证券代码：688630 证券简称：芯碁微装 公告编号：2024-043 合肥芯碁微电子装备股份有限公司 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依 法承担法律责任。 合肥芯碁微电子装备股份有限公司（以下简称"公司"）于 2024 年 8 月 21 日召开的第二届董事会第十七次会议、第二届监事会第十 五次会议，审议通过了《关于会计政策变更的议案》。根据相关法律 法规的规定，公司本次会计政策变更无需提交股东大会审议。现将有 关事项公告如下： 一、 本次会计政策变更概述 （一）变更原因 1、执行《企业会计准则解释第 17 号》的相关规定 2023 年 10 月 25 日，财政部发布了《企业会计准则解释第 17 号》 （财会【2023】21 号）（以下简称"解释 17 号")，自 2024 年 1 月 1 日起施行。本公司于 2024 年 1 月 1 日起执行解释 17 号的规定。执 行解释 17 号的相关规定对本公司报告期内财务报表无重大影响。 A、关于流动负债和非流动负债的划分 本公司自 2024 年 1 月 1 日起执行该规定，执行该规 ...

证券代码：688630 证券简称：芯碁微装 公告编号：2024-044 合肥芯碁微电子装备股份有限公司 第二届董事会第十七次会议决议的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依 法承担法律责任。 一、董事会会议召开情况 合肥芯碁微电子装备股份有限公司（以下简称"公司"）第二届 董事会第十七次会议于 2024 年 8 月 9 日以电子邮件方式向全体董事 发出通知，2024 年 8 月 21 日在公司会议室以现场结合通讯的方式召 开。会议应出席董事 9 名，实际出席董事 9 名，会议由董事长程卓召 集并主持。本次会议召开符合《公司法》等法律法规及《公司章程》 的有关规定。 1 过。 具体内容详见公司同日在上海证券交易所网站（www.sse.com.cn） 披露的《2024 年半年度报告》及其摘要。 （二）审议通过《关于公司 2024 年半年度募集资金存放与使用 情况的专项报告的议案》 根据中国证监会发布的《上市公司监管指引第 2 号——上市公司 募集资金管理和使用的监管要求》和上海证券交易所发布的《上海证 券交易所科创板上市公司自律 ...

证券代码：688630 证券简称：芯碁微装 公告编号：2024-045 合肥芯碁微电子装备股份有限公司 第二届监事会第十五次会议决议的公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依 法承担法律责任。 具体内容详见公司同日在上海证券交易所网站（www.sse.com.cn） 1 披露的《2024 年半年度报告》及其摘要。 （二）审议通过《关于公司 2024 年半年度募集资金存放与实际 使用情况的专项报告的议案》 公司 2024 年半年度募集资金存放与实际使用情况的专项报告符 合法律法规、《上海证券交易所科创板股票上市规则》《合肥芯碁微 电子装备股份有限公司募集资金管理制度》等相关规定，该报告真实、 客观的反映了公司 2024 年半年度募集资金的存放和实际使用情况。 报告期内，公司募集资金实际投入项目与承诺投入项目一致，不存在 违规使用募集资金的行为，亦不存在改变或者变相改变募集资金投向 等损害股东利益的情形。 一、监事会会议召开情况 合肥芯碁微电子装备股份有限公司（以下简称"公司"）第二届 监事会第十五次会议于 2024 年 8 月 ...

证券代码：688630 证券简称：芯碁微装 公告编号：2024-042 合肥芯碁微电子装备股份有限公司 关于调整 2022 年限制性股票激励计划授予价格的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏。并对其内容的真实性、准确性和完整性依 法承担法律责任。 合肥芯碁微电子装备股份有限公司（以下简称"公司"）于 2024 年 8 月 21 日召开的第二届董事会第十七次会议和第二届监事会第十 五次会议，审议通过了《关于调整 2022 年限制性股票激励计划授予 价格的议案》，同意根据公司《2022 年限制性股票激励计划（草案）》 的有关规定，对 2022 年限制性股票激励计划首次授予及预留部分限 制性股票的授予价格进行调整。具体调整情况如下： 一、本次股权激励计划已履行的相关决策程序和信息披露情况 1、2022 年 4 月 7 日，公司召开的第一届董事会第十六次会议审 议通过了《关于公司<2022 年限制性股票激励计划（草案）>及其摘 要的议案》、《关于公司<2022 年限制性股票激励计划实施考核管理办 法>的议案》以及《关于提请股东大会授权董事会办理股权激励计划 相关事项的 ...

Financial Performance - The company reported a significant increase in revenue for the first half of 2024, achieving a total of 1.2 billion CNY, representing a 25% year-over-year growth[1]. - The company reported a revenue of 1.5 billion RMB for the first half of 2024, representing a 20% increase compared to the same period last year[9]. - The company achieved operating revenue of CNY 449.43 million in the first half of 2024, representing a year-on-year increase of 41.04%[17]. - Net profit attributable to shareholders reached CNY 100.69 million, up 38.56% compared to the same period last year[17]. - The company reported a total revenue of 88,300 million RMB for the first half of 2024, with a net profit of 30,440.63 million RMB[71]. - The company reported a total operating revenue for the first half of 2024 reached ¥449,434,289.81, a significant increase from ¥318,659,921.78 in the same period of 2023, representing an increase of approximately 41.0%[146]. - The net profit for the first half of 2024 was ¥100,694,227.54, compared to ¥72,674,167.70 in the first half of 2023, reflecting a growth of about 38.5%[148]. User Growth - User data indicates a growing customer base, with an increase of 15% in active users compared to the previous year, reaching 500,000 users[1]. - User data showed a growth of 15% in active users, reaching 2 million by the end of the reporting period[10]. - User data showed an increase in active users, reaching 150 million, which is a 10% increase compared to the previous year[116]. Future Outlook - The company has set a future outlook with a revenue target of 2.5 billion CNY for the full year 2024, which would represent a 20% increase from 2023[1]. - The company expects a revenue growth of 25% for the second half of 2024, driven by new product launches and market expansion strategies[9]. - The company provided a positive outlook for the next quarter, projecting a revenue growth of 20% for Q3 2024[117]. Product Development - New product development includes the launch of a next-generation semiconductor equipment line, expected to contribute an additional 300 million CNY in revenue by Q4 2024[1]. - The introduction of a new line of high-performance PCBs is expected to contribute an additional 200 million RMB in revenue by Q4 2024[9]. - The company is focusing on upgrading PCB equipment and expanding high-end solder mask equipment production to enhance its product matrix in the semiconductor sector[50]. - The company launched the new drilling series product MCD 75T in May 2024, which features real-time position calibration and energy monitoring, improving accuracy in micro-hole and line positioning[50]. Market Expansion - The company is expanding its market presence in Southeast Asia, with plans to establish a new manufacturing facility in Thailand by mid-2025[1]. - The company plans to expand its market presence in Southeast Asia, targeting a 10% market share by the end of 2025[9]. - The company is actively expanding its overseas presence, having established a subsidiary in Thailand and planning to enhance its sales and operational teams abroad[30]. - The company is actively expanding its market presence in Southeast Asia, particularly in Thailand and Vietnam, to enhance its global competitiveness in the micro-nano direct writing lithography field[51]. Research and Development - The company has allocated 150 million CNY for R&D in advanced technologies, focusing on AI integration in semiconductor manufacturing processes[1]. - Investment in R&D for new technologies increased by 30%, focusing on advanced packaging and laser direct imaging techniques[10]. - R&D investment totaled ¥48,934,569.54, a 25.95% increase from ¥38,851,978.27 in the same period last year, accounting for 10.89% of operating revenue[67]. - The R&D team consists of 214 members, accounting for 34.80% of the total workforce, highlighting the company's commitment to innovation[78]. Financial Management - There are no plans for profit distribution or capital increase during this reporting period, focusing instead on reinvestment into growth initiatives[1]. - The company has no significant risks impacting operations during the reporting period, ensuring stable performance moving forward[1]. - The company reported a net cash flow from operating activities improved to CNY -47.43 million, a 56.47% increase year-on-year, primarily due to higher sales collections[19]. - The company has committed to optimizing its governance structure and enhancing internal controls to ensure shareholder rights are fully exercised[108]. Sustainability and Environmental Responsibility - The management highlighted a commitment to sustainability, aiming to reduce carbon emissions by 30% by 2026 through improved operational efficiencies[1]. - The company is not classified as a key pollutant discharging unit and adheres to environmental protection laws and sustainable development principles[99]. - The company has implemented measures to reduce carbon emissions, including promoting green low-carbon office practices and utilizing rooftop solar power[101]. - The company’s production processes generate minimal solid waste and wastewater, which are managed through appropriate treatment methods[100]. Strategic Acquisitions - A strategic acquisition of a local competitor is in progress, which is anticipated to enhance market share by 10% in the next fiscal year[1]. - A strategic acquisition of a semiconductor firm is anticipated to enhance production capabilities and reduce costs by 15%[10]. - The company is considering strategic acquisitions to enhance its product portfolio, with a target of completing at least two acquisitions within the next year[115]. Shareholder Engagement - The company is committed to shareholder returns and has established a mechanism to align management and shareholder interests, promoting long-term development[57]. - The company distributed a cash dividend of 0.80 CNY per share in 2023, totaling 104,753,411.20 CNY, which represents 58.42% of the net profit attributable to shareholders[57]. - The company has established a fundraising management system to ensure the proper use of raised funds, complying with relevant laws and regulations[108]. Risks and Challenges - The company faces risks from intensified market competition and potential fluctuations in demand within the PCB and semiconductor sectors[82]. - The company has no significant changes in lease liabilities, which stood at CNY 1,831,205.40, an increase of 22.65%[88]. - The company reported a significant decrease in accounts receivable financing by 56.42% to CNY 3,306,874.98, due to a reduction in receivable notes[88].

合肥芯碁微电子装备股份有限公司 关于召开 2024 年半年度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依 法承担法律责任。 重要内容提示： （网址：http://roadshow.sseinfo.com/） 投资者可于在 2024 年 8 月 26 日（星期一）16:00 前登录上证路 演中心网站首页点击"提问预征集"栏目或通过公司邮箱进行提问。 公司将在说明会上对投资者普遍关注的问题进行回答。 合肥芯碁微电子装备股份有限公司（以下简称"公司"）将于 2024 年 8 月 22 日披露公司《2024 年半年度报告》，为便于广大投资者更 全面、深入地了解公司 2024 年半年度经营成果、财务状况，公司计 划于 2024 年 8 月 27 日上午 11:00-12:00 举行 2024 年半年度业绩说 明会，就投资者关心的问题进行交流。 一、 说明会类型 本次业绩说明会以网络互动形式召开，公司将针对 2024 年半年 证券代码：688630 证券简称：芯碁微装 公告编号：2024-039 总经理：方林 董事会秘书、财务总监 ...

Investment Rating - The report maintains an "Accumulate" rating for the company [3]. Core Insights - The company is experiencing rapid growth in performance, particularly in PCB and semiconductor equipment sectors [3]. - For Q2 2024, the company is expected to achieve revenue between 237-253 million yuan, representing a year-on-year growth of 46.43%-56.28%, and a net profit of 59-63 million yuan, with a year-on-year increase of 50.95%-60.23% [3]. - The company is focusing on product upgrades and expanding its global presence, particularly in Southeast Asia, to enhance its competitiveness in the high-end PCB market [3]. - The company is diversifying its product matrix in the semiconductor sector, continuously innovating and launching new products to support future growth [3]. Financial Forecasts - The company’s revenue is projected to grow from 1,112 million yuan in 2024 to 2,097 million yuan in 2026, with corresponding net profits expected to rise from 257 million yuan to 465 million yuan during the same period [3]. - The report forecasts a PE ratio decline from 29.3 in 2024 to 16.2 in 2026, indicating an improving valuation as earnings grow [3]. - The company’s return on equity (ROE) is expected to increase from 11% in 2024 to 15% in 2026, reflecting enhanced profitability [3].

买入 原评级：买入 市场价格:人民币 57.30 板块评级:强于大市 相关研究报告 《芯碁微装》20240429 《芯碁微装》20240225 《芯碁微装》20231029 中银国际证券股份有限公司 具备证券投资咨询业务资格 机械设备：专用设备 证券分析师：苏凌瑶 lingyao.su@bocichina.com 证券投资咨询业务证书编号：S1300522080003 2024Q2 归母净利润环比增速超市场预期，PCB 业务受技术升级和海外拓展需求强劲 688630.SH | --- | --- | --- | |-------------------------------|------------|----------| | | | | | 发行股数 ( 百万 ) | | 131.42 | | 流通股 ( 百万 ) | | 131.42 | | 总市值 ( 人民币 百万 ) | | 7,530.31 | | 3 个月日均交易额 ( 人民币 | 百万 ) | 103.23 | | 主要股东 | | | | 程卓 | | 27.99 | | 资料来源：公司公告， Wind | ，中银证券 | | jiakai ...

司 研 事件： 公司在产品高端化和全球化上走在行业前列。产品高端化符合当 前算力 PCB 需求旺盛的市场结构，公司的中高阶 PCB 产品市场份额不 断提升，同时进一步拓展产品品类。我们看好公司受益于 PCB 厂商建 设高多层 PCB 产能带来的资本开支大幅增加。全球化上，公司加大了 在东南亚地区的市场布局，PCB 产能转移将带来大量的设备需求，同 时公司有望在新的供应格局中占据更大份额。我们持续看好公司 PCB 设备需求将进入景气周期。 我们维持此前盈利预测，预计公司 2024-2026 年营收收入为 11.5/15.6/19.9 亿元，归母净利润为 2.67/3.86/5.24 亿元，P/E 倍数分别 为 28/20/14×。我们认为，公司技术上处领先地位，同时底层技术具 备强大的平台延伸特点，维持"买入"评级。 证 券 研 究 买入（维持评级） 团队成员 分析师： 陈海进(S0210524060003) chj30590@hfzq.com.cn 华福证券 投资要点： PCB 设备受益于大算力时代，产品升级&出口双轮驱动 在泛半导体领域，公司以技术驱动创新和产品落地，站在行业前 沿引领 LDI 技术应用领域 ...

Financial Performance - The company expects to achieve operating revenue of between 434.97 million and 450.90 million CNY for the first half of 2024, representing a year-on-year growth of 36.50% to 41.50%[2] - The projected net profit attributable to the parent company for the first half of 2024 is estimated to be between 98.88 million and 102.51 million CNY, an increase of 36.06% to 41.06% compared to the same period last year[2] - The net profit excluding non-recurring gains and losses is expected to be between 95.50 million and 98.88 million CNY, reflecting a year-on-year increase of 41.35% to 46.35%[11] Business Expansion and Innovation - In the PCB sector, the company has established a subsidiary in Thailand and is enhancing its overseas sales and operations teams to strengthen service capabilities for international clients[5] - The company is expanding its product matrix in the semiconductor field, focusing on advanced packaging equipment and maintaining steady growth in substrate equipment[5] - The company is committed to continuous innovation and development of new products, including bonding, alignment, and laser drilling equipment, to support future growth in the semiconductor business[5] - The company has seen an increase in market share for high-end PCB products, driven by product upgrades and export growth in response to the demand for high-performance computing[14]