Telink Semiconductor(Shanghai) (688591)
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泰凌微:公司芯片产品在智能家居等多个领域向谷歌供货
Zheng Quan Shi Bao Wang· 2025-12-10 08:46
Group 1 - The core point of the article is that TaiLing Micro announced on December 10 that its chip products are supplying Google in various fields such as smart home and audio [1] Group 2 - The company is actively involved in the supply chain for technology products, indicating a strong position in the semiconductor industry [1] - The collaboration with a major player like Google highlights the company's growth potential and market relevance [1] - The sectors mentioned, including smart home and audio, are key growth areas in the technology market, suggesting future opportunities for the company [1]
泰凌微(688591.SH):公司的芯片已在谷歌的Pixel Bud Pro 2智能耳机方案中被采用
Ge Long Hui· 2025-12-10 08:04
Core Viewpoint - The company, TaiLing Microelectronics (688591.SH), has expanded its collaboration with Google from supplying remote control chips to a deep partnership covering multiple areas such as audio, smart home, and edge AI [1] Group 1: Partnership Development - The collaboration with Google now includes specific project cooperation in various fields [1] - The relationship has evolved from a single product focus to a comprehensive partnership [1] Group 2: Product Innovation - The company has launched the TL-EdgeAI platform based on the TL721X series chips, which supports Google's LiteRT and TVM open-source models [1] - The TL-EdgeAI platform is noted to be the world's lowest power consumption smart IoT connection protocol platform [1] Group 3: Market Application - The company's chips have been adopted in Google's Pixel Bud Pro 2 smart earphone solution [1]
泰凌微(688591.SH):公司的端侧AI芯片目前持续放量中
Ge Long Hui· 2025-12-10 08:04
格隆汇12月10日丨泰凌微(688591.SH)在互动平台表示,公司的端侧AI芯片目前持续放量中。 ...
泰凌微:与谷歌在智能家居等多个领域开展具体项目合作
Zheng Quan Shi Bao Wang· 2025-12-10 07:48
Core Viewpoint - The company has established a deep collaborative relationship with Google, expanding from a single remote control chip supplier to multiple fields including audio, smart home, and edge AI [1] Group 1: Partnership Development - The collaboration with Google now encompasses various projects in smart home and audio sectors [1] - The company has transitioned from supplying only remote control chips to a broader partnership involving advanced technologies [1] Group 2: Product Innovation - The company launched the TL-EdgeAI platform based on the TL721X series chips, which supports Google's LiteRT and TVM open-source models [1] - The TL-EdgeAI platform is noted as the world's lowest power consumption smart IoT connection protocol platform [1] Group 3: Market Application - The company's chips have been integrated into Google's Pixel Bud Pro2 smart earphone solution [1] - The company aims to further deepen its collaboration with Google in the future [1]
Matter芯片,真的火了
3 6 Ke· 2025-12-03 03:33
Core Insights - Matter has rapidly gained traction, with its version evolving to 1.5, receiving strong support from major terminal manufacturers like Amazon, Samsung, and Apple [1][6] - Despite the fragmented ecosystem in China, Matter remains a crucial standard for many overseas manufacturers [1] - The technology aims to eliminate fragmentation in the IoT space, enhancing interoperability among various smart devices [1][4] Development of Matter - Matter was initially proposed in December 2019 as CHIP and officially introduced as a new connectivity standard in May 2021 [6] - The first official version, Matter 1.0, was released in October 2022, followed by updates to versions 1.1 and 1.2 in May and October 2023, respectively [6] - The latest version, Matter 1.5, released in November 2023, includes native support for smart cameras and enhanced energy management capabilities [6][10] Features of Matter - Matter offers seamless interoperability, ease of use, strong security, and high acceptance within the ecosystem [7] - It effectively addresses the challenges of multi-protocol compatibility, allowing users to integrate new and existing devices without replacement [7] - The built-in security mechanisms of Matter reduce the burden on application layer security design, enabling developers to focus on user experience [7] Chip Technology and Manufacturers - Chip technology is crucial for the development of Matter, with two main configurations: System on Chip (SoC) and Co-processor [9] - STMicroelectronics launched the ST25DA-C, the first NFC chip compatible with Matter 1.5, allowing for easier device configuration [10][11] - Qorvo's multi-connection technology facilitates backward and forward compatibility for Matter, integrating various wireless standards [23][24] Product Offerings - Qorvo's QPG6200 series chips support multiple protocols with low power consumption, suitable for battery-operated applications [25][26] - Texas Instruments (TI) has been involved in Matter's development for over a decade, offering various compatible products [27][28][29] - NXP focuses on secure wireless connections and innovative solutions based on Matter, enhancing smart home and building automation applications [30][36][39] Industry Trends - Silicon Labs is among the first companies to support Matter compatibility certification, emphasizing the importance of flexible chip technology [40][41] - Nordic Semiconductor has expanded its product line to include high-memory wireless SoCs designed for low-power Bluetooth and Matter applications [44] - With increasing investments from chip manufacturers, the long-standing fragmentation issue in IoT is being addressed, making Matter a significant focus for companies looking to enter overseas markets [46]
泰凌微:关于董事辞职暨选举职工代表董事的公告
Zheng Quan Ri Bao· 2025-11-28 13:40
Group 1 - The company announced that on November 28, 2025, it received a written resignation letter from director MINGJIANZHENG [2] - On the same day, the company held a staff representative meeting and made a resolution to elect MINGJIANZHENG as a representative director of the second board of directors [2]
泰凌微(688591) - 关于董事辞职暨选举职工代表董事的公告
2025-11-28 10:00
本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示: 泰凌微电子(上海)股份有限公司(以下简称"公司")于 2025 年 11 月 28 日召开了 2025 年第一次临时股东会,审议通过了《关于取消监事会、变更注册 资本并修订<公司章程>的议案》。根据修订后的《公司章程》,公司董事会由 9 名董事组成,其中设职工代表董事 1 名。因此,公司对董事会成员结构进行调整。 公司于 2025 年 11 月 28 日收到董事 MINGJIAN ZHENG 先生提交的书面辞职报 告。同日,公司召开职工代表大会并作出决议,选举 MINGJIAN ZHENG 先生 为公司第二届董事会职工代表董事。现将相关情况公告如下: 证券代码:688591 证券简称:泰凌微 公告编号:2025-055 泰凌微电子(上海)股份有限公司 关于董事辞职暨选举职工代表董事的公告 公司于 2025 年 11 月 28 日召开了 2025 年第一次临时股东会,审议通过了《关 于取消监事会、变更注册资本并修订<公司章程>的议案》。根据修订后的《公司 章程》,公 ...
泰凌微(688591) - 北京市中伦(上海)律师事务所关于泰凌微电子(上海)股份有限公司2025年第一次临时股东会的法律意见书
2025-11-28 10:00
北京市中伦(上海)律师事务所 关于泰凌微电子(上海)股份有限公司 2025 年第一次临时股东会的 法律意见书 二〇二五年十一月 法律意见书 北京市中伦(上海)律师事务所 关于泰凌微电子(上海)股份有限公司 2025 年第一次临时股东会的 法律意见书 致:泰凌微电子(上海)股份有限公司(以下简称"公司") 北京市中伦(上海)律师事务所(以下简称"本所")接受公司的委托,指 派律师出席并见证公司2025年第一次临时股东会(以下简称"本次会议")。 本所律师根据《中华人民共和国公司法》(以下简称"《公司法》")、《中 华人民共和国证券法》(以下简称"《证券法》")、《上市公司股东会规则》 (以下简称"《股东会规则》")、《律师事务所从事证券法律业务管理办法》 (以下简称"《证券法律业务管理办法》")、《律师事务所证券法律业务执业 规则(试行)》(以下简称"《证券法律业务执业规则》")等相关法律、行政 法规、规章、规范性文件及《泰凌微电子(上海)股份有限公司章程》(以下简 称"《公司章程》")的规定,就本次会议的召集与召开程序、召集人资格、出 席会议人员资格、会议表决程序及表决结果等事宜,出具本法律意见书。 对本法律 ...
泰凌微(688591) - 2025年第一次临时股东会决议公告
2025-11-28 10:00
证券代码:688591 证券简称:泰凌微 公告编号:2025-056 泰凌微电子(上海)股份有限公司 2025年第一次临时股东会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示: 本次会议是否有被否决议案:无 一、 会议召开和出席情况 (一) 股东会召开的时间:2025 年 11 月 28 日 (二) 股东会召开的地点:中国(上海)自由贸易试验区盛夏路 61 弄 1 号 11 层 (三) 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况: | 1、出席会议的股东和代理人人数 | 174 | | --- | --- | | 普通股股东人数 | 174 | | 2、出席会议的股东所持有的表决权数量 | 69,050,380 | | 普通股股东所持有表决权数量 | 69,050,380 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 | 29.1967 | | 例(%) | | | 普通股股东所持有表决权数量占公司表决权数量的比例(%) | 29.1967 ...
泰凌微:非独立董事郑明剑辞任
2 1 Shi Ji Jing Ji Bao Dao· 2025-11-28 09:43
Core Points - The company announced that non-independent director Zheng Mingjian submitted a written resignation due to adjustments in the corporate governance structure [1] - Zheng Mingjian will continue to serve as the Vice General Manager and Chief Technology Officer (CTO) after his resignation [1] - As of the announcement date, Zheng Mingjian directly holds 4,740,820 shares of the company and will continue to adhere to the commitments made during the initial public offering and stock incentive plans [1]