证券日报网讯 2月9日，聚辰股份在互动平台回答投资者提问时表示，认证进展请关注公司未来披露的 公告。 （文章来源：证券日报） ...

证券日报网讯 2月9日，聚辰股份在互动平台回答投资者提问时表示，公司会在定期报告中披露股东人 数信息。 （文章来源：证券日报） ...

格隆汇2月9日｜有投资者在互动平台向聚辰股份提问：DDR5 SPD价值量较DDR4提升多少？AI服务器 单机内存模组用量相比传统服务器增长多少？聚辰在DDR5 SPD的市场占有率大概多少？ 聚辰股份回复称，当前主流的AI服务器单机内存模组用量超过20根，是传统通用服务器的2倍左右，公 司是全球前二大DDR5 SPD供应商。 ...

格隆汇2月9日丨聚辰股份(688123.SH)在投资者互动平台表示，当前主流的AI服务器单机内存模组用量 超过20根，是传统通用服务器的2倍左右，公司是全球前二大DDR5 SPD供应商。 ...

The see a see a see a least to the of the states of 行业专题报告 / 2026.02.08 ■ 证券研究报告 因 投资评级:看好(维持) 最近 12 月市场表现 27% 12% 035410 分析师 唐佳 SAC 证书编号: S0160525110002 tangjia@ctsec.com 联系人 周勃宇 zhouby@ctsec.com 相关报告 1. 《模型密集发布,国产算力需求有望加 速》 2026-02-02 2. 《AI 需求持续引领，先进晶圆代工有望 2026-02-02 大放异彩 》 3.《CPU 专题报告一:配套内存模组向 MRDIMM 发展,看好 MRCD 芯片与 MDB 芯片环节》 2026-02-01 核心观点 | 表 1. 重点公司投资评级 | | | | | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 代码 | 公司 | 总市值（亿 | 收盘价 | | EPS (元) | | | PE | | 投资评级 | | | ...

【长江TMT&医药】最新观点汇总0208 1、PCB：板块自去年四季度以来表现偏弱，主要因正交背板方案市场观点分化，部分认为可能会被铜缆/CPO替代 或推迟至28年，而我们了解到目前正交背板当前仍在正常稳步推进中，预计在27年H2步入批量生产阶段，龙头公 司因正交背板分歧导致股价滞涨，性价比凸显，推荐东山精密、胜宏科技、沪电股份。 CoWoP方案（芯片直接封装在PCB上）确定性更强，可降本 【长江TMT&医药】最新观点汇总0208 电子 电子 1、PCB：板块自去年四季度以来表现偏弱，主要因正交背板方案市场观点分化，部分认为可能会被铜缆/CPO替代 或推迟至28年，而我们了解到目前正交背板当前仍在正常稳步推进中，预计在27年H2步入批量生产阶段，龙头公 司因正交背板分歧导致股价滞涨，性价比凸显，推荐东山精密、胜宏科技、沪电股份。 CoWoP方案（芯片直接封装在PCB上）确定性更强，可降本、提效并绕过紧缺的载板产能，PCB单平米价值量或 提升数倍至十倍，有望提前至27年底出产品，28年落地，该方向下推荐关注鹏鼎控股、深南电路、兴森科技。 2、存储：合约价仍处上行周期（现货价波动无碍），模组公司Q1业绩将爆发（江 ...

Core Insights - The report highlights the contradiction faced during the "14th Five-Year Plan" period, where carbon reduction pressures are increasing while the growth rate of new energy installations is slowing down. The introduction of a national capacity price policy is expected to open up space for new energy installations and support high-yield investment options for power companies during the "14th Five-Year Plan" investment intensity [5][6][9]. Group 1: Energy Storage Industry - The national capacity price policy, issued on January 30, 2026, aims to establish a mechanism that balances power supply stability, green energy transformation, and efficient resource allocation. This policy is expected to support the development of adjustable power sources and enhance the installation of new energy [7][9]. - The report estimates that the demand for energy storage will show a high growth trend, with new energy storage installations expected to reach 66.43 GW and 189.48 GWh in 2025, representing year-on-year increases of 52% and 73% respectively [8][9]. - The capacity price policy is seen as the final piece needed for energy storage development, potentially increasing project returns from approximately 6.5% to over 8% under current subsidy conditions. This is expected to stimulate investment interest from state-owned enterprises in new energy storage projects [8][9]. Group 2: Investment Recommendations - The report suggests prioritizing investments in leading companies involved in energy storage integration and upstream battery cells, recommending firms such as Sungrow Power Supply, Trina Solar, LONGi Green Energy, JinkoSolar, CATL, and Eve Energy. It also advises monitoring companies like Haisum, Sungrow Electric, Canadian Solar, and Penghui Energy [9].

Investment Rating - The industry investment rating is maintained as "Positive" [4] Core Insights - The demand for AI computing power is driving a persistent shortage in storage [2][8] - Major storage companies are experiencing strong performance, with AI demand expected to continue creating incremental opportunities [6] - The supply of niche storage is under pressure from mainstream storage, leading to a sustained tight supply situation [7] Summary by Sections Investment Recommendations and Targets - Key investment targets include domestic storage chip design companies such as Zhaoyi Innovation, Puran, Jucheng, Dongxin, Beijing Junzheng, and Hengsuo [2][8] - Domestic storage module manufacturers like Jiangbolong, Demingli, and Baiwei Storage are also highlighted [2] - Companies benefiting from storage technology iterations include Lanke Technology, Lianyun Technology, and Aojie Technology [2] - Semiconductor equipment firms such as Zhongwei Company, Jingzhida, and Beifang Huachuang are recommended [2] - Domestic packaging and testing companies like Shentek, Huicheng, and Tongfu Microelectronics are included in the investment targets [2] Market Dynamics - TrendForce has revised upward the price growth rates for DRAM and NAND Flash products for the first quarter, with DRAM contract prices expected to rise by 90-95% and NAND Flash by 55-60% [7] - AI computing demand is becoming the dominant factor in storage demand, with significant price increases anticipated for Server DRAM and Enterprise SSDs [7] - The AI inference process is expected to significantly alter data center storage structures, leading to increased demand for active data storage [7] Niche Storage Supply - Niche storage products like NOR Flash and MLC/SLC NAND Flash are expected to remain in tight supply due to reduced production from major suppliers focusing on mainstream products [7] - The global capacity for MLC NAND Flash is projected to decrease by 41.7% in 2026 due to supply constraints [7]

Core Insights - The global High Bandwidth Memory (HBM) market is experiencing rapid growth, with shipments expected to increase from 1.5 billion gigabytes (GB) in 2023 to 5.7 billion GB by 2026, and revenues projected to rise from $4.35 billion in 2023 to $50 billion in 2026 [6][7][8]. HBM Industry Definition and Advantages - HBM is a high-performance semiconductor memory based on 3D stacking technology, offering high bandwidth and energy efficiency, primarily used in high-performance computing and networking applications [1][4]. - HBM has four main advantages over traditional DRAM: high bandwidth, high capacity, low power consumption, and small size [2][3]. HBM Industry Development Status - HBM technology is becoming a standard for AI acceleration cards (GPUs, TPUs, etc.), with its value share continuing to increase [4][6]. - The demand for HBM is driven by the needs of AI and high-performance computing, with significant growth expected in the coming years [6][10]. HBM Industry Chain - The HBM industry chain includes upstream materials (electrolytes, precursors, IC substrates) and semiconductor equipment (lithography machines, etching machines), with midstream focusing on HBM production and downstream applications in AI, data centers, and high-performance computing [8][9]. HBM Industry Competitive Landscape - The global HBM market is dominated by foreign manufacturers, with SK Hynix holding a 53% market share, followed by Samsung at 38% and Micron at 9% [14][15]. - Domestic companies in China, such as Changxin Memory, Changdian Technology, and others, are making significant progress in the HBM supply chain, aiming to increase local production capabilities [15][16]. HBM Industry Development Trends - HBM is positioned as a critical hardware component for AI and high-performance computing, with its unique 3D stacked structure providing superior bandwidth compared to traditional memory solutions [16][17]. - The future memory landscape will be heterogeneous, with HBM focusing on training scenarios, while other memory types will cater to specific workloads, creating a diverse memory ecosystem for the AI era [17].

截至9月30日，聚辰股份股东户数1.76万，较上期增加48.55%；人均流通股8981股，较上期减少 32.62%。2025年1月-9月，聚辰股份实现营业收入9.33亿元，同比增长21.29%；归母净利润3.20亿元，同 比增长51.33%。 分红方面，聚辰股份A股上市后累计派现2.99亿元。近三年，累计派现1.86亿元。 2月2日，聚辰股份跌13.93%，成交额22.07亿元。两融数据显示，当日聚辰股份获融资买入额3.24亿 元，融资偿还2.52亿元，融资净买入7130.56万元。截至2月2日，聚辰股份融资融券余额合计13.22亿 元。 融资方面，聚辰股份当日融资买入3.24亿元。当前融资余额13.17亿元，占流通市值的5.19%，融资余额 超过近一年90%分位水平，处于高位。 融券方面，聚辰股份2月2日融券偿还3400.00股，融券卖出2400.00股，按当日收盘价计算，卖出金额 38.47万元；融券余量2.96万股，融券余额474.04万元，超过近一年90%分位水平，处于高位。 资料显示，聚辰半导体股份有限公司位于上海市浦东新区张东路1761号10幢,香港湾仔皇后大道东183号 合和中心46楼，成立日期 ...