格隆汇1月29日丨德邦科技(688035.SH)公布，根据《企业会计准则》和相关会计政策等规定，为客观公 允地反映烟台德邦科技股份有限公司2025年度财务状况及经营成果，基于谨慎性原则，对截至2025年12 月31日合并报表范围内可能发生信用及资产减值损失的有关资产进行了减值测试并计提相应的减值准 备。2025年度公司计提各类信用及资产减值准备共1959.23万元。 ...

德邦科技(688035.SH)公告称，持股5%以上股东舟山泰重创业投资合伙企业（有限合伙）因自身资金需 求，拟通过集中竞价和大宗交易方式合计减持不超过2,844,800股，即不超过公司总股本的2%；其中集 中竞价减持不超过1,422,400股、大宗交易减持不超过1,422,400股；减持期间为2026年3月3日至2026年6 月2日；拟减持股份来源于公司首次公开发行前取得。 ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are highlighted, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article identifies 14 key advanced packaging materials that are critical for the semiconductor industry, emphasizing the potential for domestic companies to capture market share from established foreign players [7][8]. - Companies like 鼎龙股份, 国风新材, and 三月科 are mentioned as potential leaders in the domestic market for advanced packaging materials [8]. Growth Projections - The market for conductive adhesives is expected to reach 3 billion yuan by 2026, while the chip bonding materials market is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The epoxy encapsulation materials market is anticipated to grow to $9.9 billion by 2027, indicating strong demand in the sector [8]. Competitive Landscape - The article outlines the competitive landscape, noting that foreign companies like Fujifilm, Toray, and Dow are currently dominant in various segments, but domestic firms are rapidly advancing [8]. - The need for innovation and investment in R&D is emphasized for domestic companies to compete effectively against established international players [8].

证券日报网讯1月27日，德邦科技在互动平台回答投资者提问时表示，公司有着20余年深耕高端装备行 业及工业维修MRO领域的深厚经验与技术积淀，产品矩阵丰富多元，不仅涵盖聚氨酯、环氧、丙烯 酸、有机硅及胶带类产品，还创新开发出多元杂化胶等全化学体系产品，应用市场广泛，目前主要聚焦 于汽车包括汽车智能制造、轨道机车、工程机械、矿山机械、智慧家电和电动工具等领域。针对不同领 域的特殊需求，公司定制开发了高可靠性结构胶、耐高温密封胶等系列产品，通过优化配方设计与工艺 适配性，满足高端装备在振动防护、绝缘密封、导热散热等关键环节的性能要求。具体下游终端使用情 况请以相关厂商发布的信息为准。 ...

股票简称：德邦科技 烟台德邦科技股份有限公司 2026 年第一次临时股东会会议资料 烟台德邦科技股份有限公司 2026 年第一次临时股东会会议资料 烟台德邦科技股份有限公司 2026 年第一次临时股东会会议资料 股票代码：688035 2026 年 02 月 1 | 2026 | 年第一次临时股东会会议议程 5 | | --- | --- | | 2026 | 年第一次临时股东会会议议案 6 | | | 议案：《关于变更部分募投项目的议案》 6 | 烟台德邦科技股份有限公司 2026 年第一次临时股东会须知 为了维护全体股东的合法权益，确保股东会的正常秩序和议事效率，保证会 议的顺利进行，根据《中华人民共和国公司法》《中华人民共和国证券法》中国 证监会《上市公司股东会规则》以及《烟台德邦科技股份有限公司章程》《烟台 德邦科技股份有限公司股东会议事规则》的相关规定，特制定 2026 年第一次临 时股东会会议须知： 一、为确认出席会议的股东或其代理人或其他出席者的出席资格，会议工作 人员将对出席会议者的身份进行必要的核对工作，请被核对者给予配合。 二、为保证本次会议的严肃性和正常秩序，切实维护股东的合法权益，请出 ...

Core Viewpoint - Debon Technology has shown significant growth in revenue and net profit, indicating a strong market position in high-end electronic packaging materials [2] Group 1: Financial Performance - As of January 26, Debon Technology's stock price increased by 0.68%, with a trading volume of 457 million yuan [1] - For the period from January to September 2025, Debon Technology achieved a revenue of 1.09 billion yuan, representing a year-on-year growth of 39.01% [2] - The net profit attributable to shareholders for the same period was 69.75 million yuan, reflecting a year-on-year increase of 15.39% [2] Group 2: Shareholder and Market Activity - As of September 30, the number of shareholders for Debon Technology reached 11,700, an increase of 10.30% compared to the previous period [2] - The average number of circulating shares per shareholder increased by 45.20% to 12,171 shares [2] - The total financing and securities balance for Debon Technology as of January 26 was 383 million yuan, accounting for 4.76% of the circulating market value, which is above the 90th percentile level over the past year [1] Group 3: Business Segmentation - Debon Technology's main business revenue composition includes: 52.06% from new energy application materials, 24.14% from smart terminal packaging materials, 16.39% from integrated circuit packaging materials, and 7.27% from high-end equipment application materials [1]

（文章来源：证券日报） 证券日报网1月23日讯 ，德邦科技在接受调研者提问时表示，热界面材料是整个热管理系统的重要组成 部分，目前国内做热界面材料的中小企业较多，但大部分仍处于相对低端的领域，高端热界面材料市场 主要份额仍被国外厂商占据。目前公司热界面材料已具备多品类、多系列产品及解决方案，公司凭借自 主核心技术研发能力，目前已具备参与全球高端电子封装材料产业分工、参与竞争的综合实力。同时公 司也在积极探索新的产品体系，进一步完善公司在热管理领域的布局。 ...

证券日报网1月23日讯，德邦科技在接受调研者提问时表示，公司材料广泛应用于手机、耳机、手表、 Pad、笔记本电脑、车载电子、平面显示等智能终端产品。目前在耳机端的应用已具备了一定的份额优 势，其中在TWS耳机领域表现尤为突出——凭借在声学模组密封、结构粘接等环节的技术优势，已在 国内外头部客户的供应链中占据较高市场份额，成为该细分领域核心供应商之一；在智能手机端， 以"LIPO超窄边框屏幕封装技术"为代表的新的应用点不断突破，在智能手机端的应用点整体份额呈现 不断增长的趋势；在车载电子端实现多点的导入和起量；在偏光片领域应用拓展迅速并快速起量。产品 竞争力的提升带来的新的应用点的突破、份额的增长，推动了智能终端业务的高效增长。 ...

Core Viewpoint - The company, Debang Technology, indicates that advanced packaging materials such as chip underfill materials, chip frame AD glue, and chip bonding DAF/CDAF films are still in the early stages of development in China, with market share predominantly held by foreign manufacturers from Japan, South Korea, Europe, and the United States [1] Group 1 - The domestic market for advanced packaging materials is currently limited, with few manufacturers capable of validation or introduction [1] - The company is actively investing in research and development to keep pace with the domestic production process and has achieved mass production capabilities [1] - Small batch deliveries of advanced packaging materials are expected by 2025 for several categories, including chip underfill materials, chip frame AD glue, and chip bonding DAF/CDAF films [1] Group 2 - The company anticipates an acceleration in the domestic production process and is looking forward to customers actively adopting large-scale usage of these materials [1]

Core Viewpoint - The company is experiencing stable growth in the sales of new energy application materials, driven by the increasing demand from the downstream electric vehicle market and rapid penetration of energy storage business, despite facing pricing pressure due to cost-cutting demands from the industry [1] Group 1: Company Performance - The company reported a continuous high-speed growth in the shipment volume of new energy application materials [1] - The market share of the company remains relatively stable [1] Group 2: Cost Management Strategies - The company is implementing multiple cost-reduction measures in response to pricing pressures, including the commissioning of advanced fully automated production lines that significantly lower production and operational costs [1] - The company possesses leading capacity and output advantages domestically, along with significant bargaining power in raw material procurement [1] - Continuous optimization of formulations and technological cost reductions are part of the company's strategy to maintain reasonable gross margins while achieving sales growth in the new energy sector [1]