Group 1: Company Overview - The company is 盛美半导体设备（上海）股份有限公司, with stock code 688082 and stock abbreviation 盛美上海 [1] - The major shareholder ACMR will unlock 357,692,308 shares on November 18, 2024, accounting for 82.01% of the total share capital [2] Group 2: Financial Performance - As of September 30, 2024, the company reported a stable growth in orders, with sales confirmation increasing by approximately 40%-50% year-on-year [3] - The company has adjusted its 2024 revenue forecast upwards based on the execution progress of existing orders and product delivery plans [4] Group 3: Market Outlook - The company aims to capture 55%-60% of the cleaning market share in mainland China [3] - The expected shipment volume of copper plating equipment in 2024 is projected to increase by 80% compared to the previous year [4] Group 4: Product Development - The company is optimistic about the growth of its storage and logic products, with specific data expected by the end of the year [3] - The new Ultra C bev-p panel edge etching equipment is designed for advanced packaging and is expected to enter production lines next year [9] Group 5: Competitive Advantage - The company has developed a unique PECVD equipment design that allows multiple processes on the same platform, enhancing its competitive edge [8] - The Track equipment features a world-first non-contact backside cleaning module, improving overall system output [7]

Summary of Shengmei Shanghai's Conference Call Company Overview - **Company**: Shengmei Shanghai - **Industry**: Semiconductor Equipment Manufacturing Key Financial Performance - **Q3 2024 Revenue**: CNY 1.573 billion, up 37.96% YoY [2] - **Net Profit**: CNY 315 million, up 35.09% YoY [2] - **Non-GAAP Net Profit**: CNY 306 million, up 31.41% YoY [2] - **Gross Margin**: 45.09% [3] - **Total Assets**: CNY 11.366 billion, with cash and deposits of CNY 2.167 billion [3] Equipment and Technology Advancements - **Cleaning Equipment Revenue**: CNY 2.932 billion, up 75% YoY, accounting for 73% of total revenue [2][4] - **New Technology**: Developed proprietary information equipment with global IP protection, comparable to low-temperature SPM cleaning devices [2][5] - **SPM Process Breakthrough**: Expected to expand market share significantly [2][4] Market and Customer Developments - **Electroplating Equipment**: Revenue decreased by 13% YoY to CNY 709 million, but Q3 shipments increased by 88% [2][6] - **Customer Base Expansion**: Expected increase in electroplating furnace customers from 9 to 17 by year-end [6] - **Global Market Expansion**: Successful collaborations in the US and Europe, with major clients moving to production validation stages [2][7] Capacity and Infrastructure - **New Manufacturing Center**: Launched in October, featuring advanced logistics and production capabilities [2][8] - **R&D Investment**: CNY 612 million in R&D, representing 15.39% of revenue, with a focus on innovative product development [13] Future Outlook - **Revenue Guidance for 2024**: Adjusted to CNY 5.6 billion to 5.88 billion based on detailed assessments of order execution and delivery plans [2][10] - **Sales Growth Projection**: Anticipated double-digit growth in 2025, driven by increased market share and new product introductions [21][24] Innovations and Product Development - **New Product Launches**: Introduction of advanced packaging products and unique cleaning technologies [5][31] - **PECVD Technology**: Differentiated design expected to enhance efficiency and market competitiveness [30] Strategic Initiatives - **International Market Focus**: Aiming for over 50% of revenue from overseas markets, with significant progress in Korea and other regions [23] - **Funding and Growth Plans**: Ongoing secondary offering to support expansion and R&D efforts [25][26] Conclusion - **Long-term Growth Strategy**: Emphasis on platform development and innovative solutions to maintain competitive advantage in the semiconductor equipment market [24][33]

Key Points Summary of the Conference Call Company Overview - The conference call is regarding Shengmei Shanghai's Q3 2024 performance and future outlook, featuring key executives including the Chairman and General Manager [1][2]. Financial Performance - Q3 2024 revenue reached 1.573 billion RMB, a year-on-year increase of 37.96% [1]. - The company reported a gross profit of 709 million RMB with a gross margin of 45.09% [2]. - Net profit for Q3 was 315 million RMB, up 35.09% year-on-year, with a net margin of 20.03% [2]. - For the first nine months of 2024, revenue was 3.977 billion RMB, a 44.62% increase from 2.750 billion RMB in the same period last year [11]. - The company expects full-year revenue to be between 5.6 billion and 5.88 billion RMB, reflecting a positive adjustment based on order execution and delivery plans [10]. Product and Business Development - The cleaning equipment segment saw a revenue increase of 75.87% to 2.932 billion RMB, accounting for 73.73% of total revenue [2]. - The company has made significant technological advancements in high-temperature SPM cleaning technology, positioning itself as a potential second global provider of such equipment [3]. - The newly developed Tahoe cleaning equipment has achieved performance breakthroughs, meeting stringent requirements for high-end manufacturing [4]. - The company is focusing on environmental sustainability, with its Ultra-C Power equipment aimed at reducing environmental impact while increasing AI chip production [4]. Market Position and Competitive Landscape - Shengmei Shanghai is recognized as one of the few suppliers of semiconductor cleaning equipment with international standards, enhancing its market share in China [5]. - The company has expanded its product line to include advanced packaging and other backend equipment, with a 27.51% revenue increase in this segment [6]. - The company is actively pursuing international markets, with a goal of achieving a balanced revenue split between domestic and international sales [10]. Customer and Order Insights - There has been a notable increase in demand from logic, power, and storage sectors, with expectations of significant growth in customer numbers for certain products by the end of the year [8][9]. - The company has received orders for wafer-level packaging equipment from U.S. clients, with deliveries expected in the first half of 2025 [7]. - The company is optimistic about its order growth, with a reported 50% increase in confirmed sales compared to previous periods [18]. Research and Development - R&D investment for the first nine months of 2024 was 612 million RMB, representing 15.39% of revenue, with a 42.14% year-on-year increase [14]. - The company is committed to continuous innovation and product development, with a focus on meeting diverse market needs [11]. Future Outlook - The company anticipates continued double-digit growth in 2025, driven by expanding market share and new product introductions [22]. - The management expressed confidence in achieving significant market penetration with its proprietary technologies and products [27]. Additional Notes - The company is in the process of a secondary offering, with expectations for completion in the third quarter of the following year [29]. - The management emphasized the importance of differentiating their products from competitors to capture market share effectively [34][38].

Investment Rating - The investment rating for the company is "Buy" and is maintained [1] Core Views - The company reported significant growth in revenue and net profit for Q3 2024, achieving revenue of 1.573 billion yuan, a year-on-year increase of 37.97%, driven by strong demand in the semiconductor equipment sector [2] - The company has successfully expanded its customer base and entered new markets, contributing to overall revenue growth [2] - The company has adjusted its revenue forecast for 2024 to a range of 5.6 billion to 5.88 billion yuan, reflecting a more detailed assessment of its business situation as year-end approaches [2][4] - The company is focusing on six major business areas: cleaning, electroplating, advanced packaging wet processes, vertical furnace tubes, coating and developing, and PECVD, which supports a doubling of its serviceable available market [3] Summary by Sections Company Overview - The latest closing price is 123.00 yuan, with a total market value of 53.6 billion yuan and a circulating market value of 9.3 billion yuan [1] Financial Performance - For Q3 2024, the company achieved a net profit of 315 million yuan, a year-on-year increase of 35.09%, with a sales gross margin of 45.09% [2] - The company expects to see a higher growth rate in shipment volume than revenue growth in 2024 due to delivery delays from the previous year [2] Future Projections - Revenue projections for 2024, 2025, and 2026 are estimated at 58.7 billion, 85 billion, and 123 billion yuan respectively, with corresponding net profits of 1.3 billion, 2 billion, and 3 billion yuan [5] - The company’s current price-to-earnings ratios for 2024, 2025, and 2026 are 42x, 27x, and 18x respectively [5] Capital Raising Plans - The company plans to raise up to 4.5 billion yuan to enhance its R&D and testing capabilities, with specific allocations for various projects aimed at strengthening its product development and market expansion [4]

Investment Rating - The investment rating for the company is maintained at "Accumulate" [1][4][7] Core Views - The company has raised its revenue forecast for the full year 2024 to a range of 56.00 to 58.80 billion yuan, up from a previous estimate of 53.00 to 58.80 billion yuan, indicating strong performance in Q4 2024 [1][4] - The expected revenue for Q4 2024 is projected to be between 16.23 and 19.03 billion yuan, representing a year-on-year growth of 42.40% to 66.96% and a quarter-on-quarter growth of 3.22% to 21.02% [1][4] - The company is benefiting from strong demand in the semiconductor equipment sector, with significant progress in new customer acquisition and market development [1][4] Revenue and Profit Forecast - Revenue projections for 2024 to 2026 are updated to 56.77 billion yuan, 70.39 billion yuan, and 84.47 billion yuan respectively, with growth rates of 46.0%, 24.0%, and 20.0% [4][5] - Net profit forecasts for the same period are 11.42 billion yuan, 15.20 billion yuan, and 18.90 billion yuan, with growth rates of 25.4%, 33.1%, and 24.3% [4][5] Financial Data - The company reported a revenue of 15.73 billion yuan in Q3 2024, a year-on-year increase of 37.96% and a quarter-on-quarter increase of 6.09% [1][5] - The gross profit margin for Q3 2024 was 45.09%, a decrease of 10.27 percentage points year-on-year [1][5] - The company’s total assets are projected to reach 11,649 million yuan by 2024, with total liabilities of 4,321 million yuan [6][5] Market Position and Strategy - The company is positioned as a leader in cleaning and plating equipment, with a strategy focused on technological differentiation and product platformization [1][4] - The company has successfully established a comprehensive product portfolio covering approximately 200 billion USD market [1][4] - The new production facility in Lingang is expected to generate over 10 billion yuan in output value [1][4]

浴道证券股份有限公司 HAITONG SECURITIES CO., LTD. 海通证券股份有限公司 关于盛美半导体设备(上海)股份有限公司 2024 年度向特定对象发行 A 股股票 之 上市保荐书 保荐机构(主承销商) (上海市广东路 689 号 ) 二〇二四年十一月 声 明 海通证券股份有限公司（以下简称"海通证券"或"保荐机构"）及其保荐 代表人已根据《中华人民共和国公司法》（以下简称《公司法》）、《中华人民 共和国证券法》（以下简称《证券法》）、《上市公司证券发行注册管理办法》 （以下简称《注册管理办法》）等法律法规和中国证券监督管理委员会（以下简 称"中国证监会"）及上海证券交易所的有关规定，诚实守信，勤勉尽责，严格 按照依法制定的业务规则和行业自律规范出具上市保荐书，并保证所出具文件真 实、准确、完整。 如无特殊说明，本上市保荐书中的简称或名词释义与《盛美半导体设备（上 海）股份有限公司 2024 年度向特定对象发行 A 股股票募集说明书》一致。 3-2-1 目 录 | 一、发行人基本情况. | | --- | | 二、发行人本次发行情况……………………………………………………………………………… ...

海通证券股份有限公司 关于盛美半导体设备(上海)股份有限公司 2024 年度向特定对象发行 A 股股票 之 发行保荐书 保荐机构(主承销商) 油道征券股份有限公司 HAITONG SECURITIES CO., LTD. (上海市广东路 689 号) 二〇二四年十一月 声 明 本保荐机构及保荐代表人已根据《中华人民共和国公司法》（以下简称《公 司法》）、《中华人民共和国证券法》（以下简称《证券法》）、《上市公司证 券发行注册管理办法》（以下简称《注册管理办法》）、《上海证券交易所科创 板股票上市规则》（以下简称《上市规则》）等有关法律、法规，诚实守信，勤 勉尽责，严格按照依法制定的业务规则和行业自律规范出具证券发行保荐书，并 保证所出具文件真实、准确、完整。 如无特殊说明，本发行保荐书中的简称或名词释义与《盛美半导体设备（上 海）股份有限公司 2024 年度向特定对象发行 A 股股票募集说明书》一致。 3-1-1 目 录 | 第一节 本次证券发行基本情况 … | | --- | | 一、本次证券发行保荐机构名称 | | 二、保荐机构指定保荐代表人及保荐业务执业情况…………………………………………………………… ...

股票简称：盛美上海 股票代码：688082 盛美半导体设备（上海）股份有限公司 ACM Research（Shanghai）, Inc. （中国（上海）自由贸易试验区丹桂路 999 弄 5、6、7、8 号全幢） 2 0 2 4 年度向特定对象发行 A 股股票 募集说明书 （申报稿） 保荐人（主承销商） （上海市广东路 689 号） 二〇二四年十一月 盛美半导体设备（上海）股份有限公司 募集说明书 声 明 本公司及全体董事、监事、高级管理人员承诺募集说明书及其他信息披露资 料不存在任何虚假记载、误导性陈述或重大遗漏，并对其真实性、准确性及完整 性承担相应的法律责任。 公司负责人、主管会计工作负责人及会计机构负责人保证募集说明书中财务 会计资料真实、完整。 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对申请 文件及所披露信息的真实性、准确性、完整性作出保证，也不表明其对发行人的 盈利能力、投资价值或者对投资者的收益作出实质性判断或保证。任何与之相反 的声明均属虚假不实陈述。根据《证券法》的规定，证券依法发行后，发行人经 营与收益的变化，由发行人自行负责。投资者自主判断发行人的投资价值，自主 作出投 ...

特此公告。 盛美半导体设备（上海）股份有限公司 董事会 2024年11月12日 盛美半导体设备（上海）股份有限公司（以下简称"公司"）于2024年11 月11日收到上海证券交易所出具的《关于受理盛美半导体设备（上海）股份有限 公司科创板上市公司发行证券申请的通知》（上证科审（再融资）[2024]123号）。 上海证券交易所依据相关规定对公司报送的科创板上市公司发行证券的募集说 明书及相关申请文件进行了核对，认为申请文件齐备，符合法定形式，决定予以 受理并依法进行审核。 公司本次向特定对象发行A股股票事项尚需通过上海证券交易所审核，并获 得中国证券监督管理委员会（以下简称"中国证监会"）作出同意注册的决定后 方可实施。上述事项最终能否通过上海证券交易所审核，并获得中国证监会同意 注册的决定及其时间尚存在不确定性。 公司将根据该事项的进展情况及时履行信息披露义务，敬请广大投资者注意 投资风险。 证券代码：688082 证券简称：盛美上海 公告编号：2024-076 盛美半导体设备（上海）股份有限公司 关于向特定对象发行 A 股股票申请获得上海证券交易 所受理的公告 本公司董事会及全体董事保证本公告内容不存在任何虚 ...

盛美半导体设备（上海）股份有限公司 审计报告及财务报表 二○二三年度 信会师报字[2024]第 ZI10020 号 6-1-1 盛美半导体设备（上海）股份有限公司 审计报告及财务报表 （2023 年 1 月 1 日至 2023 年 12 月 31 日止） | | 目录 | 页次 | | --- | --- | --- | | 一、 | 审计报告 | 1-5 | | 二、 | 财务报表 | | | | 合并资产负债表和母公司资产负债表 | 1-4 | | | 合并利润表和母公司利润表 | 5-6 | | | 合并现金流量表和母公司现金流量表 | 7-8 | | | 合并所有者权益变动表和母公司所有者权益变动表 | 9-12 | | 三、 | 财务报表附注 事务所执业资质证明 | 1-96 | 6-1-2 审 计 报 告 信会师报字[2024]第 ZI10020 号 盛美半导体设备（上海）股份有限公司全体股东： 一、 审计意见 我们审计了盛美半导体设备（上海）股份有限公司（以下简称盛 美上海）财务报表，包括 2023 年 12 月 31 日的合并及母公司资产负 债表，2023 年度的合并及母公司利润表、合并及母公 ...