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芯联集成:公司8寸SiC MOSFET产线已经实现量产,产能已达到2000片/月
Zheng Quan Ri Bao· 2025-11-13 02:27
Core Viewpoint - The company has achieved mass production of its 8-inch SiC MOSFET production line, with a current capacity of 2,000 wafers per month, indicating a positive growth trajectory in demand for SiC products as customer validation continues [1] Group 1 - The 8-inch SiC MOSFET production line has reached a capacity of 2,000 wafers per month [1] - The company plans to expand production capacity in response to increasing market demand as more customers are onboarded and validated [1]
芯联集成:公司三季度营收19.27亿元,同比增长15.52%
Core Viewpoint - The company reported a third-quarter revenue of 1.927 billion yuan, representing a year-on-year growth of 15.52% [1] - The company anticipates a full-year revenue of 8 billion to 8.3 billion yuan, which indicates a growth of 23% to 28% compared to the previous year [1] Group 1 - The company's revenue growth is driven by industry development, increasing demand, and ongoing domestic substitution [1] - The company is deepening cooperation and accelerating customer acquisition to maintain revenue expansion [1]
芯联集成:公司应用于高端消费、新能源汽车的第三代麦克风进入大批量量产
Core Viewpoint - The company has commenced mass production of its third-generation microphones used in high-end consumer electronics and new energy vehicles, while the fourth-generation dual-diaphragm microphone is currently in the design iteration phase [1] Group 1 - The company's high-performance microphones hold over 50% market share in a leading international smartphone terminal market [1]
芯联集成:公司模拟IC芯片聚焦于持续开发高压、大功率、高密度的BCD工艺
Core Viewpoint - Company focuses on the continuous development of high-voltage, high-power, and high-density BCD process for analog IC chips, with accelerated customer adoption of high-voltage and integrated solution process platforms, currently covering over 70% of domestic design companies [1] Group 1 - Company is engaged in the development of analog IC chips [1] - Company emphasizes high-voltage, high-power, and high-density BCD process technology [1] - Customer adoption of high-voltage and integrated solution process platforms is accelerating [1] Group 2 - Company has achieved coverage of over 70% of domestic design companies [1]
芯联集成:公司布局了AI服务器电源的系统代工方案,产品可覆盖50%以上AI服务器电源价值
Core Viewpoint - The company is actively expanding its presence in the AI server power supply market and has developed a comprehensive chip system OEM solution that covers over 50% of the AI server power supply value [1] Group 1: AI Server Power Supply - The company has laid out a system OEM solution for AI server power supplies, which includes first-level, second-level, and third-level power supplies [1] - The product offerings encompass power devices, driver ICs, magnetic components, MCUs, and current sensors [1] - The company is focusing on the 800V high-voltage direct current (HVDC) market to enhance the efficiency of end-to-end power supply systems for data centers [1] Group 2: Robotics Applications - The company has developed a miniaturized drive module for robotic dexterous hands, which has been adopted by leading domestic enterprises [1] - This solution aims to provide a one-stop chip system OEM solution for clients seeking lightweight and compact designs [1]
芯联集成:目前公司MEMS传感器、激光雷达等芯片已占据国内主要市场份额
Core Viewpoint - The company, ChipLink Integrated, has established an efficient digital automotive-grade smart factory, providing one-stop system OEM services for various clients [1] Group 1: Company Overview - ChipLink Integrated's production lines are all automotive-grade, ensuring high standards for manufacturing [1] - The company has a significant market share in domestic MEMS sensors and LiDAR chips [1]
芯联资本完成首支主基金12.5亿元募集
FOFWEEKLY· 2025-11-12 10:04
Group 1 - The core viewpoint of the article highlights the successful fundraising of 1.25 billion yuan for the first main fund of ChipLink Capital, with an expected total scale exceeding 1.5 billion yuan, focusing on hard technology sectors such as semiconductors, artificial intelligence, robotics, and new energy [2] - The fund was raised in less than a year, featuring a highly market-oriented LP structure that includes a mix of industry, capital, and policy backgrounds, with notable investors such as ChipLink Integrated, Shanghai Lingang New Area Fund, and various leading market-oriented mother funds and financial institutions [2] - The founder of ChipLink Capital, Yuan Feng, emphasized that the successful fundraising reflects investors' confidence in the long-term development of China's hard technology and strategic emerging industries, indicating a commitment to supporting companies through different development stages [2] Group 2 - ChipLink Capital operates as a corporate venture capital (CVC) institution, leveraging deep industry resources from its parent company, ChipLink Integrated, to drive investment strategies that combine capital and industry, aiming to expand the industrial chain and build an ecosystem for hard technology companies [3] - The institution has invested in several well-known companies within the semiconductor and new energy sectors, including ShuoKe ZhongKe Xin, ChipLink Power, and Junyuan Electronics, and has also begun investments in emerging application fields such as robotics and AI [3]
芯联集成-U:8寸SiC MOSFET产线已实现量产,目前产能达2000片/月
Di Yi Cai Jing· 2025-11-12 08:43
Core Viewpoint - The company has achieved mass production of its 8-inch SiC MOSFET production line, with a current capacity of 2,000 pieces per month, indicating a strong position in the SiC market as demand is expected to grow with customer adoption and validation [1] Group 1 - The 8-inch SiC MOSFET production line has reached a capacity of 2,000 pieces per month [1] - The company plans to expand production capacity in response to market demand as customer validation progresses [1] - Continuous growth in demand for 8-inch SiC is anticipated as more customers are onboarded [1]
芯联集成(688469.SH):布局了AI服务器电源的系统代工方案,产品可覆盖50%以上AI服务器电源价值
Ge Long Hui· 2025-11-12 08:32
Core Viewpoint - Company is focusing on AI server power applications and has developed a comprehensive system OEM solution that covers over 50% of the AI server power value [1] Group 1: AI Server Power Applications - Company has laid out a system OEM solution for AI server power, which includes a one-stop chip system solution from primary power, secondary power, to tertiary power [1] - The solution encompasses power devices, driver ICs, magnetic components, MCUs, and current sensors [1] - Company is actively expanding into the 800V high-voltage direct current (HVDC) market to enhance the efficiency of end-to-end power supply systems for data centers [1] Group 2: Robotics Applications - Company has independently developed a miniaturized drive module for robotic dexterous hands, which has been designated by leading domestic enterprises [1] - This solution aims to provide a one-stop chip system OEM solution for clients seeking lightweight and compact designs [1]
芯联集成(688469.SH):高性能麦克风在某国际TOP手机终端市场份额超50%
Ge Long Hui· 2025-11-12 08:32
Group 1 - The company has commenced mass production of its third-generation microphones used in high-end consumer products and new energy vehicles [1] - The design iteration for the fourth-generation dual-diaphragm microphone is currently underway [1] - The company's high-performance microphones hold over 50% market share in a leading international smartphone terminal market [1]