Core Viewpoint - Since 2025, the demand for semiconductor equipment in China has remained strong, leading to steady revenue growth for the company due to its technological advantages, product maturity, and market recognition [1] Company Summary - As of September 29, 2025, the company's total order backlog amounts to 9.072 billion yuan, representing a year-on-year increase of 34.10% compared to the voluntarily disclosed order data from the previous year [1]

盛美半导体设备（上海）股份有限公司 （中国（上海）自由贸易试验区丹桂路 999 弄 5、6、7、8 号全幢） 2024 年度向特定对象发行 A 股股票 上市公告书 股票代码：688082 股票简称：盛美上海 中国（上海）自由贸易试验区商城路 618 号 保荐人（主承销商） 联席主承销商 广东省深圳市福田区中心三路 8 号卓越时代广场（二期）北座 深圳市前海深港合作区南山街道桂湾五路 128 号前海深港基金小镇 B7 栋 401 二〇二五年九月 特别提示 一、发行数量及价格 3、募集资金总额：人民币 4,481,999,961.86 元 4、募集资金净额：人民币 4,435,015,697.05 元 二、本次发行股票预计上市时间 本次发行新增股份将于限售期届满后的次一交易日起在上海证券交易所上 市流通交易，如遇法定节假日或休息日，则顺延至其后的第一个交易日。 三、新增股份的限售安排 本次发行对象共有 17 名，均以现金方式参与认购，全部发行对象认购的股 票自发行结束之日起六个月内不得转让。法律法规、规范性文件对限售期另有 规定的，依其规定。发行对象基于本次交易所取得的公司向特定对象发行的股 票，因公司分配股票股 ...

关于盛美半导体设备（上海）股份有限公司 2024 年度向特定对象发行 A 股股票 之 上市保荐书 国泰海通证券股份有限公司 保荐人（主承销商） | 一、发行人基本情况 3 | | --- | | 二、发行人本次发行情况 15 | | 三、本次证券发行上市的项目保荐代表人、协办人及项目组其他成员情况 17 | | 四、保荐机构是否存在可能影响公正履行保荐职责情形的说明 18 | | 五、保荐机构承诺事项 18 | | 六、本次证券发行上市履行的决策程序 20 | | 七、保荐机构关于符合国家产业政策和板块定位的核查情况 22 | | 八、本次向特定对象发行股票符合规定 23 | | 九、保荐机构对发行人持续督导工作的安排 27 | | 十、保荐机构和保荐代表人联系方式 28 | | 十一、保荐机构认为应当说明的其他事项 28 | | 十二、保荐机构对本次股票上市的推荐结论 28 | 一、发行人基本情况 国泰海通证券股份有限公司（以下简称"国泰海通"或"保荐机构"或"保 荐人"）及其保荐代表人已根据《中华人民共和国公司法》（以下简称《公司法》）、 《中华人民共和国证券法》（以下简称《证券法》）、《上市公司证券发行 ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-068 盛美半导体设备（上海）股份有限公司 关于 2024 年度向特定对象发行 A 股股票 发行结果暨股本变动公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 预计上市时间：盛美半导体设备（上海）股份有限公司（以下简称"公 司"、"盛美上海"或"发行人"）本次发行新增股份38,601,326股已于2025年9 月26日在中国证券登记结算有限责任公司上海分公司办理完毕股份登记手续。本 次发行新增股份为有限售条件流通股，将于限售期届满后的次一交易日起在上海 证券交易所上市流通交易，如遇法定节假日或休息日，则顺延至其后的第一个交 易日。 本次发行完成后，发行对象认购的股份自发行结束之日起六个月内不得转让。 法律法规、规范性文件对限售期另有规定的，依其规定。发行对象基于本次交易 所取得的公司向特定对象发行的股票，因公司分配股票股利、资本公积转增股本 等情形所衍生取得的股份亦应遵守上述股份锁定安排。发行对象因本次交易取得 的公司股份在限售期届满后减持 ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-069 盛美半导体设备（上海）股份有限公司 关于在手订单情况的自愿性披露公告 3、以上在手订单数据源自公司内部统计，未经审计，不能以此直接推算公 司全年营业收入、净利润等财务数据，仅供投资者及时了解公司日常经营概况。 具体准确的财务数据以公司正式披露的定期报告为准，敬请广大投资者注意投资 风险。 特此公告。 盛美半导体设备（上海）股份有限公司（以下简称"公司"）从事对集成电 路制造与先进晶圆级封装制造行业至关重要的单晶圆及槽式湿法清洗设备、电镀 设备、无应力抛光设备、立式炉管设备、前道涂胶显影设备和等离子体增强化学 气相沉积设备等的研发、制造和销售。2025年以来，中国半导体行业设备需求持 续旺盛，公司凭借技术优势、产品成熟度和市场认可度，不断深耕现有市场、拓 展新市场，收入稳步增长。为让投资者更好地了解公司经营情况，现将截至2025 年9月29日的在手合同订单情况公告如下： 一、截至2025年9月29日在手订单情况 截至2025年9月29日，公司在手订单总金额为907,153.57万元，与上年同期 已自愿性披露的在手订单数据相比，在手订单总金额 ...

Core Viewpoint - Shengmei Shanghai (688082.SH) reported a total order backlog of 9.072 billion yuan as of September 29, 2025, representing a year-on-year increase of 34.10% [1] Group 1 - The total order backlog includes equipment orders that have been delivered to customers but not yet recognized as revenue, as well as equipment orders that will be delivered in the future [1]

Core Insights - The company announced that as of September 29, 2025, its total backlog of orders amounts to 9.072 billion yuan, representing a 34.10% increase compared to the same period last year [1] Summary by Categories Order Backlog - The total backlog includes equipment orders that have been delivered to customers but have not yet received customer confirmation of revenue, as well as equipment orders that will be delivered in the future [1] - The backlog data is sourced from the company's internal statistics and is unaudited, intended to provide investors with timely insights into the company's operational status [1] Financial Impact - The backlog is subject to specific execution and implementation progress, which introduces uncertainty regarding its impact on the company's current and future financial performance [1] - Accurate financial data will be disclosed in the company's formal periodic reports [1]

Core Viewpoint - The largest scale of competitive private placement in the semiconductor equipment industry in the past three years has been completed, with several public funds participating in the allocation [2][12]. Group 1: Fundraising Details - Semiconductor equipment leader, Shengmei Semiconductor Equipment (Shanghai) Co., Ltd., has completed a private placement fundraising of nearly 4.5 billion yuan [2][3]. - The total number of shares issued in this private placement is 38.6013 million shares, with an issue price of 116.11 yuan per share, raising a total of 4.482 billion yuan [3][8]. - The funds raised will enhance the company's R&D capabilities in the semiconductor equipment field [2][8]. Group 2: Participating Institutions - Five public funds participated in the private placement, including E Fund, Xingsheng Global, and others, with E Fund acquiring 144 million yuan worth of shares [3][7]. - Shanghai Pudong New Industry Investment Co., Ltd. received the largest allocation of 1.5 billion yuan, followed by Caitong Fund with 544 million yuan [3][4]. Group 3: Company Performance - Shengmei Shanghai reported a revenue of 3.265 billion yuan in the first half of the year, a year-on-year increase of over 35%, with a net profit of nearly 700 million yuan, up approximately 57% [13]. - The company has seen continuous growth in revenue and net profit from 2018 to 2024, with revenue increasing from 550 million yuan to 5.618 billion yuan, and net profit from 93 million yuan to 1.153 billion yuan, with average annual growth rates exceeding 30% [13]. Group 4: Market Context - The semiconductor market is expected to shrink by 8% in 2023 but is projected to grow by 12% to 687.3 billion dollars by 2025 [12]. - The private placement market has seen a surge in interest in technology innovation sectors, with semiconductor industry private placements reaching 19.4 billion yuan in the first seven months of the year, a fivefold increase compared to the previous year [18][19].

Core Viewpoint - The semiconductor equipment industry has seen its largest scale private placement in three years, with multiple public funds participating in the allocation, indicating strong institutional interest in the sector [2][3][10]. Group 1: Fundraising Details - Semiconductor equipment leader, Shengmei Semiconductor Equipment (Shanghai) Co., Ltd., completed a private placement raising approximately 4.482 billion yuan, with a share price of 116.11 yuan per share [5][10]. - A total of 17 institutions participated in the bidding, with all bids being valid and timely, leading to the allocation of 38.6 million shares [5][6]. - The largest allocation was to Shanghai Pudong New Industry Investment Co., Ltd., receiving 1.5 billion yuan, followed by Caitong Fund and Nord Fund with allocations of 544 million yuan and 533 million yuan, respectively [5][6]. Group 2: Use of Proceeds - The raised funds will enhance the company's R&D capabilities in semiconductor equipment, focusing on the construction of R&D and process testing platforms, high-end semiconductor equipment iteration projects, and supplementing working capital [3][11][14]. - Specific projects include the establishment of an integrated circuit equipment R&D and testing platform and further iterative development of existing equipment designs to ensure global competitive differentiation [12][13]. Group 3: Market Context and Performance - The semiconductor market experienced an 8% contraction in 2023, but is projected to grow by 12% to reach 687.3 billion USD by 2025 [15]. - Shengmei Shanghai reported a revenue of 3.265 billion yuan in the first half of the year, a year-on-year increase of over 35%, with net profit nearing 700 million yuan, reflecting strong domestic demand and effective order management [16]. - The company's revenue and net profit have consistently increased over the past several years, with revenue growing from 550 million yuan in 2018 to 5.618 billion yuan in 2024, representing an average annual growth rate exceeding 30% [16]. Group 4: Institutional Participation Trends - Major public funds, including E Fund, have been actively participating in private placements, particularly in high-growth sectors such as AI, robotics, innovative pharmaceuticals, and semiconductors, indicating a trend towards investing in "hard technology" [20][21]. - The private placement market has seen significant activity, with 28 fund companies participating in 218 projects this year, amounting to 5.864 billion yuan, which is five times the total from the previous year [20][21].

Group 1 - Changchuan Technology's stock rose over 7%, reaching a new historical high [1] - Other companies such as Yingji Chip, Shengmei Shanghai, Jingyi Equipment, Zhengfan Technology, and Zhongwei Company also experienced stock increases [1]