 股，范俊先生所持有的公司 股份被动稀释比例为 0.01%。 1 希荻微电子集团股份有限公司 董事兼高级管理人员减持股份结果公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律 责任。 重要内容提示： 董高持有的基本情况 本次减持计划实施前，希荻微电子集团股份有限公司（以下简称"公司"） 董事、副总经理、核心技术人员范俊先生持有公司股 ...

本次交易尚需满足多项交易条件后方可实施，包括但不限于上交所审核通过、中国 证监会同意注册等。本次交易能否取得上述批准和注册，以及取得批准和注册的时间存 在不确定性。 证券代码：688173 证券简称：希荻微 公告编号：2025-098 希荻微电子集团股份有限公司 关于收到上海证券交易所恢复审核发行股份 及支付现金购买资产并募集配套资金 通知的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 希荻微电子集团股份有限公司（以下简称"公司"）拟通过发行股份及支付现金方 式购买深圳市诚芯微科技股份有限公司 100%股份并募集配套资金（以下简称"本次交 易"）。 公司于 2025 年 9 月 30 日收到上海证券交易所（以下简称"上交所"）的通知，因 本次交易申请文件中记载的财务资料已过有效期，需要补充提交，按照《上海证券交易 所上市公司重大资产重组审核规则》的相关规定，上交所对本次交易中止审核。具体内 容详见公司于 2025 年 10 月 1 日在上海证券交易所网站（www.sse.com.cn）披露的《希 荻微电子集团股份有 ...

希荻微电子集团股份有限公司 关于 上海证券交易所 《关于希荻微电子集团股份有限公司发行股份及支付现 金购买资产并募集配套资金申请的审核问询函》之回复 （修订稿） 独立财务顾问 二〇二五年十一月 上海证券交易所： 希荻微电子集团股份有限公司（以下简称"公司"、"上市公司"或"希荻微"） 于 2025 年 5 月 13 日收到贵所下发的《关于希荻微电子集团股份有限公司发行股份及支 付现金购买资产并募集配套资金申请的审核问询函》（上证科审（并购重组）〔2025〕 12 号）（以下简称"审核问询函"）。公司及相关中介就审核问询函所提问题经过了 认真分析讨论与核查，并按照要求在《希荻微电子集团股份有限公司发行股份及支付现 金购买资产并募集配套资金报告书（草案）（修订稿）》（以下简称"重组报告书"） 中进行了补充披露，现就相关回复说明如下。现提交贵所，请予审核。 除特别说明外，本审核问询函回复（以下简称"本回复"）所述的词语或简称与重 组报告书中"释义"所定义的词语或简称具有相同的含义。 在本回复中，若合计数与各分项数值相加之和在尾数上存在差异，均为四舍五入所 致。本回复字体代表如下含义： | 审核问询函所列问题 | 黑 ...

之专项核查意见 银信资产评估有限公司 2025 年 11 月 银信资产评估有限公司 关于上海证券交易所 上海证券交易所： 《关于希荻微电子集团股份有限公司发行股份及支付现金购买资 银信资产评估有限公司（以下简称"评估机构"或"银信评估"）接受希荻微电子 集团股份有限公司（以下简称"上市公司"、"公司"或"希荻微"）的委托，担任希 荻微本次发行股份及支付现金购买资产（以下简称"本次交易"）的资产评估机构。希 荻微于 2025 年 5 月 13 日收到贵所下发的《关于希荻微电子集团股份有限公司发行股份 及支付现金购买资产并募集配套资金申请的审核问询函》（上证科审（并购重组）〔2025〕 12 号）（以下简称"审核问询函"）。银信评估会同上市公司及其他中介机构就审核 问询函所提问题经过了认真分析讨论与核查，现就有关事项发表核查意见。现提交贵所， 请予审核。 产并募集配套资金申请的审核问询函》回复 问题 1（原问题 2）关于交易方案 重组报告书披露：（1）交易各方约定自 2026 年 2 月 15 日起 1 个月内完成标的资 产交割手续；（2）标的资产业绩承诺期为 2025 年至 2027 年，业绩补偿的计算基于 2 ...

北京国枫律师事务所 关于希荻微电子集团股份有限公司 国枫律证字[2025]AN039-22 号 发行股份及支付现金购买资产并募集配套资金的 补充法律意见书之四 北京国枫律师事务所 Grandway Law Offices 北京市东城区建国门内大街 26 号新闻大厦 7 层、8 层 邮编：100005 电话(Tel)：010-88004488/66090088 传真(Fax)：010-66090016 致：希荻微电子集团股份有限公司 根据本所与希荻微签署的《法律服务协议》，本所接受希荻微的委托，担任 本次重组的专项法律顾问。 针对本次重组，本所出具了《北京国枫律师事务所关于希荻微电子集团股份 有限公司发行股份及支付现金购买资产并募集配套资金的法律意见书》《北京国 枫律师事务所关于希荻微电子集团股份有限公司发行股份及支付现金购买资产 并募集配套资金的补充法律意见书之一》《北京国枫律师事务所关于希荻微电子 集团股份有限公司发行股份及支付现金购买资产并募集配套资金的补充法律意 见书之二》《北京国枫律师事务所关于希荻微电子集团股份有限公司发行股份及 支付现金购买资产并募集配套资金的补充法律意见书之三》（以下合称《法律意 ...