Investment Rating - The report maintains a positive investment rating for the semiconductor equipment industry, highlighting growth opportunities driven by AI applications and advanced logic and memory technology upgrades [5]. Core Insights - The global semiconductor equipment market is projected to reach a record $125.5 billion by 2025, driven by capacity expansion for AI applications and technology iterations across various segments [1][11]. - China is expected to lead global spending on 300mm equipment, with an investment of $94 billion from 2026 to 2028, supported by national policies [17]. - AI applications are significantly boosting demand for high-bandwidth memory (HBM) and NAND flash storage, with the overall revenue for AI semiconductors expected to grow from $8.2 billion to $41.3 billion from 2020 to 2030, at a CAGR of 24.4% [22][46]. Summary by Sections 1. Semiconductor Process Upgrades and AI-Driven Capital Expenditure - The semiconductor equipment market is expected to grow, with global spending on 300mm wafer fab equipment projected to exceed $100 billion for the first time in 2025, reaching $107 billion [10]. - AI applications are driving continuous growth in capital expenditure, with data center investments expected to rise from $17 billion in 2020 to $45.3 billion by 2028 [20]. - Advanced logic processes have progressed to the 2nm node, necessitating upgrades in equipment such as etching and deposition tools [26]. 2. AI Applications Driving Storage Demand Growth - The reduction in DDR4 production has led to a continuous increase in storage prices, with DDR4 prices expected to rise significantly due to supply constraints [35][36]. - High-end storage technologies are evolving, with 3D NAND layer counts expected to reach around 1000 layers, enhancing storage density [47]. - The demand for enterprise-grade SSDs is surging as AI models require efficient data storage solutions, with NAND storage demand projected to grow approximately 15% from 2024 to 2029 [46][56]. 3. Supply Chain Security and Self-Sufficiency - The report highlights the challenges in acquiring advanced semiconductor manufacturing equipment from overseas, with the U.S. proposing broader bans on sales to China [57]. - Domestic semiconductor manufacturers are expected to gain market share due to supply constraints faced by international competitors, with companies like Changxin Technology projected to increase production capacity significantly [59]. - The focus on self-sufficiency in semiconductor equipment is emphasized, with companies like North Huachuang expanding their product offerings in etching and deposition equipment [60].

Group 1 - The core point of the news is the recent performance of Jingce Electronic, which has seen a stock price increase of 5.08% to 75.27 CNY per share, with a total market capitalization of 21.056 billion CNY and a trading volume of 488 million CNY [1] - Jingce Electronic has experienced a cumulative increase of 3.72% over the past three days, indicating positive market sentiment [1] - The company's main business segments include display (48.56%), semiconductor (40.74%), and new energy testing systems (8.67%), with a minor contribution from other areas (2.03%) [1] Group 2 - The fund "Jingguan Taifu Advantage Mixed A" holds a significant position in Jingce Electronic, with 80,000 shares representing 2.25% of the fund's net value, making it the tenth largest holding [2] - The fund has generated a floating profit of approximately 291,200 CNY today, with a total floating profit of 205,600 CNY during the three-day stock price increase [2] - The fund has achieved a year-to-date return of 26.05%, ranking 3211 out of 8154 in its category, and a one-year return of 25.03%, ranking 2957 out of 8025 [2]

Core Insights - The company has achieved a significant breakthrough in the core light source field of semiconductor precision equipment with its self-developed excimer laser core module, which has received client recognition and is set for batch verification [1][3] - The excimer laser is a crucial component in semiconductor lithography and display inspection equipment, requiring high precision, energy stability, and longevity [3] - The company has received multiple repeat orders for its semiconductor core components and is currently in the machine integration verification phase, with expected applications in downstream wafer and panel factories [3] Company Strategy - The company has been increasing its investment in the research and development of high-end testing equipment and key core modules, covering three major business sectors: semiconductor testing, display testing, and new energy testing [3] - The continuous improvement of the layout from core components to complete systems is aimed at promoting the process of domestic substitution [3] - Successful client verification of the excimer laser core module is seen as a milestone for the company to expand its presence in the high-end semiconductor equipment market, potentially enhancing its competitive advantage in the domestic light source equipment sector [3]

Group 1 - The core performance indicators of the excimer laser core module have been recognized by clients, and it will soon be sent for batch verification at the client site [1] - The semiconductor core components have received multiple repeat orders and are currently undergoing integrated verification [1]

Core Insights - The company Jingce Electronics reported that as of October 10, 2025, the total number of shareholders is 19,986 [2] Company Summary - Jingce Electronics has engaged with investors through an interactive platform, providing updates on shareholder numbers [2] - The company is actively communicating with its investors, indicating a focus on transparency and shareholder engagement [2]

Core Viewpoint - The recent report by the All-China Federation of Industry and Commerce highlights the innovation status of the top 1,000 private enterprises in R&D investment, with notable performances from the instrumentation manufacturing industry [2][4]. R&D Investment Rankings - Three companies from the instrumentation manufacturing sector made it to the "Top 500 Private Enterprises in R&D Investment" list: - Weisheng Holdings Co., Ltd. (Rank 310, Hunan Province) - Wuhan Jingce Electronic Group Co., Ltd. (Rank 314, Hubei Province) - Holley Technology Group Co., Ltd. (Rank 329, Beijing) [2][3]. Patent Rankings - Six companies from the instrumentation manufacturing sector were recognized in the "Top 500 Private Enterprises in Invention Patents" list: - Weisheng Holdings Co., Ltd. (Rank 42, Hunan Province) - Wuhan Jingce Electronic Group Co., Ltd. (Rank 87, Hubei Province) - Juhua Technology (Hangzhou) Co., Ltd. (Rank 251, Zhejiang Province) - Holley Technology Group Co., Ltd. (Rank 257, Beijing) - Anhui Tiankang Group Co., Ltd. (Rank 423, Anhui Province) - Jinka Intelligent Group Co., Ltd. (Rank 494, Zhejiang Province) [3][5].

证券代码：300567 证券简称：精测电子 公告编号：2025-121 武汉精测电子集团股份有限公司 一、使用部分闲置募集资金进行现金管理到期赎回的情况 近日，公司使用部分闲置募集资金进行现金管理的理财产品已到期赎回，具 体情况如下： 关于使用部分闲置募集资金进行现金管理的进展公告 公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记 载、误导性陈述或重大遗漏。 武汉精测电子集团股份有限公司（以下简称"公司"或"精测电子"）于 2025 年 4 月 23 日分别召开了第五届董事会第二次会议、第五届监事会第二次会议， 审议通过了《关于公司及子公司使用部分闲置募集资金进行现金管理的议案》， 同意公司在确保不影响募集资金投资项目建设、募集资金使用和不改变募集资金 用途的情况下，使用额度不超过 4 亿元人民币暂时闲置募集资金进行现金管理， 购买安全性高、流动性好、低风险的理财产品。期限自公司董事会审议通过之日 起十二个月内有效，在决议有效期内，上述额度可循环使用。公司监事会、保荐 机构均发表了明确同意的意见。具体内容详见公司于 2025 年 4 月 25 日在巨潮资 讯网（http://www.cnin ...

证券代码：300567 证券简称：精测电子 公告编号：2025-120 武汉精测电子集团股份有限公司 关于为子公司向银行申请授信提供担保的进展公告 公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记 载、误导性陈述或重大遗漏。 一、担保情况概述 武汉精测电子集团股份有限公司（以下简称"公司"）分别于 2025 年 4 月 23 日、2025 年 5 月 19 日召开第五届董事会第二次会议、2024 年度股东大会， 审议通过《关于为子公司向银行申请授信额度提供担保的议案》，为保证公司及 下属各子公司的正常生产经营，拓宽资金渠道，公司或子公司拟对子公司 2025 年度向银行申请综合授信提供保证担保，担保总额不超过 37.8 亿元人民币；其 中，公司拟对子公司上海精积微半导体技术有限公司（以下简称"上海精积微"） 向银行申请授信提供最高担保额度人民币 1.3 亿元，授信品种：流动资金贷款、 银行承兑汇票、保函、国内信用证、票据贴现、票据池、商业保理以及其他方式 最终以各家银行实际审批的授信额度及授信期限为准。具体内容详见公司于2025 年 4 月 25 日在巨潮资讯网（http://www.cnin ...

证券代码：300567 证券简称：精测电子 公告编号：2025-122 武汉精测电子集团股份有限公司 关于放弃参股公司增资优先认缴出资权的进展公告 公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 法定代表人：杨道虹 成立日期：2021 年 8 月 25 日 注册地址：湖北省武汉市东湖新技术开发区流芳园横路 12 号汇成工业科创 园 2 号楼 11F（自贸区武汉片区）（一照多址） 注册资本：叁仟柒佰捌拾伍万柒仟壹佰柒拾壹圆人民币 一、交易概述 武汉精测电子集团股份有限公司（以下简称"公司"）于2025年9月29日召 开第五届董事会第五次会议，审议通过了《关于放弃参股公司增资优先认缴出 资权的议案》，公司参股公司湖北星辰技术有限公司（以下简称"湖北星辰"） 通过增资扩股的方式引入由关键管理人员、骨干员工等共同投资设立的员工持 股平台海南锐芯投资合伙企业（有限合伙）（以下简称"海南锐芯"）。湖北 星辰于2025年9月29日与新增投资者海南锐芯以及湖北星辰全体原股东签订了 《增资协议》。新增股东海南锐芯向湖北星辰增资人民币35,700万元，其中 849.8953万元计入 ...

| 证券代码：300567 | 证券简称：精测电子 | 公告编号：2025-119 | | --- | --- | --- | | 债券代码：123176 | 债券简称：精测转2 | | 武汉精测电子集团股份有限公司 2025年第三季度可转换公司债券转股情况的公告 公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记 载、误导性陈述或重大遗漏。 特别提示： 1、"精测转 2"（债券代码：123176）转股期为 2023 年 9 月 8 日至 2029 年 3 月 1 日，转股价格为 64.71 元/股； 2、截至 2025 年第三季度末，"精测转 2"剩余可转换公司债券为 12,754,038 张，剩余票面总金额为 1,275,403,800 元人民币。 根据《深圳证券交易所创业板股票上市规则》（以下简称"《创业板股票上 市规则》"）、《深圳证券交易所上市公司自律监管指引第 15 号——可转换公 司债券》的有关规定，武汉精测电子集团股份有限公司（以下简称"公司"、"精 测电子"）现将 2025 年第三季度可转换公司债券转股及公司股份变动情况公告 如下： 一、可转债发行上市基本情况 经中国证券监督 ...