（编辑 姚尧） 证券日报网讯 12月30日，晶盛机电在互动平台回答投资者提问时表示，公司基于在高纯石英领域的技 术和工艺积累，积极拓展布局精密石英制品，如应用于半导体制造的石英舟、石英腔体等各类石英制 品；应用于光伏产业链的投料筒、匀流板、光伏舟托等，并顺利实现销售。 ...

Core Viewpoint - The company, Jing Sheng Mechanical & Electrical (300316), emphasizes its commitment to research and development in the photovoltaic equipment sector, providing comprehensive solutions across the silicon wafer, battery, and module segments [1] Group 1: Company Overview - The company offers a full line of photovoltaic solutions, covering silicon wafers, batteries, and modules [1] - The company is actively monitoring the development of new technologies and routes in the battery segment [1] Group 2: Research and Development Focus - The company places significant importance on the development of new products and technologies [1] - Investors are encouraged to follow the company's future public information for updates on technological advancements [1]

（文章来源：证券日报） 证券日报网讯 12月30日，晶盛机电在互动平台回答投资者提问时表示，在新能源光伏领域，公司布局 硅片、电池片及组件环节核心设备，是技术、规模双领先的光伏设备供应商。 ...

Core Viewpoint - The successful delivery of the world's first 12-inch single-wafer silicon carbide (SiC) epitaxy equipment by Jing Sheng Electromechanical marks a significant breakthrough in SiC epitaxy technology, enhancing production efficiency and reliability in the industry [1] Group 1: Company Developments - Jing Sheng Electromechanical delivered the first 12-inch single-wafer SiC epitaxy equipment to leading industry player Hantian Tiancheng on December 24, 2025 [1] - The new equipment features a unique vertical airflow intake design, improving precise temperature control and gas distribution during the epitaxy process [1] - The equipment includes automated loading/unloading modules and one-click automatic PM assistance, significantly enhancing particle control and maintenance efficiency [1] Group 2: Industry Impact - Hantian Tiancheng has launched the world's first 12-inch high-quality SiC epitaxy wafer, which improves production efficiency for downstream power devices and reduces unit manufacturing costs for SiC chips [1] - The introduction of 12-inch wafers allows for a significant increase in the number of chips per wafer, with 12-inch wafers accommodating 4.4 times the number of chips compared to 6-inch wafers and 2.3 times compared to 8-inch wafers under the same production process [1]

Summary of the Conference Call for Jing Sheng Mechanical & Electrical Co., Ltd. Industry and Company Overview - The conference call focused on Jing Sheng Mechanical & Electrical Co., Ltd., particularly its developments in the semiconductor and photovoltaic (PV) equipment sectors [2][4][9]. Key Points and Arguments Semiconductor Equipment Orders - Jing Sheng has semiconductor equipment orders amounting to approximately 3.7 billion yuan, primarily concentrated in the silicon wafer sector [2][4]. - The company has successfully transitioned from 8-inch to 12-inch silicon wafer equipment, resulting in a significant increase in order volume [2][4]. - The company is actively expanding into silicon carbide (SiC) epitaxy and wafer manufacturing, achieving breakthroughs in 12-inch wafer epitaxy equipment, with some customers already validating the technology [2][5]. Silicon Carbide Industry Dynamics - The SiC industry is experiencing positive changes after intense competition, with improved supply-demand relationships and increased technical barriers due to national regulations limiting new capacity expansion [2][6]. - New power applications, including AI, electricity demand, IDC storage, and overseas grid upgrades, are creating market opportunities that will further drive the SiC industry [2][6][11]. Photovoltaic Sector Developments - Jing Sheng has a comprehensive layout in the PV sector, covering long furnaces, cutting equipment, and automation for battery and module production [2][7]. - The company is innovating and iterating products to continuously increase market share, benefiting from the ongoing global energy transition that is driving demand in the PV industry [2][8]. Future Growth Projections - Starting in 2026, semiconductor equipment orders are expected to increase significantly, with the PV sector also poised for market share expansion [2][9]. - The company anticipates a rapid growth phase as its technologies mature and achieve mass production [9]. Silicon Carbide Applications - SiC devices are rapidly replacing IGBTs in new energy vehicles and charging stations due to their energy efficiency [10]. - The cost of SiC substrates and devices has decreased significantly, with the price difference between SiC and silicon-based devices narrowing to below 2 times, enhancing acceptance in the IDC sector [10]. Market Potential for Silicon Carbide - Demand for SiC in IDC and grid storage is expected to exceed that of the new energy vehicle market by 1-2 times in the coming years [11]. - Emerging applications in AR glasses and advanced semiconductor packaging present significant growth potential for SiC materials [11]. Current Status of Photovoltaic Business - Jing Sheng's PV business is currently in a bottoming phase, with industry overcapacity leading to reduced profitability and new order declines [13]. - However, the industry capital expenditure has stabilized, and the company expects its PV equipment performance to bottom out in 2026 [13][14]. New Growth Points - The company is focusing on TOPCon retrofitting equipment and silver reduction technologies, which are expected to be key capital expenditure areas in 2026 [14]. - The market share in PV materials has increased from 40% to over 50%, indicating a positive shift in the industry supply-demand landscape [14]. Other Important Insights - The SiC industry is consolidating, with smaller players struggling to compete, while established companies are solidifying their market positions [6]. - The transition to advanced packaging using SiC is driven by the increasing power requirements of GPUs, necessitating effective thermal management solutions [12].

Core Viewpoint - The delivery of a 12-inch single-wafer silicon carbide (SiC) epitaxy growth equipment to the SiC wafer manufacturer Hantian Tiancheng marks a significant advancement in the SiC industry, enhancing production capabilities for both 8-inch and 12-inch substrates [1] Group 1 - The 12-inch single-wafer SiC epitaxy equipment has been successfully delivered to Hantian Tiancheng, a producer of SiC epitaxial wafers [1] - The 12-inch substrates used in this process are supplied by Zhejiang Jingrui SuperSiC, indicating collaboration within the supply chain [1] - The newly developed equipment is compatible with both 8-inch and 12-inch SiC epitaxy production, showcasing its versatility [1]

（文章来源：证券日报） 证券日报网讯 12月17日，晶盛机电在互动平台回答投资者提问时表示，公司锗直拉炉在技术、规模及 市占率上均处于国际领先地位，产品已稳定供应国内主要衬底企业，具体业绩信息请关注公司披露的定 期报告。 ...

（文章来源：证券日报） 证券日报网讯 12月17日，晶盛机电在互动平台回答投资者提问时表示，二级市场股价波动受宏观经 济、行业周期、市场情绪等多重因素影响。公司始终坚持以技术创新和对客户需求深度挖掘的双轮驱动 模式实施研发创新，持续加强研发投入，以确保公司竞争力的可持续性。公司将继续稳健经营、坚持科 研创新，促进公司高质量、可持续发展，力争以更好的业绩回报广大投资者的信任与支持。 ...

浙江晶盛机电股份有限公司 一、被提名人已经通过浙江晶盛机电股份有限公司第五届董事会提名委员会资格 审查，提名人与被提名人不存在利害关系或者其他可能影响独立履职情形的密切关系。 √ 是 □ 否 如否，请详细说明： 二、被提名人不存在《中华人民共和国公司法》第一百七十八条等规定不得担任 公司董事的情形。 √ 是 □ 否 如否，请详细说明： 三、被提名人符合中国证监会《上市公司独立董事管理办法》和深圳证券交易所 业务规则规定的独立董事任职资格和条件。 √ 是 □ 否 独立董事提名人声明与承诺 提名人浙江晶盛机电股份有限公司第五届董事会现就提名王静为浙江晶盛机电 股份有限公司第六届董事会独立董事候选人发表公开声明。被提名人已书面同意作为 浙江晶盛机电股份有限公司第六届董事会独立董事候选人（参见该独立董事候选人声 明）。本次提名是在充分了解被提名人职业、学历、职称、详细的工作经历、全部兼 职、有无重大失信等不良记录等情况后作出的，本提名人认为被提名人符合相关法律、 行政法规、部门规章、规范性文件和深圳证券交易所业务规则对独立董事候选人任职 资格及独立性的要求，具体声明并承诺如下事项： 如否，请详细说明： 四、被提名人符 ...

浙江晶盛机电股份有限公司 独立董事候选人声明与承诺 声明人张红英作为浙江晶盛机电股份有限公司第六届董事会独立董事候选人，已 充分了解并同意由提名人浙江晶盛机电股份有限公司第五届董事会提名为浙江晶盛 机电股份有限公司（以下简称"该公司"）第六届董事会独立董事候选人。现公开声明 和保证，本人与该公司之间不存在任何影响本人独立性的关系，且符合相关法律、行 政法规、部门规章、规范性文件和深圳证券交易所业务规则对独立董事候选人任职资 格及独立性的要求，具体声明并承诺如下： 一、本人已经通过浙江晶盛机电股份有限公司第五届董事会提名委员会资格审查， 提名人与本人不存在利害关系或者其他可能影响独立履职情形的密切关系。 √ 是 □ 否 如否，请详细说明： 二、本人不存在《中华人民共和国公司法》第一百七十八条等规定不得担任公司董 事的情形。 √ 是 □ 否 五、本人已经参加培训并取得证券交易所认可的相关培训证明材料（如有）。 √ 是 □ 否 如否，请详细说明： 六、本人担任独立董事不会违反《中华人民共和国公务员法》的相关规定。 如否，请详细说明： 三、本人符合中国证监会《上市公司独立董事管理办法》和深圳证券交易所业务规 则规定的 ...