Core Viewpoint - Apple Inc. has announced that its Q2 FY2026 performance will be constrained by the supply of advanced processors from TSMC, marking the first time the company has made such a statement in years [1] Group 1: Apple’s Performance and Supply Constraints - Apple CEO Tim Cook indicated that the company is facing supply bottlenecks in Q2, which is reflected in the revenue guidance provided by CFO Kevin Parker [1] - The bottleneck is attributed to limited capacity at advanced process nodes, exacerbated by a 23% growth in Q1 performance, which has reduced the ability to significantly increase production [1] - CFO Kevin Parker emphasized that the guidance for the next quarter is based on the company's best estimate of supply constraints, indicating a rapidly changing situation [1] Group 2: TSMC's 2nm Capacity Demand - TSMC's 2nm process is being aggressively adopted by chip manufacturers, with companies like NVIDIA, AMD, and ASIC designers competing for capacity [2] - The rise of AI has led to high-performance computing (HPC) customers occupying a significant share of TSMC's total revenue, with initial applications driven by mobile clients like Apple and Qualcomm [2] - The competition for high-end process technology is intensifying, as major players like AMD and NVIDIA plan to utilize TSMC's advanced processes for upcoming products [2] Group 3: DRAM Price Surge - DRAM contract prices are rising at an unprecedented rate, with reports indicating that prices have nearly doubled due to strong demand [4] - Micron has proposed a significant price increase of 115% to 125% compared to Q4 2025, reflecting the ongoing negotiations between memory suppliers and large-scale data center operators [4] - The memory market is currently characterized as a "seller's market," with buyers having little bargaining power, and DRAM prices are expected to rise by 90% to 95% in the current quarter [4][5]

如果您希望可以时常见面，欢迎标星收藏哦~ 美媒报导，博通和台积电正成为客制化人工智能芯片热潮的主要受益者，与英伟达在人工智能基础 设施市场的持续主导地位一起，从中获取价值。 247wallst报导指出，博通刚刚公布2026财年第一季业绩，营收达180.2亿美元，年增28%，其中人 工智能半导体营收飙升74%。该公司预计，在客制化人工智能加速器和乙太网路人工智能交换器的 推动下，2026财年第一季人工智能半导体营收将年增一倍，达到82亿美元。 博通最近一个季度的获利成长高达188%，毛利率稳定在68%左右，这使其在超大规模资料中心建 构专有芯片架构的过程中展现出卓越的定价能力。 台积电作为制造支柱的作用同样至关重要。这家晶圆代工巨头公布了2025财年第四季财报，营收 达337.3亿美元，年增20.5%，其中77%的晶圆收入来自先进的7纳米及以下制程。台积电3纳米制 程占晶圆营收的28%，5纳米制程占35%，反映出市场对尖端人工智能芯片制造的强劲需求。台积 电45%的利润率和54%的营业利益率也凸显了服务人工智能基础建设的获利能力。 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 在 2026 年 2 月 4 日举行的财务业绩发布会上，ROHM 总裁回答提问时表示："由于我们公司与 台积电共同创立的历史，我们已经从台积电购买了许可证，现在正朝着自主生产的方向发展。" ROHM计划在其滨松工厂（滨松市）启动一条8英寸生产线并开始生产。该公司还表示，如果需求 突然增加，将把部分生产外包给VIS。虽然投产时间将取决于项目启动的进展情况，但该公司正在 迅速采取行动，以尽可能减少影响，直到台积电撤出为止。 参考链接 https://eetimes.itmedia.co.jp/ee/articles/2602/04/news114.html （来源 ： 编译自eetjp ） 点这里加关注，锁定更多原创内容 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代表半导体芯闻对该 观点赞同或支持，如果有任何异议，欢迎联系我们。 推荐阅读 10万亿，投向半导体 芯片巨头，市值大跌 黄仁勋：HBM是个技术奇迹 Jim Keller：RISC-V一定会胜出 全球市值最高的10家芯片公司 喜欢我们的内容就点 "在看 " 分享给小伙伴哦~ 继台 ...

Group 1 - The domestically developed hybrid drone Rainbow YH-1000S successfully completed its maiden flight, showcasing advancements in logistics, emergency rescue, weather modification, and marine monitoring capabilities [2] - Apple plans to use TSMC's 2nm N2 process for its M6 chip, focusing on architecture upgrades and cost control rather than adopting the N2P process [2] - Samsung's upcoming Galaxy S27 Ultra will feature Polar ID facial recognition technology, utilizing polarized light for identification without requiring large cutouts on the screen [2] - Avita Technology announced the naming of its new model Avita 06T, which will be the first to feature Huawei's next-generation lidar for enhanced environmental perception [2]

Core Viewpoint - The ongoing AI boom may lead to Nvidia losing its current dominance as large data center operators shift towards custom chips (ASICs) to reduce costs [1] Group 1: Market Dynamics - Counterpoint's report indicates that Broadcom is expected to maintain its position as the top AI server computing ASIC design partner, with its market share projected to expand to 60% by 2027 [1] - TSMC, closely partnered with Broadcom, is anticipated to rapidly grow, capturing nearly 99% of the wafer manufacturing orders from the top ten global data centers and ASIC customers [1] Group 2: Competitive Landscape - The second phase of the AI chip boom is expected to see intense competition between ASICs and GPUs following Nvidia's dominance in the GPU market [1] - Broadcom and TSMC are positioned to emerge as the biggest winners in this evolving competitive landscape [1]

智通财经2月4日讯（编辑 马兰）随着人工智能热潮的继续推进，英伟达很可能失去如今的主导地位， 因为越来越多的大型数据中心运营商为降低成本，正在采购定制芯片（ASIC），这将让英伟达的通用 型芯片"跌落云端"。 ASIC与GPU 英伟达GPU的核心优势是大规模并行计算能力，适合处理矩阵乘法、卷积运算等人工智能任务。但随着 数据中心投入和能耗问题的不断加剧，各大数据中心所有公司正在思考更加高效简约，且符合自身需求 的解决方案。 如博通为谷歌设计的TPU，其核心是脉动阵列架构，专注于矩阵乘法等张量运算，其能效比是英伟达 H100的2到3倍，而推理成本则低30%至40%。高盛分析师James Schneider指出，TPU技术从v6发展到v7 还将帮助每个token的成本下降70%。 研究公司Counterpoint在一份报告中指出，博通预计将在2027年继续保持其作为顶级AI服务器计算ASIC 设计合作伙伴的领先地位，市场份额进一步扩大至60%。 与此同时，与博通合作紧密的台积电也将快速扩张。作为定制芯片的主要代工选择，该公司几乎完全吃 下全球前十大数据中心及ASIC客户的晶圆制造订单，市场份额接近99%。 Cou ...

在1月31日的饭局结束后，黄仁勋在饭店门口接受媒体采访表 示 ， 2026 年 将 是 行 业 " 极 度 吃 紧 " 的 一 年 ， 对 高 带 宽 内 存 （HBM）和先进封装的需求将大幅爆发。算力，在2026年或 许依然会是资本市场的"热词"。 作者：郑晨烨 封图：视觉中国 2026年1月31日晚，一张合影开始在社交平台流传。 照片的背景是中国台湾省台北市的砖窑古早味怀旧餐厅，画面中，英伟达CEO黄仁勋与台积电董 事长魏哲家、鸿海董事长刘扬伟等多位AI供应链高管面对镜头，集体竖起了大拇指。 在这张合影中，黄仁勋坐在第一排正中央，他的身边是台积电董事长魏哲家、联发科执行长蔡力 行、广达电脑董事长林百里，纬创资通董事长林宪铭。在黄仁勋身后的，还有鸿海精密董事长刘扬 伟 、 和 硕 联 合 科 技 董 事 长 童 子 贤 、 工 业 富 联 （ 601138.SH ） 董 事 长 郑 弘 孟 、 胜 宏 科 技 （300476.SZ）董事长陈涛。全球绝大多数的AI服务器，都要在这些人的工厂里完成组装。 当天晚上，黄仁勋在台北市宴请了40多位供应链高管，根据社交平台流传的菜单，这顿饭的菜色 包括豆酥鳕鱼、芋头米 ...

Summary of Conference Call on Global Semiconductors Industry Overview - The focus is on the semiconductor industry, specifically the competition between Intel and TSMC regarding advanced packaging technologies for AI chips, particularly the Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology offered by Intel as an alternative to TSMC's CoWoS packaging method [2][12]. Core Points and Arguments 1. **EMIB-T Technology**: - EMIB-T is an enhanced version of Intel's existing EMIB technology, designed to support larger reticle sizes and provide a more cost-effective solution for AI chip packaging compared to TSMC's CoWoS [3][34]. - Intel claims EMIB-T can support reticle sizes of 8-12x by 2026-2027, compared to TSMC's current capabilities of 3.3x and future plans for 5.5x and 9.5x [3][34]. 2. **Financial Impact**: - If 1 million chips shift from CoWoS to EMIB-T, TSMC could face a revenue loss of approximately $1 billion, which is about 5-10% of its advanced packaging revenue in 2027, but only 0.5% of its total revenue [4][52]. - Conversely, Intel could see a revenue increase of high triple-digit millions, representing 1-2% of its revenue [4][51]. 3. **Market Positioning**: - Ibiden is highlighted as a strong player in the EMIB-T market, with expectations of increased revenue and margins due to the complexity of EMIB-T substrates [5][54]. - The substrate value for EMIB-T is projected to rise to approximately $300, significantly higher than previous generations [5][49]. 4. **Geopolitical Considerations**: - Intel's existing advanced packaging capacity in the U.S. provides a competitive edge, especially as TSMC plans to build new packaging fabs in Arizona, which may not be operational until 2028 [13][35]. 5. **Challenges for EMIB-T**: - The main challenges for EMIB-T include a lack of proven track record and potential lower production yields due to the complexity of embedding silicon bridges in the substrate [3][34]. Additional Important Content - **Customer Engagement**: Intel has indicated potential early customer engagements worth "north of a billion dollars" each, although this remains uncertain [4][51]. - **Future Developments**: Intel is also exploring advancements in 3.5D packaging, which combines EMIB with Foveros Direct technology, aiming to compete more effectively with TSMC's offerings [42][43]. - **Investment Ratings**: - Ibiden, TSMC, and MediaTek are rated as "Outperform," while Intel is rated as "Market-Perform" [8][9][10][11]. Conclusion - The semiconductor industry is witnessing a significant shift with Intel's EMIB-T technology potentially challenging TSMC's dominance in advanced packaging for AI chips. The financial implications for both companies are substantial, with Ibiden positioned to benefit from this transition. However, challenges remain regarding production yields and the need for proven technology.

Core Insights - The article highlights the growing importance of AI stocks in the stock market, particularly focusing on companies like Nvidia and OpenAI that are at the forefront of generative AI technology [1] Industry Overview - The AI sector is experiencing a boom, but selecting individual winners is challenging due to competitive pressures and risks faced by leading companies like Nvidia and TSMC [2] - TSMC, while a dominant player in chip manufacturing, faces competition from Intel and is also impacted by geopolitical risks due to its location in Taiwan [2] Investment Vehicle - Exchange-traded funds (ETFs) are presented as a smart alternative for investors seeking exposure to the stock market without the need to pick individual stocks [3] - The VanEck Semiconductor ETF (SMH) is highlighted as a top performer since its inception in 2011, significantly outperforming the S&P 500 [4][6] ETF Performance - The SMH ETF has a strong historical performance, particularly during the AI boom, and includes major chip stocks such as Nvidia (19.3% of net assets) and TSMC (10.2%) among its top holdings [6][7] - Recent performance of ASML and Intel indicates that the AI boom is benefiting even those companies that have previously lagged behind [8] Future Growth Potential - The demand for semiconductors is expected to grow due to technological advancements, with increasing reliance on semiconductors in various products and infrastructure [11] - Despite a trailing price-to-earnings ratio of 46, the growth potential of companies within the SMH ETF, such as Nvidia's 62% revenue growth, suggests that the ETF may be undervalued on a forward basis [12] Diversification Benefits - The VanEck Semiconductor ETF offers a good alternative to the S&P 500 by providing exposure to international stocks like TSMC and ASML, which are not included in the index [13]

Summary of the Conference Call on AI Annual Report Analysis Industry Overview - The conference focused on the analysis and outlook of AI annual reports, particularly in the TMT (Technology, Media, and Telecommunications) sector, with a specific emphasis on domestic and international AI companies [1][2][4]. Key Points and Arguments General Market Sentiment - The period from October 31 to March is characterized as a performance vacuum, where the focus is on thematic investments rather than immediate earnings results [2][3]. - The spring market is expected to see a resurgence, with significant activity anticipated around March [3][4]. North American Companies - North American companies, particularly those involved in AI and cloud computing, have reported earnings that exceeded expectations, indicating strong capital expenditure in AI [4][6]. - Companies like Microsoft and Meta have shown robust spending on AI infrastructure, reflecting a positive outlook for the sector [4][6]. - Despite some domestic companies underperforming, their stock prices have rebounded, suggesting that market sentiment is more focused on thematic trends rather than immediate earnings [5][6]. Domestic AI Companies - Domestic AI companies are experiencing a supply-demand imbalance, with strong demand for AI-related products and services, despite some companies reporting earnings below expectations [6][7]. - The industry is characterized by a shortage of materials and components, which is driving prices up and creating a favorable environment for growth [6][7][10]. Future Growth Projections - There is a consensus that the growth trajectory for AI companies will continue to be strong, with expectations for significant growth in 2026 and beyond [8][9]. - Many companies are currently undervalued, trading at price-to-earnings (P/E) ratios between 15x to 20x, which presents a potential investment opportunity [8][9]. Specific Company Insights - Companies like Wan, Tianfu Communication, and others are highlighted for their potential despite recent earnings misses, as the overall industry outlook remains positive [4][6][7]. - The demand for GPUs and AI chips is expected to remain high, with domestic companies like Cambrian facing challenges but still showing potential for recovery [9][10]. Application and Innovation - The conference emphasized the importance of AI applications, particularly in gaming and media, with companies like Tencent and ByteDance leading the charge [14][15]. - The emergence of AI-driven applications is seen as a significant growth area, with expectations for increased investment and innovation in this space [14][15]. Regulatory and Market Concerns - There are concerns regarding potential regulatory impacts on the gaming industry, but these are largely viewed as unfounded and not likely to affect the overall market significantly [15][16]. - The market is currently experiencing volatility, but analysts suggest that this presents buying opportunities for fundamentally strong companies [21][22]. Additional Important Insights - The conference highlighted the importance of monitoring capital expenditure trends among major tech companies, as this will influence the demand for AI infrastructure and services [36][37]. - The potential for new technologies, such as diamond-based cooling materials for semiconductors, was discussed as a future growth area [24][25]. - Analysts recommend focusing on companies with strong fundamentals and growth potential, particularly in the AI and semiconductor sectors, as the market continues to evolve [22][23][39].