Summary of Conference Call Notes Industry Overview - The focus is on the application of **tandem solar cells** in **space photovoltaic** systems, highlighting the challenges and advancements in technology related to lightweight and flexible solar panels [1][2]. Key Points and Arguments 1. **Challenges with Thin Silicon Cells**: - Space photovoltaic cells require extreme weight reduction and flexibility, making ultra-thin silicon cells very fragile. The use of string welding can lead to mechanical stress and high-temperature welding issues, increasing the risk of silicon cell breakage and detachment under extreme temperature variations in space [1][2]. 2. **Advantages of Tandem Structure**: - The tandem structure allows for flexible connections of silicon cells, reducing the number of solder joints. This effectively disperses mechanical stress, minimizing the risks of hidden cracks and breakage [1][2]. 3. **Increased Effective Power Generation**: - The tandem structure can achieve zero spacing between solar cells, which enhances the effective power generation area for the same solar wing size [3]. 4. **Historical Context**: - The application of tandem structures in space photovoltaics is well-established, with the "Shijian-1" satellite launched in 1971 being an early example of a solar panel using a "comb-type" structure designed in China [4]. 5. **Industry Feedback**: - Leading North American renewable energy companies are currently using tandem solutions for ground photovoltaic modules. The production line for tandem components is reported to be more than twice the cost of conventional string welding lines, indicating significant market interest [4]. Company Highlights 1. **ST Jingji**: - The wholly-owned subsidiary, Shengcheng Photovoltaics, possesses competitive manufacturing technology for tandem components. It is noted for being the sole supplier of ground tandem production lines to a well-known North American company and has also supplied coating equipment to overseas space perovskite enterprises. The company holds a significant market share in North America, estimated to exceed 50% [4]. 2. **Dike Co., Ltd.**: - A leading company in photovoltaic silver paste, known for its R&D capabilities. It has nearly 100% market share in North America and has been promoting tandem adhesive products since 2019, leveraging its core patent advantages in conductive paste solutions [5]. 3. **Debang Technology**: - A core supplier of tandem conductive adhesives, with products widely used in leading photovoltaic companies such as Tongwei, Canadian Solar, and major North American renewable energy firms, holding a strong competitive position in the market [5]. 4. **Juhe Materials**: - A leading company in photovoltaic silver paste, developing copper paste products suitable for photovoltaic cells, currently undergoing testing with major clients and expected to benefit from the adoption of high/pure copper paste materials [5]. 5. **Aotewei**: - A leading company in photovoltaic component equipment, with key products including string welding machines and silicon wafer sorting machines. The company has also made advancements in tandem equipment, achieving high precision and yield rates [6]. Additional Important Insights - The integration of semiconductor material assets by companies is seen as a solution to domestic supply chain issues, addressing critical bottlenecks in the industry [5][6].

Investment Rating - The report maintains a strong recommendation for companies such as 帝科股份 (Dike Co., Ltd.) and 聚和材料 (Juhua Materials) [3][4] - ST 京机 (ST Jingji) and 德邦科技 (Debang Technology) are not rated [3] Core Insights - The report highlights the potential application of the tile structure in space photovoltaic systems, which can reduce the risk of damage to solar cells and improve power output per unit area [1][7] - The use of tile structures is expected to create new demand scenarios for conductive adhesives and related equipment, benefiting companies involved in these technologies [1][7] Industry Overview - The industry consists of 308 listed companies with a total market capitalization of 792.4 billion and a circulating market value of 693.8 billion [4] - The industry has shown strong performance with absolute returns of 63.1% over 12 months [6] Key Companies - **ST 京机 (ST Jingji)**: A leader in automated manufacturing technology for photovoltaic modules, with a significant market share and established partnerships in tile technology [8] - **帝科股份 (Dike Co., Ltd.)**: A leading company in photovoltaic silver paste, with a strong market position and potential for growth in space photovoltaic applications [9] - **德邦科技 (Debang Technology)**: A core supplier of conductive adhesives for tile photovoltaic cells, with a strong competitive advantage [10] - **聚和材料 (Juhua Materials)**: A leading company in photovoltaic silver paste, developing copper paste products and addressing domestic supply chain issues [11] - **奥特维 (Aotewi)**: A prominent manufacturer of photovoltaic equipment, with deep reserves in tile technology and a comprehensive solution for vacuum process equipment [12]

Group 1 - The A-share market saw a collective surge in liquid cooling concept stocks, with Fangsheng Co. rising by 17%, Shenling Environment increasing by over 13%, and Langjin Technology and Yimikang both up by over 12% [1] - Other notable performers included Chuanrun Co., Bojie Co., and Dayuan Pump Industry, which all hit the daily limit of 10%, while Keda, Yingweik, Kexin Innovation, and Debang Technology rose by over 7% [1] Group 2 - The table lists several stocks with their respective price changes and market capitalizations, highlighting that Youkede-W had a price increase of 20.01% with a total market value of 20.6 billion, and a year-to-date increase of 60.38% [2] - Wansheng Co. experienced a 17.01% rise, with a market cap of 2.801 billion and a year-to-date increase of 10.23% [2] - Shenmeng Environment saw a 13.84% increase, with a market cap of 22.9 billion and a year-to-date increase of 35.74% [2]

Core Viewpoint - Debang Technology has announced a change in its fundraising project, reallocating the remaining funds of 62.3699 million yuan from the "Annual Production of 35 Tons of Semiconductor Electronic Packaging Materials Project" to a new project focused on the "Debang Semiconductor Material R&D and Production Base in South China" to align with industry trends and optimize strategic layout [2][4]. Group 1 - The new project will be implemented by Debang Technology's wholly-owned subsidiary, Shenzhen Debang Interface Materials Co., Ltd., located in Longgang District, Shenzhen, with a construction period of 2 years and a total investment of 230 million yuan [2]. - The new project aims to achieve an annual production capacity of 450 tons of thermal management and EMI materials, including subcategories such as thermal paste, thermal mud, thermal gel, thermal pads, phase change materials, and conductive adhesives, focusing on the core semiconductor materials sector [3]. - The original project, which has been terminated, was planned to produce 15 tons of electronic packaging materials for semiconductor chips and systems, and 20 tons of photovoltaic stacking materials, but faced significant delays and low funding utilization [3]. Group 2 - The change in fundraising projects reflects Debang Technology's quick response to changes in industry demand and is a strategic move to optimize regional production capacity and strengthen core competitiveness, potentially injecting new momentum into the company's development in the high-end semiconductor materials sector [4].

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are highlighted, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article identifies 14 key advanced packaging materials that are critical for the semiconductor industry, emphasizing the potential for domestic companies to capture market share from established foreign players [7][8]. - Companies like 鼎龙股份, 国风新材, and 三月科 are mentioned as potential leaders in the domestic market for advanced packaging materials [8]. Growth Projections - The market for conductive adhesives is expected to reach 3 billion yuan by 2026, while the chip bonding materials market is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The epoxy encapsulant market is anticipated to grow to $9.9 billion by 2027, indicating strong demand for these materials in the electronics sector [8]. Competitive Landscape - The article outlines the competitive landscape, noting that foreign companies like Fujifilm, Toray, and JSR dominate certain segments, while domestic firms are emerging as strong competitors [8]. - The need for innovation and investment in R&D is emphasized for domestic companies to successfully compete against established international players [8].

Core Points - The company held its first extraordinary general meeting of shareholders in 2026, with no resolutions being rejected [2][5] - The total share capital of the company is 142,240,000 shares, with 1,676,917 shares in the repurchase account not entitled to voting rights, resulting in 140,563,083 shares eligible for voting at the meeting [2] - The meeting was convened by the board of directors and chaired by the chairman, utilizing a combination of on-site and online voting methods, in compliance with the Company Law and the company's articles of association [3] Meeting Attendance - All 9 current directors attended the meeting, along with the board secretary and a senior executive [4] - The meeting was witnessed by lawyers from Beijing Zhide Law Firm, who confirmed the legality of the meeting's procedures and results [6] Agenda Review - One of the key resolutions discussed was the proposal to change part of the fundraising projects, which was approved by more than half of the voting rights represented at the meeting [5][6] - The meeting took place on February 4, 2026, at the company's office in Yantai, Shandong Province [5]

本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 证券代码：688035 证券简称：德邦科技 公告编号：2026-010 一、 会议召开和出席情况 烟台德邦科技股份有限公司 2026年第一次临时股东会决议公告 （一） 股东会召开的时间：2026 年 2 月 4 日 （二） 股东会召开的地点：山东省烟台市开发区珠江路 66 号正海大厦 29 层 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 75 | | --- | --- | | 普通股股东人数 | 75 | | 2、出席会议的股东所持有的表决权数量 | 73,130,214 | | 普通股股东所持有表决权数量 | 73,130,214 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 | 52.0266 | | 例（%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 52.0266 | 注：截至本次股 ...

北京植德律师事务所 关于烟台德邦科技股份有限公司 2026 年第一次临时股东会的 法律意见书 北京市东城区东直门南大街 1 号来福士中心办公楼 12 层 邮编：100007 12th Floor, Raffles City Beijing Offices Tower, No.1 Dongzhimen South Street, Dongcheng District, Beijing 100007 P.R.C. 电话（Tel）: 010-56500900 传真（Fax）: 010-56500999 www.meritsandtree.com 北京植德律师事务所 关于烟台德邦科技股份有限公司 2026 年第一次临时股东会的 法律意见书 植德京（会）字[2026]0015 号 致：烟台德邦科技股份有限公司（贵公司） 植德京（会）字[2026]0015号 二〇二六年二月 北京植德律师事务所（以下简称"本所"）接受贵公司的委托，指派律师出席 并见证贵公司 2026 年第一次临时股东会（以下简称"本次会议"）。 本所律师参加本次会议进行见证，并根据《中华人民共和国公司法》（以下简称 "《公司法》"）、《中华人民共和国证券 ...

Group 1 - The core point of the article is that Debang Technology announced its share repurchase status as of January 31, 2026, indicating that the company has repurchased a total of 991,897 shares, which represents 0.6973% of its total share capital [2] Group 2 - The share repurchase was conducted through the centralized bidding trading method on the Shanghai Stock Exchange [2] - The announcement was made on February 2, 2026, providing an update on the company's ongoing share repurchase program [2]

烟台德邦科技股份有限公司 关于第二期以集中竞价交易方式回购公司股份的进展 公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2025/4/4 | | | --- | --- | --- | | 回购方案实施期限 | 2025 年 4 月 2 日~2026 年 | 4 月 1 日 | | 预计回购金额 | 4,000万元~8,000万元 | | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 | | | | □用于转换公司可转债 | | | | □为维护公司价值及股东权益 | | | 累计已回购股数 | 991,897股 | | | 累计已回购股数占总股本比例 | 0.6973% | | | 累计已回购金额 | 4,001.28万元 | | | 实际回购价格区间 | 35.79元/股~50.93元/股 | | 一、回购股份的基本情况 2025 年 4 月 2 日，烟台德邦科技股份有限公司（以下简称"公司"）召开第二 届董事会第十四次会议，审议通过了《关于第二期以集中 ...