| 证券代码：688352 | 证券简称：颀中科技 | 公告编号：2026-012 | | --- | --- | --- | | 转债代码：118059 | 转债简称：颀中转债 | | 合肥颀中科技股份有限公司 关于全资子公司发生火灾事故的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 2026年1月24日清晨，合肥颀中科技股份有限公司（以下简称"公司"）全资 子公司颀中科技（苏州）有限公司（以下简称"苏州颀中"）厂区凸块制程段发生 火 灾 事 故 。 具 体 内 容 详 见 公 司 于 2026 年 1 月 26 日 在 上 海 证 券 交 易 所 网 站 （www.sse.com.cn）披露的《合肥颀中科技股份有限公司关于全资子公司发生火 灾事故的公告》（公告编号：2026-009）。通过公司进一步的梳理和评估，现将相 关进展情况公告如下： 一、相关资产受损情况及保险覆盖情况 截至本公告日，最终损失金额及可理赔金额暂未确定。公司将持续积极跟进 保险公司理赔进展，及时履行信息披露义务。 二、对公司生产进度的影 ...

Core Viewpoint - The company announced a fire incident at its subsidiary Suzhou Qizhong on January 24, which has impacted the production line for bump manufacturing. The recovery process is expected to take several months, with a planned resumption of production by July [1] Group 1: Incident Details - A fire occurred in the bump manufacturing process at the Suzhou Qizhong facility on January 24 [1] - The company is coordinating with equipment suppliers for repairs and prioritizing the cleaning and refurbishment of the cleanroom [1] - The fire safety inspection is expected to take approximately 2-3 months to complete [1] Group 2: Recovery Plan - After the completion of the fire safety inspection, the company will organize the installation and debugging of equipment, which is anticipated to take an additional 2 months [1] - The Suzhou Qizhong bump manufacturing line is projected to resume production by July [1] Group 3: Interim Measures - During the transition period before the resumption of production in Suzhou, the company plans to relocate some production equipment to Hefei to quickly enhance capacity [1] - The Hefei facility is expected to meet existing customer order demands by operating at full capacity in February [1] - Customers are actively cooperating to facilitate product validation for orders transferred to the Hefei facility, with most orders expected to be handled by the end of February [1]

Group 1 - The core point of the article is that Qizhong Technology announced on February 1 that it did not repurchase any shares in January 2026 [1]

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2025/6/19 | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | | 回购方案实施期限 | 2025 年 6 月 6 | 18 | 日~2026 | 年 | 月 | 17 | 日 | | 预计回购金额 | 7,500万元~15,000万元 | | | | | | | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 | | | | | | | | | □用于转换公司可转债 □为维护公司价值及股东权益 | | | | | | | | 累计已回购股数 | 8,714,483股 | | | | | | | | 累计已回购股数占总股本比例 | 0.73% | | | | | | | | 累计已回购金额 | 100,398,688.97元 | | | | | | | | 实际回购价格区间 | 11.10元/股~11.86元/股 | | | | | | ...

Core Viewpoint - The storage market is experiencing a significant price increase, with Samsung Electronics raising NAND flash contract prices by over 100% starting January 2026, driven by strong demand for AI-related hardware and supply-demand imbalances across the semiconductor industry [1] Group 1: Price Increases in the Semiconductor Industry - The price increase in storage chips is spreading to the foundry and packaging/testing sectors, with some foundries planning to raise prices by 5-20% due to rising demand for AI-related power ICs and reduced production from major manufacturers [3][4] - The demand for AI servers is driving a rapid price increase across the semiconductor supply chain, with foundries and packaging companies responding to the increased demand and rising raw material costs [3][4] Group 2: Expansion in Packaging and Testing - Companies in the packaging and testing sector are actively expanding capacity, with investments announced for new facilities in Malaysia and increased funding for advanced packaging companies in China [5] - The leading packaging company, ASE Technology, has raised its price increase forecast for 2026 due to strong AI semiconductor demand and capacity constraints [4] Group 3: Passive Component Price Surge - There is a significant price increase in passive components, with major manufacturers like Huaxin Technology and Yageo announcing price hikes of 10-20% due to rising costs of raw materials and increased demand from AI servers [6][8] - The demand for passive components, particularly MLCCs, has surged, with usage in AI server motherboards increasing by over 100% compared to traditional servers [9][10] Group 4: Raw Material Cost Pressures - The prices of key raw materials such as copper, silver, and gold have reached record highs, contributing to the rising costs of passive components [10] - The expectation of price increases leads to stockpiling by distributors, further exacerbating supply constraints and driving prices higher [11]

Core Viewpoint - The storage market is experiencing a price increase trend that is expected to continue into 2026, affecting not only storage chips but also the foundry and packaging sectors, as well as passive components [1][4]. Group 1: Price Increases in the Semiconductor Industry - Micron Technology and other manufacturers are raising prices due to supply chain pressures and increased costs, with price adjustments for products like MCU and Norflash ranging from 15% to 50% [2]. - Samsung Electronics has negotiated a price increase of over 100% for NAND flash contracts with major customers, effective from January 2026 [2]. - The demand for AI-related hardware is driving a supply-demand imbalance, leading to price hikes in both foundry and packaging sectors [2][4]. Group 2: Foundry and Packaging Sector Dynamics - Foundries are increasing prices by 5% to 20% due to rising raw material costs and strong demand for AI-related power ICs [5][6]. - The packaging sector is also seeing price increases, with companies like ASE Technology raising their forecasts for price hikes to 5% to 20% due to AI semiconductor demand and capacity constraints [6]. - Companies are expanding their production capabilities in response to the increased demand, such as Yongxi Electronics planning to invest in a new packaging and testing facility in Malaysia with a total investment of up to 2.1 billion yuan [7]. Group 3: Passive Component Price Trends - Passive components, including resistors and capacitors, are experiencing significant price increases, with major manufacturers like Huaxin Technology announcing price hikes effective February 1 [17][18]. - The price increases are attributed to rising costs of raw materials, including metals like silver and copper, which have seen substantial price increases [19][21]. - The demand for high-end capacitors in AI servers has surged, leading to a shift in production capacity and a reduction in supply for mid-range components, further driving up prices [20][22].

Group 1 - The storage sector in the US stock market showed strength, with Micron Technology rising by 5%, SanDisk by over 3%, Western Digital by nearly 3%, and Seagate Technology by over 2% as of January 27 [1] - The semiconductor industry is experiencing widespread price increases due to tight supply and rising costs, with companies like Zhongwei Semiconductor announcing price hikes of 15% to 50% for products like MCU and Norflash [2][3] - AI-related demand is driving the need for increased computing power, leading to a supply-demand imbalance in the semiconductor industry, prompting wafer foundries and packaging/testing companies to raise prices by 5% to 20% [3][4] Group 2 - Morgan Stanley has revised its price increase expectations for leading packaging company ASE, anticipating a 5% to 20% increase in wafer packaging prices due to strong AI semiconductor demand and capacity constraints [4] - Companies like Yongxi Electronics are expanding production capacity in response to rising demand and material costs, with plans to invest up to 2.1 billion yuan in a new integrated circuit packaging and testing facility in Malaysia [4] - Recent reports indicate a significant price increase in passive components, with major players like Huaxin Technology announcing price hikes for resistors effective February 1, driven by rising costs of raw materials and increased demand from AI servers [13][15] Group 3 - The demand for passive components, particularly MLCCs, has surged due to AI server requirements, with usage increasing by over 100% compared to traditional servers [14] - The prices of key metals used in passive components, such as copper and silver, have risen significantly, contributing to the overall increase in component prices [15] - Companies are facing challenges from rising labor, electricity, and raw material costs, leading to further price adjustments across the industry [15]

证券代码：688352 证券简称：颀中科技 公告编号：2026-010 转债代码：118059 转债简称：颀中转债 合肥颀中科技股份有限公司 部分高级管理人员减持股份结果公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏， 并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： ● 高级管理人员持股的基本情况 公司于近日收到周小青先生出具的《关于股份减持结果的告知函》，截至2026年1月23日，周小青先生 已通过集中竞价方式减持公司股份合计115,885股，占公司总股份的比例为0.01%。截至本公告披露日， 上述高级管理人员减持计划已实施完毕。 一、减持主体减持前基本情况 ■ 上述减持主体无一致行动人。 二、减持计划的实施结果 （一）高级管理人员因以下事项披露减持计划实施结果： 截至本公告披露之日，合肥颀中科技股份有限公司（以下简称"公司"）高 级管理人员周小青先生直接持有公司463,541股股份，占公司总股本的比例为0.04%。以上股份来源于公 司首次公开发行前取得的股份，且已于2024年11月15日解除限售并上市流通。 ● 减持计划的实施结果情况 ...

（记者 曾健辉） 每经头条（nbdtoutiao）——国际金价冲破5000美元！7年涨了280%，什么时候才见顶？专家：关键还 看美元，重点关注国际货币体系、降息和科技革命 每经AI快讯，颀中科技1月26日晚间发布公告称，公司于近日收到周小青先生出具的《关于股份减持结 果的告知函》，截至2026年1月23日，周小青先生已通过集中竞价方式减持公司股份合计约12万股，占 公司总股份的比例为0.01%。减持计划已实施完毕。 ...

| 证券代码：688352 | 证券简称：颀中科技 | 公告编号：2026-010 | | --- | --- | --- | | 转债代码：118059 | 转债简称：颀中转债 | | 合肥颀中科技股份有限公司 部分高级管理人员减持股份结果公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律 责任。 重要内容提示： 高级管理人员持股的基本情况 截至本公告披露之日，合肥颀中科技股份有限公司（以下简称"公司"）高 级管理人员周小青先生直接持有公司 463,541 股股份，占公司总股本的比例为 0.04%。以上股份来源于公司首次公开发行前取得的股份，且已于 2024 年 11 月 15 日解除限售并上市流通。 减持计划的实施结果情况 根据公司 2025 年 12 月 31 日披露的《合肥颀中科技股份有限公司部分高级 管理人员减持股份计划公告》（公告编号：2025-071），周小青先生因个人资金需 求，于本次减持计划公告披露日起 15 个交易日后的 3 个月内，在符合法律法规 的前提下，拟通过集中竞价、大宗交易的方式减持所持 ...