Investment Rating - The industry investment rating is "Outperform the Market" (maintained) [3] Core Viewpoints - The report highlights that AI is driving advanced packaging demand, with significant growth in storage-related businesses [2][4] - The semiconductor packaging sector experienced a slight decline in gross margin in Q3 2025, but year-on-year comparisons show growth [11][12] - The report emphasizes the importance of advanced packaging technologies in enhancing chip performance and integration, particularly with the ongoing development of Chiplet packaging concepts [4][5] Summary by Sections Overview - In Q3 2025, the semiconductor packaging sector's gross margin slightly decreased, with a gross margin of 21.09%, which is higher than the average of 15.79% for leading packaging companies [11][12] OSAT (Outsourced Semiconductor Assembly and Test) - AI is significantly boosting demand for advanced packaging, with notable growth in the storage sector [17] - Major companies like ASE achieved revenues of 22.63 billion RMB in Q3 2025, reflecting an 8.34% quarter-on-quarter increase and a 16.90% year-on-year increase [18][19] - Advanced packaging services are expected to continue driving growth, particularly in AI-related applications [19][20] Testing - AI-related business growth is notable, with companies like Jingyuan Electronics reporting a revenue increase of 31.99% year-on-year in Q3 2025 [5][41] - Wei Ce Technology's revenue for the first three quarters of 2025 reached 10.83 billion RMB, a 46.22% year-on-year increase, driven by strong demand in computing and automotive electronics [5][41] Equipment - The report indicates that AI growth is leading to a continuous increase in orders, with companies like Besi reporting a 36.5% quarter-on-quarter increase in new orders [5][41] - ASMPT's revenue in Q3 2025 was 33.13 billion RMB, a 7.6% quarter-on-quarter increase, driven by growth in SMT business [5][41] Investment Recommendations - The report suggests focusing on companies benefiting from AI-driven demand, including packaging companies like ASE, Tongfu Microelectronics, and Changdian Technology, as well as testing companies like Jingyuan Electronics and Wei Ce Technology [5][41]

Quantitative Models and Construction Methods 1. Model Name: Liquidity Impact Coefficient Model - **Model Construction Idea**: This model measures the liquidity impact of index adjustments on individual stocks by calculating the ratio of net fund flows to the stock's recent average daily trading volume[12][13] - **Model Construction Process**: The liquidity impact coefficient for a stock is calculated as follows: $$ impact_{i} = \sum_{k=1}^{N} \frac{\Delta weight_{k,i} \times AUM_{k}}{amt\_avg_{i,20}} $$ - \( \Delta weight_{k,i} \): Estimated weight change of stock \( i \) in index \( k \) - \( AUM_{k} \): Total assets under management of passive products tracking index \( k \) as of the end of November - \( amt\_avg_{i,20} \): Average daily trading volume of stock \( i \) over the past 20 trading days as of the end of November[12][13] - **Model Evaluation**: The model provides a quantitative framework to estimate short-term liquidity shocks caused by index adjustments, but it is subject to data discrepancies and assumptions, which may lead to deviations from actual results[13] --- Model Backtesting Results Liquidity Impact Coefficient Model - **Top 5 Stocks with Highest Positive Impact Coefficients**: - Zhangjiagang Bank (002839 CH): 11.55[15] - Jiangzhong Pharmaceutical (600750 CH): 11.44[15] - Tower Group (002233 CH): 11.04[15] - Jichuan Pharmaceutical (600566 CH): 10.14[15] - Zhengbang Technology (002157 CH): 9.99[15] - **Top 5 Stocks with Highest Negative Impact Coefficients**: - Shenzhen Expressway (600548 CH): -24.95[16] - Vanward Electric (002543 CH): -20.90[16] - Aviation Materials (688563 CH): -14.06[16] - Huaxi Biology (688363 CH): -10.81[16] - Ninghu Expressway (600377 CH): -10.54[16] --- Quantitative Factors and Construction Methods 1. Factor Name: Net Fund Flow Factor - **Factor Construction Idea**: This factor estimates the net fund inflow or outflow for stocks due to index adjustments, based on changes in index weights and the total AUM of passive products tracking the index[9][10] - **Factor Construction Process**: - Outflow Amount: Total AUM of linked products multiplied by the stock's actual weight in the index as of the end of November - Inflow Amount: Total AUM of linked products multiplied by the estimated weight of the stock in the index post-adjustment - Weight estimation is based on free-float market capitalization and index-specific weighting rules, such as dividend yield weighting or market capitalization weighting[9][10] - **Factor Evaluation**: The factor provides a transparent and systematic approach to estimate fund flows, but it is sensitive to assumptions about future index weights and AUM changes[9][10] --- Factor Backtesting Results Net Fund Flow Factor - **Top 5 Stocks with Highest Net Fund Inflows**: - Victory Precision (300476 CH): 112.61 billion CNY[10] - Dongshan Precision (002384 CH): 99.32 billion CNY[10] - Guangqi Technology (002625 CH): 77.81 billion CNY[10] - Sugon Information (603019 CH): 65.44 billion CNY[10] - Top Group (601689 CH): 53.07 billion CNY[10] - **Top 5 Stocks with Highest Net Fund Outflows**: - China Mobile (600941 CH): -40.02 billion CNY[11] - CRRC Corporation (601766 CH): -36.40 billion CNY[11] - Aluminum Corporation of China (601600 CH): -34.29 billion CNY[11] - TCL Zhonghuan (002129 CH): -30.07 billion CNY[11] - Huagong Tech (000988 CH): -27.44 billion CNY[11]

Core Viewpoint - Huatian Technology's stock price has shown fluctuations, with a recent increase of 2.02% and a year-to-date decline of 3.65%, indicating volatility in the semiconductor packaging and testing sector [1][2]. Company Overview - Huatian Technology, established on December 25, 2003, and listed on November 20, 2007, is located in Tianshui, Gansu Province. The company primarily engages in integrated circuit packaging and testing, with 99.97% of its revenue derived from integrated circuits and 0.03% from LEDs [1][2]. Financial Performance - For the period from January to September 2025, Huatian Technology reported a revenue of 12.38 billion yuan, reflecting a year-on-year growth of 17.55%. The net profit attributable to shareholders was 543 million yuan, marking a significant increase of 51.98% [2][3]. Shareholder Information - As of September 30, 2025, Huatian Technology had 412,300 shareholders, an increase of 1.77% from the previous period. The average number of tradable shares per shareholder decreased by 0.83% to 7,901 shares [2][3]. Dividend Distribution - Since its A-share listing, Huatian Technology has distributed a total of 935 million yuan in dividends, with 340 million yuan distributed over the past three years [3]. Institutional Holdings - Among the top ten circulating shareholders as of September 30, 2025, Hong Kong Central Clearing Limited held 56.17 million shares, an increase of 11.10 million shares. The Southern CSI 500 ETF reduced its holdings by 1.14 million shares, while the Guotai Junan Semiconductor ETF entered the top ten as a new shareholder [3].

Core Viewpoint - Institutions remain optimistic about the technology sector as the main investment theme for 2026, driven by improving fundamentals and industry highlights, indicating significant potential for market growth [5][6]. Investment Themes - The three main investment directions identified are technology leadership, domestic demand recovery, and cyclical recovery, with a focus on five key technology areas: AI, embodied intelligence, solid-state batteries, semiconductors, and controllable nuclear fusion [7][8]. Economic and Market Outlook - Various institutions predict a "slow bull" market for 2026, with macroeconomic conditions expected to improve and a focus on fiscal policies to stimulate demand [9]. - The A-share market is anticipated to show upward momentum, supported by stable macro policies and a recovery in corporate earnings [9][10]. Performance of Technology Sectors - The five key technology sectors have shown significant excess returns this year, with indices for solid-state batteries and nuclear fusion rising over 55%, while AI and semiconductor indices increased by over 30% [10]. - The net profit growth for these sectors in the first three quarters of this year has significantly improved compared to the previous year, with AI and semiconductor sectors seeing net profit increases exceeding 50% [10]. Valuation and Profit Recovery - A total of 24 technology stocks are identified as having the potential for both valuation and profit recovery, with many expected to see a forecasted net profit growth of over 30% for 2025 and 2026 [12][13]. - Specific companies, such as Weijie Chuangxin and Xinxiangwei, are highlighted for their significant valuation discounts and strong growth prospects in the semiconductor and OLED sectors, respectively [12][13]. Key Companies and Predictions - Companies like Huatian Technology and Del's shares are projected to have substantial net profit growth, driven by increased orders in automotive electronics and advanced packaging [13][14]. - The table of 24 companies indicates various forecasted P/E ratios and expected profit growth, showcasing the potential for investment in these technology stocks [15].

Core Points - The U.S. International Trade Commission (ITC) has voted to initiate a Section 337 investigation into certain liquid crystal devices, components, and products containing them [1] Group 1: Investigation Details - The investigation is identified by the code 337-TA-1462 [1] - The investigation targets specific liquid crystal devices and their downstream products [1] Group 2: Defendants Listed - Multiple companies are named as defendants, including: - HKC Corporation Ltd. of China - Chongqing HKC Optoelectronics Technology Co., Ltd. of China - HiSense Group Co., Ltd. of China - VIZIO Holding Corp. of the U.S. - TCL Electronics Holdings Ltd. of Hong Kong - LG Electronics, Inc. of South Korea - Westinghouse Electric Corporation of the U.S. [2]

Core Points - The company announced the resignation of non-independent director Cui Weibing due to adjustments in the corporate governance structure [2] - Following his resignation, Cui Weibing will continue to serve in the company [2] - The company held the fourth employee representative assembly meeting on November 24, 2025, where Cui Weibing was elected as a worker representative director for the eighth board of directors [2] - Cui Weibing's term as a worker representative director will last until the eighth board's term expires [2]

本公司及董事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 一、董事辞职情况 关于董事辞职暨选举职工代表董事的公告 天水华天科技股份有限公司 证券代码：002185 证券简称：华天科技 公告编号：2025-061 崔卫兵先生当选职工代表董事后，公司第八届董事会中兼任公司高级管理人 员以及由职工代表担任的董事人数总计未超过公司董事总数的二分之一，符合相 1 关法律法规的要求。 特此公告。 天水华天科技股份有限公司董事会 二〇二五年十一月二十五日 天水华天科技股份有限公司（以下简称"公司"）董事会于 2025 年 11 月 24 日收到非独立董事崔卫兵先生提交的书面辞职报告，因公司治理结构调整， 崔卫兵先生申请辞去公司第八届董事会非独立董事职务，辞去非独立董事职务后 将继续在公司任职。崔卫兵先生原定任期至第八届董事会届满之日止。 崔卫兵先生辞去董事职务不会导致公司董事会成员低于法定最低人数，不会 影响公司董事会的正常运作，根据有关法律法规及《公司章程》的规定，辞职报 告自送达公司董事会时生效。截至本公告披露日，崔卫兵先生直接持有公司股份 107,600 股，不存在应当履行而未 ...

Group 1 - The core viewpoint of the article emphasizes the transition of the integrated circuit industry from traditional transistor scaling to system-level integration and architecture innovation, particularly highlighting the importance of advanced packaging and testing in enhancing chip performance and optimizing system power consumption [2][4][9]. Group 2 - The integrated circuit manufacturing industry consists of three main segments: chip design, wafer manufacturing, and packaging testing, with packaging testing further divided into packaging and testing processes [4][6]. - Advanced packaging is a critical aspect of modern integrated circuit manufacturing, focusing on enhancing functionality density and system-level optimization, distinguishing itself from traditional packaging methods [9][11]. Group 3 - The global integrated circuit packaging and testing industry has shifted from its early development in Europe and the United States to emerging markets in Asia, with Taiwan, mainland China, and the United States forming a triad in the current market landscape [14][16]. - The market size of the global integrated circuit packaging and testing industry is projected to grow from $55.46 billion in 2019 to $101.47 billion in 2024, with a compound annual growth rate (CAGR) of 12.8% [16]. - The advanced packaging market is expected to grow at a CAGR of 10.6% from 2024 to 2029, significantly outpacing the traditional packaging market's 2.1% CAGR [17]. Group 4 - In mainland China, major players in the integrated circuit packaging and testing industry include Longsys Technology, Tongfu Microelectronics, and Huatian Technology, with a market size projected to grow from ¥234.98 billion in 2019 to ¥331.90 billion in 2024, reflecting a CAGR of 7.2% [20][22]. - The advanced packaging market in mainland China is expected to grow at a CAGR of 14.4% from 2024 to 2029, with its market share reaching 22.9% by 2029 [22]. Group 5 - The global advanced packaging industry includes participants from both wafer manufacturing and packaging backgrounds, with significant growth driven by the demand for high-performance computing applications such as artificial intelligence and data centers [24][25]. - The market for Flip Chip (FC) packaging is projected to grow from $18.75 billion in 2019 to $26.97 billion in 2024, with a CAGR of 7.5% [28]. - Chiplet integration packaging is identified as a key growth area, with its market size expected to increase from $2.49 billion in 2019 to $8.18 billion in 2024, reflecting a remarkable CAGR of 26.9% [29]. Group 6 - The advanced packaging technology is widely applied across various sectors, including consumer electronics, mobile communications, and high-performance computing, with significant growth driven by the demand for advanced packaging in smartphones and AI applications [34][42]. - The global computing power is expected to grow from 309.0 EFlops in 2019 to 2,207.0 EFlops in 2024, with a CAGR of 48.2% [36]. Group 7 - The article outlines several trends in the integrated circuit advanced packaging and testing industry, including the acceleration of domestic substitution, the rise of chiplet integration packaging, and the increasing importance of industry chain collaboration [48][50][51]. - The value of advanced packaging is expected to continue rising, driven by the shift towards high-performance applications in AI and data centers [52].

证券代码：002185 证券简称：华天科技 公告编号：2025-060 天水华天科技股份有限公司 2025 年第一次临时股东大会决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 重要提示： 1、本次股东大会未出现否决议案的情形。 2、本次股东大会未涉及变更前次股东大会决议。 一、会议召开和出席情况 （一）会议召开情况 1、会议召开时间： （1）现场会议召开时间：2025 年 11 月 21 日（星期五）14:30 （2）网络投票时间：通过深圳证券交易所（以下简称"深交所"）交易系统 进行网络投票的时间为 2025 年 11 月 21 日上午 9:15 至 9:25，9:30 至 11:30，下午 13:00 至 15:00；通过深交所互联网投票系统投票的时间为 2025 年 11 月 21 日 9:15 至 15:00 期间的任意时间。 2、现场会议召开地点：甘肃省天水市秦州区秦州大道 360 号公司六楼会议室 3、会议的召开方式：本次股东大会采用现场投票与网络投票相结合的方式。 4、会议召集人：公司董事会 5、会议主持人：公司董事长肖胜利先生 6、会 ...

北京市竞天公诚律师事务所上海分所 关于 天水华天科技股份有限公司 2025 年第一次临时股东大会 之 法律意见书 上海市徐汇区淮海中路 1010 号嘉华中心 45 层 邮编：200031 Suite 45/F, K.Wah Centre, 1010 Huaihai Road (M), Xuhui District, Shanghai 200031, China 电话/Tel: +86 21 5404 9930 传真/Fax: +86 21 5404 9931 网址/Website: www.jingtian.com 二〇二五年十一月 北京市竞天公诚律师事务所上海分所 法律意见书 北京市竞天公诚律师事务所上海分所 关于天水华天科技股份有限公司 2025 年第一次临时股东大会之法律意见书 致：天水华天科技股份有限公司 北京市竞天公诚律师事务所上海分所（下称"本所"）受天水华天科技股份 有限公司（下称"公司"）委托，就公司 2025 年第一次临时股东大会（下称"本 次股东大会"）召集、召开、表决程序、出席会议人员资格和有效表决等所涉及 的法律事项出具本法律意见书（下称"本法律意见书"）。 本所根据《中华人民共和国公 ...