Core Viewpoint - The company, Guangli Technology, has confirmed that its semiconductor packaging equipment is widely applicable across various semiconductor products, particularly highlighting its cutting equipment represented by model 8230, which has over 20 different models and has received high recognition from leading domestic clients [1] Group 1 - The company provides high-end cutting equipment and consumables for semiconductor packaging processes [1] - The customer base of the company is extensive, covering a wide range of clients in the semiconductor industry [1]

Group 1 - The company is actively seeking new application areas for its reverse planetary roller screw products [2]

证券日报网讯光力科技8月15日在互动平台回答投资者提问时表示，公司将持续认真听取投资者、市场 和客户的反馈与意见，不断加强品牌形象和宣传。 （文章来源：证券日报） ...

证券日报网讯光力科技8月15日在互动平台回答投资者提问时表示，公司集成整合英国核心零部件研发 平台研发和加工制造优势，成功开发的一体式反向式行星滚柱丝杠电动缸，具有高精度和大行程范围的 特点。 （文章来源：证券日报） ...

（文章来源：证券日报） 证券日报网讯光力科技8月15日在互动平台回答投资者提问时表示，公司集成整合英国核心零部件研发 平台研发和加工制造优势，成功开发的一体式反向式行星滚柱丝杠电动缸，具有高精度和大行程范围的 特点。公司正在积极寻求半导体设备以外的应用领域。 ...

每经AI快讯，有投资者在投资者互动平台提问：市场有传言公司半年报业绩很差，作为坚信公司的投 资者，真心希望公司能及时披露下半年报预告，好坏都是对投资者及时认真的反馈。特别是当下市场大 好，公司股价却不涨反跌，这对公司坚信的投资者来说，是个大的打击。 光力科技（300480.SZ）8月15日在投资者互动平台表示，相关信息请以公司公开披露的信息为准。公司 严格按照《深圳证券交易所创业板股票上市规则》等相关规定履行信息披露义务，并预约于2025年8月 27日披露公司2025年半年度报告，关于公司业绩情况敬请关注公司相关披露。 （文章来源：每日经济新闻） ...

Group 1 - The company has developed a one-piece reverse planetary roller screw and linear actuator technology and processing techniques, which can be customized according to customer needs and application scenarios [2] - Although there have been some initial sales, the products are specifically developed for certain industry demands, and the company is actively seeking new application areas [2]

天眼查商业履历信息显示，光力科技股份有限公司，成立于1994年，位于郑州市，是一家以从事仪器仪 表制造业为主的企业。企业注册资本35282.9602万人民币，实缴资本13323.1664万人民币。公司法定代 表人为赵彤宇。 通过天眼查大数据分析，光力科技股份有限公司共对外投资了8家企业，参与招投标项目1350次，知识 产权方面有商标信息11条，专利信息489条，此外企业还拥有行政许可26个。 金融界消息 截至2025年8月14日收盘，光力科技（300480）报收于15.92元，下跌4.27%，换手率 6.58%，成交量16.29万手，成交金额2.64亿元。 资金流向方面，今日主力资金净流出3782.63万元，占比成交额14.34%。其中，超大单净流出1843.48万 元、占成交额6.99%，大单净流出1939.15万元、占成交额7.35%，中单净流出流出389.58万元、占成交 额1.48%，小单净流入4172.22万元、占成交额15.82%。 光力科技最新一期业绩显示，截至2025一季报，公司营业总收入1.53亿元、同比增长4.99%，归属净利 润1784.84万元，同比增长19.12%，扣非净利润1674 ...

资金流向方面，今日主力资金净流出1325.36万元，占比成交额6.6%。其中，超大单净流出303.04万 元、占成交额1.51%，大单净流出1022.32万元、占成交额5.09%，中单净流出流入577.04万元、占成交 额2.87%，小单净流入748.32万元、占成交额3.73%。 来源：金融界 光力科技最新一期业绩显示，截至2025一季报，公司营业总收入1.53亿元、同比增长4.99%，归属净利 润1784.84万元，同比增长19.12%，扣非净利润1674.91万元，同比增长43.16%，流动比率6.762、速动比 率5.077、资产负债率32.40%。 天眼查商业履历信息显示，光力科技股份有限公司，成立于1994年，位于郑州市，是一家以从事仪器仪 表制造业为主的企业。企业注册资本35282.9602万人民币，实缴资本13323.1664万人民币。公司法定代 表人为赵彤宇。 金融界消息 截至2025年8月13日收盘，光力科技（300480）报收于16.63元，下跌1.71%，换手率 4.87%，成交量12.07万手，成交金额2.01亿元。 通过天眼查大数据分析，光力科技股份有限公司共对外投资了8家企业，参 ...

Group 1 - The semiconductor packaging equipment industry is experiencing robust growth in China, driven by strong demand in emerging applications such as smartphones, AI, IoT, and automotive electronics. The sales revenue for semiconductor packaging equipment in China is projected to reach 28.27 billion yuan in 2024, representing a year-on-year increase of 18.93% [1][18] - The industry is expected to continue evolving towards high-density, high-performance, and high-reliability equipment due to rapid advancements in technologies like 5G, IoT, and AI [1][18] - The global semiconductor equipment market is also witnessing significant growth, with sales expected to reach 117.1 billion USD in 2024, a 10.16% increase from 2023 [15][17] Group 2 - Key players in the semiconductor packaging equipment market include both international leaders such as ASM Pacific Technology, Kulicke & Soffa, and local Chinese companies like North Huachuang, Shengmei Semiconductor, and Xinyi Chang [21][23] - North Huachuang's revenue from electronic process equipment is projected to be 27.707 billion yuan in 2024, marking a 41.28% increase [23] - Shengmei Semiconductor's revenue is expected to reach 5.44 billion yuan in 2024, reflecting a 46.43% growth [25] Group 3 - The semiconductor packaging equipment industry is supported by various policies aimed at promoting domestic production and technological breakthroughs, including the implementation of national standards and talent cultivation initiatives [8][10] - The industry is characterized by a complex supply chain, with upstream components including sensors and subsystems, midstream manufacturing, and downstream applications serving OSATs, IDMs, and foundries [11][13] Group 4 - The industry is witnessing a shift towards high precision and intelligent equipment, with advancements in packaging technologies such as Chiplet and 3D IC driving innovation [27] - New application scenarios, particularly in electric vehicles and AI chips, are creating additional market opportunities for specialized packaging equipment [28] - The construction of digital factories is transforming traditional equipment operation and maintenance, enhancing efficiency through real-time data collection and predictive maintenance [29]