海通证券股份有限公司关于 根据中国证券监督管理委员会于 2024 年 1 月 17 日出具的《关于同意灿芯 半导体（上海）股份有限公司首次公开发行股票注册的批复》（证监许可[2024]106 号），同意公司首次公开发行股票的注册申请。公司首次向社会公众公开发行人 民币普通股（A 股）股票 3,000 万股，并于 2024 年 4 月 11 日在上海证券交易所 科创板上市，发行完成后总股本为 12,000 万股，其中有限售条件流通股 96,034,501 股，无限售条件流通股 23,965,499 股。具体详见公司 2024 年 4 月 10 日在上海证券交易所网站（www.sse.com.cn）上披露的《灿芯股份首次公开发行 股票科创板上市公告书》。 1 本次上市流通的限售股为公司首次公开发行部分限售股及部分战略配售限 售股，限售股股东数量为 20 名，限售期为自公司首次公开发行股票并上市之日 起 12 个月，该部分限售股股东对应的股份数量为 45,965,010 股，占公司股本总 数的 38.30%。其中，首发限售股份数量为 42,965,010 股，占公司股本总数的比 例为 35.80%，股东数量为 19 ...

证券代码：688691 证券简称：灿芯股份 公告编号：2025-002 灿芯半导体（上海）股份有限公司 注： 1、本报告期初数同法定披露的上年年末数。 2、以上财务数据及指标以合并报表数据填列，但未经审计，最终结果 以公司 2024 年年度报告为准。 2024 年度业绩快报公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 本公告所载灿芯半导体（上海）股份有限公司（以下简称"公司"） 2024 年度主要财务数据为初步核算数据，未经会计师事务所审计，具体 数据以公司 2024 年年度报告为准，提请投资者注意投资风险。 | | | | 单位：万元 | | --- | --- | --- | --- | | 项目 | 本报告期 | 上年同期 | 增减变动幅度 | | | | | （%） | | 营业总收入 | 108,966.12 | 134,149.26 | -18.77 | | 营业利润 | 6,450.40 | 18,001.78 | -64.17 | | 利润总额 | 6,449.91 | 18,268.20 | -6 ...

Financial Performance - The company expects a net profit attributable to shareholders of the parent company for 2024 to be between 57 million and 65 million yuan, representing a decrease of 10.54715 million to 11.34715 million yuan, or a decline of 61.87% to 66.56% compared to the previous year[4]. - The net profit attributable to shareholders after deducting non-recurring gains and losses is projected to be between 41 million and 47 million yuan, down by 9.90457 million to 10.50457 million yuan, or a decrease of 67.82% to 71.93% year-on-year[4]. - The total profit for the previous year was 182.682 million yuan, with a net profit of 170.4715 million yuan attributable to shareholders of the parent company[6]. - The performance forecast is based on preliminary calculations and has not yet been audited by a registered accountant, highlighting the need for caution among investors[13]. Research and Development - The company has increased its investment in research and development, with both the size of the R&D team and R&D expenses growing compared to the previous year[10]. - The company has made significant progress in developing high-speed interface IP and system-level chip platforms, with various IPs being optimized and tested on new process platforms[10]. - The company has established a hardware design and software development process system for automotive-grade integrated circuits, having passed the ISO 26262 functional safety management system verification[11]. - The company plans to conduct tape-out verification for its automotive-grade dual-core lock-step MCU platform based on 40nm EFlash in 2025, targeting multiple application scenarios[11]. - The company completed 190 chip design projects this year, an increase of over 30% compared to the previous year, which is expected to positively impact revenue in 2025[9]. Investor Relations - The company aims to enhance communication with investors and improve its market value management practices to protect the interests of shareholders, especially small and medium investors[12].