Group 1 - The core point of the article is that the controlling shareholder and actual controller of Xingsen Technology, Mr. Qiu Xingya, has recently completed the procedure for the release of part of his pledged shares, totaling 3.95 million shares [1] Group 2 - The number of shares released from pledge is 3.95 million [1]

1、本次股份解除质押基本情况 证券代码：002436 证券简称：兴森科技 公告编号：2026-02-003 深圳市兴森快捷电路科技股份有限公司 关于控股股东部分股份解除质押的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 深圳市兴森快捷电路科技股份有限公司（以下简称"公司"）于近日接到控股股东、实际控 制人邱醒亚先生的通知，获悉其将所持有的部分公司股份办理了解除质押手续。具体事项如下： 一、股东股份解除质押基本情况 二、备查文件 1、国泰海通证券股份有限公司股票质押式回购交易协议书。 特此公告。 深圳市兴森快捷电路科技股份有限公司 董事会 二〇二六年二月三日 | | 是否为控股股 东或第一大股 | 本次解除质押 | 占其所持 | 占公司 | 质押开始 | 解除质押 | 质权人 | | --- | --- | --- | --- | --- | --- | --- | --- | | 股东名称 | 东及其一致行 | 股份数量（股） | 股份比例 | 总股本 比例 | 日期 | 日期 | | | | 动人 | | | | | | | | 邱醒亚 | 是 | ...

Group 1 - The circuit board index experienced a strong rally, with constituent stocks showing a broad upward trend [1] - Shiyun Circuit led the gains, followed by Mingyang Circuit, Pengding Holdings, Guanghe Technology, and Xingsen Technology, which all had significant increases [1]

Group 1 - The core point of the article is that Xingsen Technology has reported its total number of shareholders as exceeding 124,000 as of January 30, 2026 [2]

证券之星消息，2月2日元件板块较上一交易日下跌1.29%，兴森科技领跌。当日上证指数报收于 4015.75，下跌2.48%。深证成指报收于13824.35，下跌2.69%。元件板块个股涨跌见下表： | 代码 | 名称 | 主力净流入(元) | 主力净占比 游资净流入 (元) | | 游资净占比 散户净流入 (元) | | 散户净占比 | | --- | --- | --- | --- | --- | --- | --- | --- | | 300476 胜宏科技 | | 6.76 Z | 6.38% | -4.18 Z | -3.94% | -2.58 Z | -2.44% | | 002384 | 东山精密 | 1.69 Z | 4.19% | -8335.87万 | -2.06% | -8584.66万 | -2.12% | | 688183 | 生益电子 | 5613.28万 | 3.74% | -1.77万 | 0.00% | -5611.51万 | -3.74% | | 002138 顺络电子 | | 5190.61万 | 4.98% | -5943.56万 | -5.70% | 752.94万 | ...

Group 1 - The core viewpoint of the news is that Xingsen Technology's stock has experienced a decline of 5%, with a current price of 22.41 yuan per share and a total market capitalization of 38.09 billion yuan [1] - Xingsen Technology, established on March 18, 1999, and listed on June 18, 2010, primarily engages in PCB and semiconductor businesses, with revenue composition being 71.45% from PCB, 21.09% from IC packaging substrates, 4.29% from other sources, and 3.17% from semiconductor testing boards [1] Group 2 - According to data from the top ten holdings of funds, one fund under Renbao Asset holds a significant position in Xingsen Technology, with 28,600 shares representing 1.13% of the fund's net value, ranking as the ninth largest holding [2] - The Renbao Core Selected Mixed A Fund (022702) has a total scale of 5.49 million, with a year-to-date return of 5.74% and a cumulative return of 27.17% since inception [2] Group 3 - The fund manager of Renbao Core Selected Mixed A Fund is Liu Shikai, who has been in the position for 1 year and 137 days, overseeing assets totaling 2.114 billion yuan, with the best return during his tenure being 67.94% and the worst being -1.23% [3]

登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：002436 证券简称： 兴森科技 公告编号：2026-01-002 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假记载、误导性陈述或重大遗 漏。 一、本期业绩预计情况 1、业绩预告期间：2025年1月1日至2025年12月31日 2、预计的经营业绩：扭亏为盈 公司已就本次业绩预告情况与年报审计会计师事务所进行预沟通，公司与会计师事务所对本次业绩预告 不存在分歧。 本次业绩预告相关财务数据未经审计机构预审计。 三、业绩变动原因说明 报告期内，公司业绩较去年同期变动的主要原因如下： 1、 经营层面的影响 受益于行业复苏，公司营业收入保持稳定增长。利润层面主要受广州兴森半导体有限公司FCBGA封装 基板业务和宜兴硅谷电子科技有限公司高多层PCB业务的影响，其中，FCBGA封装基板业务仍未实现 大批量量产，依然对公司盈利形成拖累，全年费用投入约6.6亿元，但2025年样品订单数量同比实现大 幅增长；高多层PCB业务因产品结构不佳，全年亏损约1亿元，但各季度亏损持续收窄，第四季度已接 近盈亏平衡。 2、 其他影响 二、与会计师事务所沟通情 ...

受益于行业复苏，公司营业收入保持稳定增长。利润层面主要受广州兴森半导体有限公司FCBGA封装 基板业务和宜兴硅谷电子科技有限公司高多层PCB业务的影响，其中，FCBGA封装基板业务仍未实现 大批量量产，依然对公司盈利形成拖累，全年费用投入约6.6亿元，但2025年样品订单数量同比实现大 幅增长；高多层PCB业务因产品结构不佳，全年亏损约1亿元，但各季度亏损持续收窄，第四季度已接 近盈亏平衡。 格隆汇1月30日丨兴森科技(002436.SZ)公布，预计2025年归属于上市公司股东的净利润13,200万元– 14,000万元，同比扭亏为盈，归属于上市公司股东的扣除非经常性损益的净利润13,800万元–14,600万 元，同比扭亏为盈。 ...

Core Viewpoint - The company expects a net profit attributable to shareholders of 132 million to 140 million yuan for the year 2025, indicating a turnaround from losses in the previous year [1] Group 1: Financial Performance - The company anticipates a net profit excluding non-recurring gains and losses of 138 million to 146 million yuan for 2025 [1] - The net profit is expected to show a year-on-year improvement, moving from a loss to profitability [1] Group 2: Revenue and Business Impact - The company's revenue is projected to grow steadily due to industry recovery, with significant contributions from its subsidiaries [1] - The FCBGA packaging substrate business has not yet achieved mass production, impacting profitability, with an annual expense of approximately 660 million yuan [1] - The high-layer PCB business is expected to incur a loss of about 100 million yuan for the year, although quarterly losses are narrowing, nearing breakeven in Q4 [1] Group 3: Other Financial Influences - Interest expenses related to convertible bonds are estimated to impact profits by about 17 million yuan [1] - Fair value loss from the redemption rights of Guangzhou Xingsen Semiconductor Co., Ltd. is expected to be around 38 million yuan [1] - The company anticipates an increase in income tax expenses by approximately 36 million yuan due to the recognition of deferred tax assets following the high-tech enterprise certification of Zhuhai Xinke Semiconductor Co., Ltd. [1] - The company expects to recognize a fair value loss of about 13 million yuan from its investment in Shenzhen Ruijun Semiconductor Co., Ltd., which continues to operate at a loss [1]

证券代码：002436 证券简称： 兴森科技 公告编号：2026-01-002 深圳市兴森快捷电路科技股份有限公司 2025 年年度业绩预告 没有虚假记载、误导性陈述或重大遗漏。 本公司及董事会全体成员保证信息披露内容的真实、准确和完整， 一、本期业绩预计情况 1、业绩预告期间：2025年1月1日至2025年12月31日 2、预计的经营业绩：扭亏为盈 | 项目 | 本报告期 | 上年同期 | | --- | --- | --- | | 归属于上市公司股东的净利润 | 盈利：13,200万元–14,000万元 | 亏损：19,828.98万元 | | 归属于上市公司股东的扣除非 经常性损益的净利润 | 盈利：13,800万元–14,600万元 | 亏损：19,576.85万元 | | 基本每股收益 | 盈利：0.08元/股–0.08元/股 | 亏损：0.12元/股 | 二、与会计师事务所沟通情况 公司已就本次业绩预告情况与年报审计会计师事务所进行预沟通，公司与会 计师事务所对本次业绩预告不存在分歧。 本次业绩预告相关财务数据未经审计机构预审计。 三、业绩变动原因说明 受益于行业复苏，公司营业收入保持稳定增长。利 ...