一、本次上市流通的限售股类型 根据中国证券监督管理委员会（以下简称"中国证监会"）于 2020 年 8 月 25 日出具的《关于同意芯海科技（深圳）股份有限公司首次公开发行股票注册 的批复》（证监许可〔2020〕1930 号），同意公司首次公开发行股票的注册申请。 芯海科技（深圳）股份有限公司首次向社会公开发行人民币普通股（A 股）股 票 25,000,000 股，并于 2020 年 9 月 28 日在上海证券交易所科创板上市，发行完 成后总股本为 100,000,000 股，其中有限售条件流通股 79,647,715 股，占公司发 行后总股本 79.65%，无限售条件流通股 20,352,285 股，占公司发行后总股本的 20.35%。 本次上市流通的限售股为公司首次公开发行限售股，限售期为自公司股票 上市之日起 36 个月，涉及股东数量为 3 名，对应股票数量 63,110,355 股，占公 司目前总股本数 142,381,063股的 44.33%。上述限售股的限售期即将届满，将于 2023 年 9 月 28 日起上市流通。 天风证券股份有限公司 关于芯海科技（深圳）股份有限公司 首次公开发行限售股上市流 ...

中证鹏元关于关注芯海科技（深圳）股份有限公司 2023 年 半年度业绩下滑的公告 中证鹏元资信评估股份有限公司 中证鹏元公告【2023】423 号 中证鹏元关注到，公司主要从事健康测量 AIOT 芯片、模拟信号 链芯片、MCU 芯片的研发、设计与销售。目前公司上游产业链回归 "缺货潮"前的产能水平，晶圆及封测采购价格逐步回落，公司 2023 年第二季度业绩相较于一季度业绩趋于好转，净利润亏损有所收窄。 公司在汽车电子、笔电及 BMS 领域的产品处于研发中、或客户导入 及量产阶段，未来可贡献一定规模的收入，但该等领域研发投入的效 益转化尚需一段时间，且芯片设计产品下游应用相关领域发展迅速， 新产品或新技术创新迭代较快，公司仍需保持一定规模的研发投入以 维持产品及技术的竞争力。 中证鹏元将持续关注集成电路行业发展、公司产品销售及汽车电 子、泛工业、BMS 及计算机等应用领域的拓展情况，并持续跟踪以 上事项对公司主体信用等级、评级展望以及"芯海转债"信用等级可 能产生的影响。 特此公告。 中证鹏元资信评估股份有限公司 二〇二三年九月十四日 中证鹏元资信评估股份有限公司（以下简称"中证鹏元"）对芯 海科技（深圳）股份 ...

天风证券股份有限公司 关于芯海科技（深圳）股份有限公司 2023 年半年度持续督导跟踪报告 根据《证券发行上市保荐业务管理办法》《上海证券交易所科创板股票上市 规则》和《上海证券交易所上市公司自律监管指引第 11 号——持续督导》等有 关法律、法规的规定，天风证券股份有限公司（以下简称"保荐机构"）作为芯 海科技（深圳）股份有限公司（以下简称"芯海科技"、"公司"或"发行人"） 的持续督导保荐机构，负责芯海科技的持续督导工作，并出具本持续督导跟踪 报告。 一、保荐机构和保荐代表人发现的问题及整改情况 无。 二、重大风险事项 （一） 核心竞争力风险 公司所处的集成电路行业为技术密集型企业。公司研发水平的高低直接影 响公司的竞争能 力。公司自上市以来，在业务快速增长的基础上不断增加研发 投入，新招聘大量优秀高端人才，在保障现有产品性能及功能优化的同时大力 增加新产品的研发，努力缩短新产品的研发成果转化周期。 1、市场竞争风险 公司的核心技术之一为高精度 ADC 技术，报告期内，公司含 ADC 技术产 品占主营业务收入比例较高。此外，公司模拟信号链芯片、健康测量与 AIOT 芯片对于研发投入要求较高，如果未来不能及 ...

2023 年半年度报告 1 / 182 2023 年半年度报告 重要提示 一、 本公司董事会、监事会及董事、监事、高级管理人员保证半年度报告内容的真实性、准确性、 完整性，不存在虚假记载、误导性陈述或重大遗漏，并承担个别和连带的法律责任。 二、 重大风险提示 公司已在本报告中详细描述了可能存在的相关风险，敬请查阅本报告"第三节 管理层讨论与分 析"中关于公司可能面临的各种风险及应对措施部分内容。 三、 公司全体董事出席董事会会议。 六、 董事会决议通过的本报告期利润分配预案或公积金转增股本预案 无 公司代码：688595 公司简称：芯海科技 芯海科技（深圳）股份有限公司 2023 年半年度报告 七、 是否存在公司治理特殊安排等重要事项 □适用 √不适用 八、 前瞻性陈述的风险声明 √适用 □不适用 本报告所涉及的公司未来计划、发展战略等前瞻性陈述，不构成公司对投资者的实质承诺，请投 资者注意投资风险。 九、 是否存在被控股股东及其他关联方非经营性占用资金情况 否 十、 是否存在违反规定决策程序对外提供担保的情况？ 否 十一、 是否存在半数以上董事无法保证公司所披露半年度报告的真实性、准确性和完整性 否 十二、 ...

| | | 芯海科技（深圳）股份有限公司 关于参加2023年半年度半导体行业专场 集体业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： http://roadshow.sseinfo.com/） 会议召开方式：上证路演中心视频录播结合网络文字互动 投资者可于 2023 年 09 月 01 日(星期五) 16:00 前通过邮件、电话、传真 等形式将需要了解和关注的问题提前提供给公司。公司将在文字互动环节对投资 者普遍关注的问题进行回答。 芯海科技（深圳）股份有限公司（以下简称"公司"）将于2023年08月31日 发布公司2023年半年度报告，为便于广大投资者更全面深入地了解公司2023年半 年度经营成果、财务状况、发展理念，公司将参与由上海证券交易所主办的2023 年半年度半导体行业专场集体业绩说明会，此次活动将采用视频录播结合网络文 字互动的方式举行，投资者可登录上海证券交易所上证路演中心（网址： http://roadshow.sseinfo.com/）参与线上互动交流。 一、说明会类型 ...

| | | 芯海科技（深圳）股份有限公司 关于召开2022年度暨2023年第一季度 业绩说明会的公告 芯海科技（深圳）股份有限公司（以下简称"公司"）已于2023年3月31日和 2023年4月29日分别发布公司2022年度报告及2023年第一季度报告，为便于广大 投资者更全面深入地了解公司2022年度及2023年第一季度经营成果、财务状况等 情况，公司计划于2023年05月15日（星期一）下午14:00-15:30举行2022年度暨2023 年第一季度业绩说明会，此次活动将采用视频录播和网络文字互动的方式举行， 投资者可登录上海证券交易所上证路演中心（网址：http://roadshow.sseinfo.com/） 参与线上互动交流。 会议召开时间：2023 年 05 月 15 日（星期一）下午 14:00-15:30 会议召开地点：上海证券交易所上证路演中心（网址： 一、说明会类型 二、说明召开的时间、地点 本次投资者说明会以视频录播结合网络文字互动形式召开，公司将针对 2022年度及2023年第一季度经营成果、财务状况等情况与投资者进行互动交流 和沟通，在信息披露允许的范围内就投资者普遍关注的问题进行回答 ...

2023 年第一季度报告 证券代码：688595 证券简称：芯海科技 芯海科技（深圳）股份有限公司 2023 年第一季度报告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示 公司董事会、监事会及董事、监事、高级管理人员保证季度报告内容的真实、准确、完整，不存 在虚假记载、误导性陈述或重大遗漏，并承担个别和连带的法律责任。 公司负责人、主管会计工作负责人及会计机构负责人（会计主管人员）保证季度报告中财务信息 的真实、准确、完整。 第一季度财务报表是否经审计 □是 √否 一、 主要财务数据 (一)主要会计数据和财务指标 单位：元 币种：人民币 | 项目 | 本报告期 | 本报告期比上年 | | --- | --- | --- | | | | 同期增减变动幅 | | | | 度(%) | | 营业收入 | 61,659,280.95 | -58.60 | | 归属于上市公司股东的净利润 | -48,954,819.46 | -4,944.49 | | 归属于上市公司股东的扣除非 经常性损益的净利润 | -57,81 ...

Share Repurchase and Dividends - The company repurchased 1,071,844 shares with a total amount of RMB 60,018,526.11 (excluding taxes and transaction fees) from May to July 2022[5] - The cash dividend ratio for 2022 was 2147.06% of the net profit attributable to ordinary shareholders in the consolidated financial statements[5] - The company decided not to distribute cash dividends, issue bonus shares, or convert capital reserves into share capital for 2022, with undistributed profits carried forward to future years[5] Company Information - Chipsea Technologies (Shenzhen) Corp., Ltd. is listed on the Shanghai Stock Exchange's STAR Market with the stock code 688595[21] - The company's registered and office address is located at 1st Building, 301, Shenzhen Bay Innovation Technology Center, Keji Avenue, Nanshan District, Shenzhen, with a postal code of 518000[17][18] - The company's legal representative is Lu Guojian[17] - The company's website is www.chipsea.com and the email contact is info@chipsea.com[18] - The company's annual report is disclosed on media platforms including "China Securities Journal," "Shanghai Securities News," "Securities Times," and "Securities Daily," and is also available on the Shanghai Stock Exchange website[20] - The company's annual report is prepared at the Board of Directors Office[20] Financial Performance - Revenue in 2022 was RMB 6,176.72 million, a decrease of 6.28% year-over-year[24] - Net profit attributable to shareholders was RMB 2.80 million, a significant decline of 97.08% compared to the previous year[24] - Net profit attributable to shareholders after deducting non-recurring gains and losses was RMB -40.14 million, a decrease of 138.89% year-over-year[24] - Operating cash flow was RMB -85.55 million, a decrease of 169.99% compared to 2021[24] - Total assets increased by 52.10% to RMB 1,700.73 million at the end of 2022[24] - Revenue for 2022 was RMB 617.67 million, a decrease of 6.28% year-over-year, primarily due to weak demand in 8-bit MCU and consumer electronics sectors[101] - Operating costs increased by 19.18% to RMB 375.61 million, driven by changes in product sales structure[101] - Gross margin decreased by 13 percentage points to 39.19% due to weak demand, increased market competition, and higher procurement costs[103] - Net cash flow from operating activities was negative RMB 85.55 million, a significant decline of 169.99% year-over-year, due to slower customer payments and increased inventory purchases[101] - Revenue from the health measurement segment decreased by 35.99% to RMB 146.60 million, with a corresponding 24.99% decrease in costs[104] - Revenue from the analog signal chain chip segment increased by 40.36% to RMB 171.01 million, driven by large-scale shipments of BMS chips to key customers[104] - MCU chip segment revenue decreased by 2.09% to RMB 288.99 million, with costs increasing by 37.22% due to a shift in product mix towards higher-cost 32-bit MCUs[104] - Domestic revenue accounted for RMB 597.78 million, a decrease of 4.47%, while international revenue decreased by 43.54% to RMB 15.02 million[105] - Production volume of health measurement products decreased by 50.10% to 12.22 million units, with sales volume dropping by 54.25%[106] - MCU chip sales volume reached 28,960.83 thousand units, a year-on-year decrease of 7.73%[107] - Overall production and sales rate of main products was 98.07%, with MCU chip production and sales rate at 107.40%, a year-on-year increase of 9.51%[107] - Total cost of raw materials for integrated circuits increased by 27.48% to 253,596,278.14 yuan[107] - Sales to the top five customers accounted for 39.84% of total annual sales, totaling 24,609.50 million yuan[108][110] - Procurement from the top five suppliers accounted for 76.11% of total annual procurement, totaling 40,677.14 million yuan[112][115] - Net cash flow from financing activities increased to 537,300,492.21 yuan, mainly due to the issuance of convertible bonds[119] - Disposal of Tongfu Microelectronics stock resulted in an investment income of 9.4 million yuan, and government subsidies contributed approximately 39 million yuan[120] - Cash and cash equivalents increased by 66.79% to 636,822,512.76 RMB, accounting for 37.44% of total assets, primarily due to funds raised from the issuance of convertible bonds[122] - Trading financial assets increased by 80.86% to 94,161,187.22 RMB, accounting for 5.54% of total assets, mainly due to increased financial management activities[122] - Accounts receivable increased by 88.43% to 255,474,574.94 RMB, accounting for 15.02% of total assets, driven by reduced customer repayments due to the economic downturn[122] - Inventory increased by 62.01% to 206,183,518.96 RMB, accounting for 12.12% of total assets, due to changes in product structure and increased stock of higher-cost items[122] - Other current assets increased by 58.43% to 52,036,228.86 RMB, accounting for 3.06% of total assets, mainly due to an increase in tax credits[122] - Other equity instrument investments increased by 55.56% to 28,000,000.00 RMB, accounting for 1.65% of total assets, due to increased equity investments[122] - Short-term borrowings amounted to 130,359,027.78 RMB, accounting for 7.66% of total assets, primarily due to new low-cost working capital loans[122] - Bonds payable amounted to 339,670,902.75 RMB, accounting for 19.97% of total assets, due to the issuance of convertible bonds[123] - Overseas assets totaled 31,482.57 RMB, accounting for 0.002% of total assets[125] - Investment in land for self-built office spaces amounted to 21,655,027 RMB, as part of the change in the implementation method of fundraising projects[130] - The company's total assets at the end of the period amounted to 122,919,713.22 yuan, with a decrease in fair value changes of -1,902,049.34 yuan during the period[133] - The company invested 114,000,000 yuan in bank wealth management products during the period, with an ending balance of 94,161,187.22 yuan[133] - The company's investment in the private equity fund "Hainan Huoyan Xihe Equity Investment Fund" amounted to 10,000,000 yuan, with a total investment of 123,390,121 yuan across 10 projects, accounting for 71.04% of the fund's total size[137] - The company's subsidiary, Hefei Xinhai Electronics Technology Co., Ltd., reported a net profit of 2,408.53 million yuan, with total assets of 29,827.21 million yuan and net assets of 25,109.92 million yuan[138] - The company's subsidiary, Xi'an Xinhai Microelectronics Technology Co., Ltd., reported a net loss of -1,952.92 million yuan, with total assets of 768.76 million yuan and net assets of -1,516.56 million yuan[138] - The company's subsidiary, Shenzhen Kangyou Health Technology Co., Ltd., reported a net profit of 59.06 million yuan, with total assets of 303.14 million yuan and net assets of 21.54 million yuan[138] - The company's subsidiary, Shenzhen Xinhai Chuangxin Technology Co., Ltd., reported a net loss of -145.93 million yuan, with total assets of 4,597.86 million yuan and net assets of -552.53 million yuan[138] - The company's subsidiary, Chengdu Xinhai Chuangxin Technology Co., Ltd., reported a net loss of -696.52 million yuan, with total assets of 5,665.66 million yuan and net assets of 4,261.21 million yuan[138] - The company's subsidiary, Shanghai Xinhai Technology Co., Ltd., reported a net loss of -2,104.37 million yuan, with total assets of 686.91 million yuan and net assets of -1,474.59 million yuan[138] R&D and Innovation - R&D investment accounted for 30.13% of revenue, an increase of 4.47 percentage points from 2021[25] - MCU chip sales in 2022 were RMB 2,889.96 million, a slight decrease of 2.09% year-over-year, with high-performance 32-bit MCUs accounting for 62% of MCU product sales[26] - Analog signal chain chip sales grew by 40.36% to RMB 1,710.05 million, with BMS shipments increasing by 808% year-over-year[26] - Health measurement AIOT chip sales declined by 35.99% to RMB 1,466.03 million, primarily due to weak consumer demand[27] - R&D investment in 2022 totaled 186.1307 million yuan, a year-on-year increase of 10.06%, accounting for 30.13% of revenue, up 4.47 percentage points[38] - The number of R&D technical personnel increased to 345, a year-on-year growth of 21.05%, accounting for 68.86% of total employees[38] - The proportion of R&D personnel with master's or doctoral degrees reached 62.03%, an increase of 9.4 percentage points[39] - In 2022, the company applied for 114 new invention patents and was granted 18, while applying for 37 new utility model patents and being granted 62[39] - Cumulative invention patent applications reached 600, with 175 granted, and utility model patent applications totaled 245, with 208 granted[39] - The company made significant breakthroughs in markets such as BMS, industrial measurement and control, smart meters, PCs, and automotive electronics[41] - The company's 32-bit MCU chip sales grew by 75.02% year-over-year, with sales accounting for over 60% of total MCU revenue[59] - The company's single-cell lithium battery management BMS chip achieved mass production, with shipments reaching tens of millions of units[57] - The company's high-reliability industrial-grade sensor conditioning chips began mass production, targeting industrial and automotive applications[58] - The company's PD series MCU products expanded into the energy storage and power tool markets, achieving mass production[59] - The company's health measurement AIoT solutions achieved a commercial-grade accuracy of 0.97, with over 1 million units shipped for blood oxygen measurement solutions[60] - The company's AIoT business, leveraging OpenHarmony, achieved over 10 million units shipped across 11 categories and 61 SKUs[61] - The company's automotive MCU business is progressing well, with multiple automotive-grade MCU chips entering testing and mass production phases, and ASIL-D compliant products expected in 2023[60] - The company's new generation of high-precision Sigma-Delta ADC and high-speed SAR ADC for automotive applications is under development, with products expected to launch in 2023[58] - High-precision ADC technology has achieved mass production, with significant cost advantages over international competitors like TI and ADI, helping downstream manufacturers quickly enhance product technical content[64] - The high-precision reference source technology has improved measurement accuracy through second-order temperature compensation and dynamic device matching, meeting market demands for high-precision measurement[64] - Human impedance measurement technology has reduced the cost of 4/8-electrode body fat scales and human composition analyzers by 1%, with impedance measurement accuracy reaching 1% and phase angle accuracy at ±0.5[64] - The multi-frequency algorithm for human body composition analysis has achieved a correlation coefficient of 0.97 with the DEXA gold standard, positioning it as a leader in the domestic market[65] - The high-reliability MCU technology has enhanced ESD performance to 8KV and EFT performance to 4KV, enabling widespread application in various fields and replacing foreign products[65] - The company's ADC technology has improved signal input range, reduced chip noise, and minimized power supply noise impact, making it suitable for various application scenarios[64] - The human impedance measurement chip supports multi-frequency and multi-electrode measurements, significantly improving accuracy and dynamic range for high-end applications like 8-electrode body composition analyzers[65] - The MCU technology has improved reliability through research on reset circuits, clock circuits, and storage circuits, achieving high performance in different application scenarios[65] - The company's ADC technology has forced a sharp decline in the prices of overseas products, promoting rapid development in related industries[64] - The human impedance measurement technology has expanded low-cost multi-parameter measurements, including heart rate, phase angle, weight, and balance, significantly enhancing the value of body fat scales[65] - High-precision ForceTouch technology for pressure touch control has been widely adopted by major smartphone manufacturers including vivo, Xiaomi, and Meizu, achieving mass production[66] - The company's Bluetooth application technology for smart health products has reduced development time for Bluetooth body fat scales to 7-15 days, accelerating industry adoption and upgrading[66] - The battery monitoring technology for lithium management features high precision and integration, addressing the market dominated by TI and overcoming trade restrictions[67] - The company's pressure sensor measurement technology achieves high-speed and low-power consumption, suitable for smart terminals like smartphones, TWS, and tablets[66] - The Bluetooth body fat scale software solutions have standardized functions such as communication handshake, data transmission, and online upgrades, improving product usability and stability[66] - The adaptive gain adjustment and high-precision fast-response incremental Σ-Δ ADC technology for battery monitoring is under patent application, targeting low power consumption and high accuracy[67] - The company's pressure sensor signal measurement architecture resolves the challenge of measuring weak signals with high speed and low power consumption, validated in real-world applications[66] - The Bluetooth technology has facilitated the transition of traditional weighing scales to smart body fat scales, driving industry-wide upgrades[66] - The company's battery monitoring chip integrates multiple high-performance modules, offering a competitive alternative to TI's monopoly in the high-performance battery monitoring market[67] - The pressure sensor technology based on the Wheatstone bridge structure achieves high-speed, low-power measurement, making it suitable for human-computer interaction in smart devices[66] - The company's R&D investment in 2022 increased by 10.06% year-on-year, reaching RMB 186.13 million, with R&D expenses accounting for 30.13% of total revenue, an increase of 4.47 percentage points compared to the previous year[75] - In 2022, the company applied for 114 new invention patents, 37 utility model patents, and 18 software copyrights, with a cumulative total of 600 invention patents, 245 utility model patents, and 191 software copyrights applied for[72][73] - The company's R&D personnel increased by 21.05% to 345 people by the end of 2022, with a 39.74% increase in total R&D personnel compensation[76] - The company's embedded controller for laptops achieved a maximum frequency of 60MHz, with DMIPS/MHz of 1.05 and Cormark/MHz of 2.24, surpassing competitors in low-power design[68] - The company's automotive-grade MCU technology achieved ISO 26262 ASIL-D functional safety level and AEC-Q100 Grade0/1 reliability, breaking the monopoly of foreign companies in the automotive chip market[69] - The company's R&D investment in 2022 included a 75.77% increase in depreciation and amortization due to the purchase of new EDA tools, software, and IP assets[76] - The company's R&D auxiliary materials and testing fees increased by 9.59% year-on-year in 2022[76] - The company's embedded controller for laptops supports multiple low-power modes, with VBAT mode power consumption below 6uA, exceeding the level of foreign competitors[68] - The company's automotive-grade MCU technology meets the ISO 26262 design standard and AEC-Q100 Grade1 testing standard, with some even requiring Grade0 standards[69] - The company's embedded controller for laptops integrates AES, RSA, HASH, TRNG hardware encryption modules, supporting secure boot and secure online upgrades[68] - The company's R&D personnel increased to 345, up 21.05% YoY, with master's and doctoral degree holders accounting for 62.03% of the total R&D staff, an increase of 9.4 percentage points[82] - The company has invested a total of RMB 29.633 billion in R&D projects, with a cumulative investment of RMB 18.613 billion in the current period[79] - The company's high-precision ADC technology has reached domestic leading and internationally advanced levels, with a 24-bit Sigma-Delta ADC being the first of its kind in China[85] - The company has launched the first global resistive micro-pressure strain technology-based pressure touch SoC chip, which is used in mobile phones and TWS earphones[85] - The company has developed a 32-bit MCU with built-in USB PD3.0 fast charging protocol, which has been adopted by leading domestic customers[85] - The company has introduced notebook motherboard controller chips with higher integration and better security compared to overseas competitors, and these have been adopted by leading customers[85] - The company has developed multiple automotive-grade MCU chips, which are now being introduced to clients[85] - The company has accumulated 600 patent applications, with 175 patents granted (including 2 US patents), and has won the "China IC" award six times[86] - The company has been recognized as a national-level "Little Giant" enterprise and a "Guangdong Province IoT Chip Development and Application Engineering Technology Research Center"[86] - R&D team accounts for 68.86% of the company's total workforce, emphasizing delivery capability and technical advancement[87] Strategic Focus and Market Expansion - The company strengthened its layout in the automotive electronics market, releasing multiple automotive-grade chips and establishing strategic partnerships with industry-leading customers[40] - The company has implemented organizational reforms in 2022, including LTC (Leads To Cash) and ITR (Issue to Resolved) areas, and introduced CRM and

证券代码：688595 证券简称：芯海科技 芯海科技（深圳）股份有限公司 投资者关系活动记录表 编号： | --- | --- | --- | --- | --- | |----------------|----------------------------------------------------------|--------------------------------------------------------------|-------------|------------------------------------------------------------------------| | | | | | | | 投资 | □特定对象调研 □分析师会议 | | | | | 者关 | □媒体采访 | □业绩说明会 | | | | 系活 动类 | □新闻发布会 □路演活动 | | | | | 别 | □现场参观 | ■电话会议 | | | | | □其他 | （请文字说明其他活动内容） | | | | 日 期 / 时间 | 2022 年 5 月 5 日-2022 | 年 5 月 30 ...

证券代码：688595 证券简称：芯海科技 芯海科技（深圳）股份有限公司 投资者关系活动记录表 编号： | --- | --- | --- | --- | --- | |----------------|------------------------------------------------------------------------------------------------------|-----------------------------------------------------------|------------------------------------------|-------------------------------------------------------------------------------------------| | | | | | | | 投资 | □特定对象调研 □分析师会议 | | | | | 者关 | □媒体采访 | □业绩说明会 | | | | 系活 动类 | □新闻发布会 □路演活动 | | | | | 别 | □现场参 ...