Group 1 - The core point of the article highlights that on February 17, ChipLink Integration executed 4 large transactions on the trading platform, totaling a volume of 5.2 million shares and a transaction amount of 23.643 million yuan [1] - The transactions were conducted at a discount relative to the closing price, indicating a trend of discounted trading for the day [1] - Over the past three months, the stock has seen a total of 62 large transactions, with a cumulative transaction amount of 466 million yuan [1]

证券代码：688469 证券简称：芯联集成 公告编号：2025-003 芯联集成电路制造股份有限公司 公司在收到《审核问询函》后，立即会同相关中介机构进行了认真研究和落 实。鉴于《审核问询函》涉及的部分事项还需进一步落实，预计无法在规定时间 内向上海证券交易所提交完整的书面回复及相关文件。为切实稳妥做好《审核问 询函》的回复工作，经与相关中介机构审慎协商，公司已向上海证券交易所书面 提交延期回复的申请，申请自回复期届满之日起延期不超过 1 个月提交《审核问 询函》的书面回复等相关文件，并及时履行信息披露义务。 本次交易尚需经上海证券交易所审核通过以及中国证券监督管理委员会同 意注册后方可实施。公司将根据上述事项的进展情况，严格按照有关法律法规的 1 规定和要求及时履行信息披露义务，提请广大投资者注意投资风险。 特此公告。 芯联集成电路制造股份有限公司董事会 2025 年 2 月 15 日 关于延期回复《关于芯联集成电路制造股份有限公司 发行股份及支付现金购买资产暨关联交易申请的审核问询 函》的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完 ...

证券代码： 688469 证券简称：芯联集成 公告编号：2025-002 芯联集成电路制造股份有限公司 关于第一期股票期权激励计划第二个行权期 第三次行权结果暨股份变动的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误 导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承 担法律责任。 重要内容提示： 本次行权股票数量：2,758,137 股，占行权前公司总股本的比例为 0.04%。 本次行权股票上市流通时间：本次行权股票自行权日起满三年可上市流通， 预计上市流通时间为 2028 年 1 月 23 日（如遇非交易日则顺延）。 一、本次股票期权行权的决策程序及相关信息披露 芯联集成电路制造股份有限公司（以下简称"公司"）于 2021 年 9 月制定 并实施《绍兴中芯集成电路制造股份有限公司第一期股票期权激励计划》，合计 向 568 名激励对象授予 6800 万份股票期权，行权价格为 2.78 元/股。 1、2021 年 9 月 13 日，公司召开第一届董事会第三次会议并形成董事会决 议，审议通过了《关于公司第一期股票期权激励计划的议案》等与本次激励计划 相关的议案。同日，公司召开第一届 ...

Revenue Expectations - The company expects to achieve an annual revenue of approximately 6.509 billion yuan in 2024, an increase of about 1.185 billion yuan, representing a year-on-year growth of approximately 22.26%[4] - The company's main revenue is expected to be around 6.276 billion yuan, with a year-on-year increase of approximately 27.79%[4] - Revenue from the automotive sector is expected to grow by approximately 41.0%, while revenue from the consumer sector is expected to grow by approximately 66.0%[9] - The company’s 12-inch silicon-based wafer products achieved revenue of approximately 791 million yuan, a year-on-year increase of approximately 1457%[10] - The silicon carbide (SiC) business is expected to generate revenue of approximately 1.016 billion yuan in 2024, benefiting from the trends of electrification and intelligence in the automotive industry[10] Profitability and Financial Performance - The estimated net profit attributable to the parent company is approximately -969 million yuan, a reduction in loss of about 989 million yuan, reflecting a year-on-year improvement of approximately 50.51%[4] - The estimated EBITDA for 2024 is approximately 2.119 billion yuan, an increase of about 1.194 billion yuan, showing a year-on-year growth of approximately 129.08%[4] - The company achieved a gross profit margin of approximately 1.1% for the year, an increase of about 7.9 percentage points, marking the first time the annual gross profit margin turned positive[11] - The EBITDA margin is expected to be approximately 32.6%, reflecting a year-on-year increase of about 15 percentage points[11] Market Trends and Future Outlook - The company anticipates that the demand for new energy vehicles will continue to expand in 2025, supported by policies promoting vehicle replacement and the integration needs brought by automotive intelligence and electrification[12]

Group 1 - The company expects to achieve an operating revenue of approximately 6.509 billion yuan in 2024, an increase of about 1.185 billion yuan compared to the previous year, representing a year-on-year growth of approximately 22.26% [1] - The company anticipates a net profit attributable to the parent company of approximately -969 million yuan for 2024, which indicates a reduction in losses of about 989 million yuan compared to the previous year, reflecting a year-on-year decrease in losses of approximately 50.51% [1] - The company's silicon carbide business has already generated revenue of approximately 1.016 billion yuan in 2024 [1]

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 芯联集成电路制造股份有限公司（以下简称"公司"）拟发行股份及支付现 金购买绍兴滨海新区芯兴股权投资基金合伙企业（有限合伙）、深圳市远致一号 私募股权投资基金合伙企业（有限合伙）等 15 名交易对方合计持有的芯联越州 集成电路制造（绍兴）有限公司 72.33%股权（以下简称"本次交易"）。 证券代码：688469 证券简称：芯联集成 公告编号：2024-090 芯联集成电路制造股份有限公司 关于发行股份及支付现金购买资产暨关联交易 申请文件获得上海证券交易所受理的公告 公司于 2024 年 12 月 30 日收到上海证券交易所（以下简称"上交所"）出具 的《关于受理芯联集成电路制造股份有限公司发行股份购买资产申请的通知》（上 证科审（并购重组）〔2024〕10 号）。上交所依据相关规定对申请文件进行了核 对，认为申请文件齐备，符合法定形式，决定予以受理并依法进行审核。 特此公告。 芯联集成电路制造股份有限公司董事会 2024 年 12 月 31 日 本次交易尚需经上交所审核通过、中 ...

证券代码：688469 证券简称：芯联集成 上市地：上海证券交易所 芯联集成电路制造股份有限公司 发行股份及支付现金购买资产 暨关联交易报告书（草案） （申报稿） | 名 称 | | | --- | --- | | 绍兴滨海新区芯兴股权投资基金合伙企业（有限合伙）、深圳 | | | 市远致一号私募股权投资基金合伙企业（有限合伙）、厦门辰 | | | 途华辉创业投资合伙企业（有限合伙）、厦门辰途华明创业投 | | | 资基金合伙企业（有限合伙）、厦门辰途华景创业投资基金合 | | | 伙企业（有限合伙）、珠海横琴强科二号股权投资合伙企业 | | | （有限合伙）、张家港毅博企业管理中心（有限合伙）、尚融 | | | 创新（宁波）股权投资中心（有限合伙）、井冈山复朴新世纪 | | | 股权投资合伙企业（有限合伙）、华民科文（青岛）创业投资 | | | 基金合伙企业（有限合伙）、无锡芯朋微电子股份有限公司、 | | | 广东导远科技有限公司、广东辰途十六号创业投资合伙企业 | | | （有限合伙）、广州辰途十五号创业投资基金合伙企业（有限 | | | 合伙）、锐石创芯（深圳）科技股份有限公司 | | | 目 | 项 ...

Summary of Conference Call on Automotive Chip Industry Company and Industry Overview - The conference call focused on the automotive chip industry, specifically discussing the domestic integration and localization of chips in the automotive sector, hosted by Guolian Automotive with Chairman Yuan from Xinnian Integrated as a key speaker [1][2]. Key Points and Arguments 1. **Current State of Chip Localization**: The current localization rate of automotive chips in China is estimated to be between 10% to 15%, with power semiconductors showing the highest localization rates [8]. 2. **Impact of Global Chip Shortage**: The global chip shortage, exacerbated by the pandemic, significantly affected automotive production and sales, highlighting the need for increased domestic chip production [3][4]. 3. **Trends in Automotive Electronics**: The automotive electronics industry is evolving towards more integrated systems, moving from distributed to centralized architectures, which require advanced chips for various functionalities [6][7]. 4. **Emerging Technologies**: There is a shift towards solid-state batteries and advanced electric motor control systems, with increasing demands for performance and efficiency from automotive manufacturers [5]. 5. **AI and Autonomous Driving**: The integration of AI in vehicles is becoming more prevalent, with costs for sensors and computing power decreasing, allowing for better autonomous driving options in lower-priced vehicles [7][8]. 6. **Strategic Partnerships**: Xinnian Integrated has established partnerships with approximately 90% of domestic automotive manufacturers, positioning itself as a key player in the localization of automotive chips [8][10]. 7. **Market Growth Projections**: The company anticipates significant growth in market share, projecting an increase from 10% to over 30% in power module market share over the next few years [15][18]. 8. **Revenue Expectations**: Xinnian Integrated aims to achieve a revenue target of 10.1 billion yuan by 2026, with substantial contributions expected from power modules and integrated solutions [34]. Additional Important Insights 1. **Challenges in Chip Development**: The automotive industry has high reliability and durability requirements, making the development and validation of new chips a lengthy process [9][24]. 2. **Competitive Landscape**: The competitive landscape is shifting, with both domestic and international players vying for market share in the rapidly growing EV sector [22][43]. 3. **Future of Carbon Silicon Technology**: The company is focusing on carbon silicon technology, which is expected to play a crucial role in the future of electric vehicles, with plans to increase production capacity significantly [32][34]. 4. **International Collaboration**: There is a growing trend of international companies seeking partnerships with Chinese firms to tap into the rapidly expanding EV market [11][35]. This summary encapsulates the key discussions and insights from the conference call, highlighting the current state and future prospects of the automotive chip industry in China.

芯联越州集成电路制造 (绍兴)有限公司 审计 报告 大信审字[2024]第 32-00074 号 大信会计师事务所(特殊普通合伙) WUYIGE CERTIFIED PUBLIC ACCOUNTANTS LLP. 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://acc.mof.gov.cn）" 报告编码:只 WUYIGE Certified Public Accountants.LLP x 知春路 1 号 Room 2206 22/F,Xueyuan International Tower 院国际大厦 22 层 2206 No.1 Zhichun Road,Haidian Dist. Beijing,China,100083 申话 Telephone: +86 (10) 82330558 网址 Internet . www.daxincna.com.cn 审计报告 大信审字[2024]第 32-00074 号 芯联越州集成电路制造(绍兴)有限公司: 一、审计意见 我们审计了芯联越州集成电路制造(绍兴)有限公司(以下简称"贵公司")财务报表,包 括 2024 年 10 月 31 日、20 ...

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 芯联集成电路制造股份有限公司（以下简称"公司"）拟发行股份及支付现 金购买绍兴滨海新区芯兴股权投资基金合伙企业（有限合伙）、深圳市远致一号 私募股权投资基金合伙企业（有限合伙）等 15 名交易对方合计持有的芯联越州 集成电路制造（绍兴）有限公司 72.33%股权（以下简称"本次交易"）。 证券代码：688469 证券简称：芯联集成 公告编号：2024-087 芯联集成电路制造股份有限公司 关于发行股份及支付现金购买资产暨关联交易 报告书（草案）修订说明的公告 2024 年 12 月 28 日，公司召开第二届董事会第二次会议，审议通过了《关 于批准公司本次交易相关的加期审计报告及备考审阅报告的议案》《关于<芯联集 成电路制造股份有限公司发行股份及支付现金购买资产暨关联交易报告书（草案） （修订稿）>及其摘要的议案》，具体内容详见公司刊登在上海证券交易所网站 （http://www.sse.com.cn）的相关文件。 公司根据上市公司、标的公司截至 2024 年 10 月 31 日的 ...